Temperature accelerated discharging processes through the bulk of PECVD silicon nitride films for MEMS capacitive switches
2017 ◽
Vol 76-77
◽
pp. 631-634
◽
2009 ◽
Vol 49
(9-11)
◽
pp. 1309-1314
◽
2014 ◽
Vol 54
(9-10)
◽
pp. 2159-2163
◽
2003 ◽
Vol 11
(2)
◽
pp. 125-130
◽
Keyword(s):