Copper polishing with a polishing pad incorporating abrasive grains and a chelating resin

2009 ◽  
Vol 33 (2) ◽  
pp. 167-174 ◽  
Author(s):  
Makoto Sato ◽  
Tetsuya Kameyama ◽  
Toru Nonami
Keyword(s):  
Chelating Resin ◽  
Abrasive Grains ◽  
Polishing Pad ◽  
Copper Polishing

Study of Slurry Composition Transition in a Rotary Copper CMP Process

2003 ◽  
Vol 767 ◽  
Author(s):  
Sharath Hegde ◽  
Udaya B. Patri ◽  
Anurag Jindal ◽  
S.V. Babu
Keyword(s):  
Chemical Mechanical Polishing ◽  
Step Flow ◽  
Polishing Pad ◽  
Particle Retention ◽  
Chemical Retention ◽  
Copper Polishing ◽  
Chemical Utilization ◽  
Polishing Pads ◽  
Slurry Composition ◽  
Flow Experiments

AbstractThe polishing pad is one of the prime components in a typical Chemical Mechanical Polishing (CMP) process. The structure and transport properties of a polishing pad are critical in determining the particle and chemical utilization in a conventional CMP process. Our earlier paper investigated the particle retention and transport on two different polishing pads, IC-1400 and Suba-500, during copper polishing. In this paper, the results of chemical retention and transport of IC-1400 and Suba-500 pads during copper polishing are presented. The polish rate results from slurry-step-flow experiments with H2O2-glycine based slurries, where the concentrations of chemicals in the slurry are altered in steps during polishing, are correlated to the chemical retention and transport characteristics of these pads. It is found that IC-1400 has a higher chemical transport capability than Suba-500 pad, which is shown to affect the polish rates of copper.

Study on Polishing Characteristics of Pyramidal Structured Polishing Pad

2019 ◽  
Vol 13 (2) ◽  
pp. 237-245
Author(s):  
Ryunosuke Sato ◽  
Yoshio Ichida ◽  
◽  
Keyword(s):  
Steady State ◽  
Wear Rate ◽  
Removal Rate ◽  
High Quality ◽  
Abrasive Grains ◽  
Polishing Pad ◽  
Finished Surface ◽  
Polishing Tool ◽  
Polishing Pressure

We conducted a polishing test to clarify the change in polishing characteristics resulting from the wear of a pyramidal-structured polishing tool, and discuss the polishing mechanism unique to the pyramidal-structured polishing pad. When the pyramidal-structured polishing pad is used for polishing, there exists an initial polishing stage in which the removal rate is high but the finished surface is rough; followed by a steady-state polishing stage in which the wear rate is low, removal rate is stable, and a high-quality finish is obtained. The true polishing pressure is constant in the steady-state polishing stage regardless of the nominal polishing pressure, although it differs with workpiece hardness. Polishing was carried out using the pyramidal-structured polishing pad containing 6 μm alumina abrasive grains for 90 min without any scorching or clogging. This resulted in finished surfaces of 0.4 μmRzand 0.07 μmRzfor oxygen-free copper and S45C, respectively.

Novel method for low level Sr-90 activity detection in seawater by combining oxalate precipitation and chelating resin extraction

2017 ◽  
Vol 51 (2) ◽  
pp. 193-197 ◽  
Author(s):  
Hirofumi Tazoe ◽  
Hajime Obata ◽  
Masatoshi Tomita ◽  
Shinya Namura ◽  
Jun Nishioka ◽  
...  
Keyword(s):  
Chelating Resin ◽  
Activity Detection ◽  
Low Level ◽  
Oxalate Precipitation ◽  
Novel Method

scholarly journals Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

2021 ◽  
Vol 11 (10) ◽  
pp. 4358
Author(s):  
Hanchul Cho ◽  
Taekyung Lee ◽  
Doyeon Kim ◽  
Hyoungjae Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Shape Error ◽  
Profile Shape ◽  
Conditioning Process ◽  
Polishing Pad ◽  
Simulation Based ◽  
Diamond Conditioner ◽  
Pad Conditioning ◽  
Good Agreement

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 μm even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.

scholarly journals Internal face finishing for a cooling channel using a fluid containing free abrasive grains

2021 ◽  
Author(s):  
Mitsugu Yamaguchi ◽  
Tatsuaki Furumoto ◽  
Shuuji Inagaki ◽  
Masao Tsuji ◽  
Yoshiki Ochiai ◽  
...  
Keyword(s):  
High Speed ◽  
Flow Behavior ◽  
Flow Simulation ◽  
Cooling Channel ◽  
H13 Steel ◽  
Channel Diameter ◽  
Abrasive Grains ◽  
Low Viscosity ◽  
Short Period ◽  
Internal Pressures

AbstractIn die-casting and injection molding, a conformal cooling channel is applied inside the dies and molds to reduce the cycle time. When the internal face of the channel is rough, both cooling performance and tool life are negatively affected. Many methods for finishing the internal face of such channels have been proposed. However, the effects of the channel diameter on the flow of a low-viscosity finishing media and its finishing characteristics for H13 steel have not yet been reported in the literature. This study addresses these deficiencies through the following: the fluid flow in a channel was computationally simulated; the flow behavior of abrasive grains was observed using a high-speed camera; and the internal face of the channel was finished using the flow of a fluid containing abrasive grains. The flow velocity of the fluid with the abrasive grains increases as the channel diameter decreases, and the velocity gradient is low throughout the channel. This enables reduction in the surface roughness for a short period and ensures uniform finishing in the central region of the channel; however, over polishing occurs owing to the centrifugal force generated in the entrance region, which causes the form accuracy of the channel to partially deteriorate. The outcomes of this study demonstrate that the observational finding for the finishing process is consistent with the flow simulation results. The flow simulation can be instrumental in designing channel diameters and internal pressures to ensure efficient and uniform finishing for such channels.

Sign in / Sign up

Export Citation Format

Share Document