Abstract
This paper describes the impression of low-k/high-k dielectric on the performance of Double Gate Junction less (DG-JL) MOSFET. An analytical model of the threshold voltage of DG-JLFET has been presented. Poisson’s equation is solved using the parabolic approximation to find out the threshold voltage. The effect of high-k on various performance parameters of N-type DG-JLFET is explored. The comparative analysis has been carried out between conventional gate oxide, multi oxide and high-k oxide in terms of Drain Induced Barrier Lowering (DIBL), threshold voltage, figure of merit (ION/IOFF) and sub-threshold slope (SS). The high-k oxide has shown superlative performance as compared to others. The results are further analyzed for various device structures. The DG-JLFET with HfO2 exhibits excellent attainment by mitigating the Short Channel Effects (SCEs). The significant reduction in off current makes the device suitable for ultra-low power applications. There is a 61.9 % and 34.29% improvement in the figure of merit and sub-threshold slope in the proposed device as compared to other devices. The simulation of DG-JLFET is carried out using the Silvaco TCAD tool.
2-D analytical modeling of dual material gate fully depleted SOI MOSFET with high-k dielectric