Evonik and Wynca start construction of fumed silica plant

2020 ◽  
Vol 2020 (2) ◽  
pp. 4
Keyword(s):  
Fumed Silica

Mechanical Property Improvement of Poly(Butylene Succinate) by Reinforcing with Modified Fumed Silica

2014 ◽  
Vol 1025-1026 ◽  
pp. 215-220 ◽  
Author(s):  
Sasirada Weerasunthorn ◽  
Pranut Potiyaraj
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Impact Strength ◽  
Flexural Strength ◽  
Fumed Silica ◽  
Tensile Modulus ◽  
Silica Particles ◽  
Melt Mixing ◽  
Butylene Succinate ◽  
Ir Spectrophotometry

Fumed silica particles (SiO2) were directly added into poly (butylene succinate) (PBS) by melt mixing process. The effects of amount of fumed silica particles on mechanical properties of PBS/fumed silica composites, those are tensile strength, tensile modulus, impact strength as well as flexural strength, were investigated. It was found that the mechanical properties decreased with increasing fumed silica loading (0-3 wt%). In order to increase polymer-filler interaction, fumed silica was treated with 3-glycidyloxypropyl trimethoxysilane (GPMS), and its structure was analyzed by FT-IR spectrophotometry. The PBS/modified was found to possess better tensile strength, tensile modulus, impact strength and flexural strength that those of PBS/fumed silica composites.

Stiff and tough hydrophobic cellulose-silica aerogels from bacterial cellulose and fumed silica

2021 ◽  
Vol 103 ◽  
pp. 31-38
Author(s):  
Sanosh Kunjalukkal Padmanabhan ◽  
Carmelo Protopapa ◽  
Antonio Licciulli
Keyword(s):  
Bacterial Cellulose ◽  
Fumed Silica ◽  
Silica Aerogels

The use of fumed silica in printing inks

1986 ◽  
Vol 15 (1) ◽  
pp. 13-19 ◽  
Author(s):  
Dieter Riffel
Keyword(s):  
Fumed Silica ◽  
Printing Inks

Performance of Polishing Slurries containing Silica Particles grown by Sol-Gel Method

2000 ◽  
Vol 613 ◽  
Author(s):  
Sun Hyuk Bae ◽  
Jae-Hyun So ◽  
Seung-Man Yang ◽  
Do Hyun Kim
Keyword(s):  
Fumed Silica ◽  
Sol Gel ◽  
Particle Growth ◽  
Silica Particles ◽  
Gel Method ◽  
Sol Gel Method ◽  
Irregular Shapes ◽  
Wafer Polishing ◽  
Transmission Electron ◽  
Silica Slurry

ABSTRACTSilica slurry used as abrasives in wafer polishing process is made by dispersing silica particles in an alkali solution. Since commercially available colloidal or fumed silica particles need some modifications to be directly used as abrasive slurry due to their small sizes, irregular shapes or broad size distribution, we have prepared silica abrasives by particle growth of fumed silica or colloidal silica as seeds by sol-gel method. Silica slurries prepared by this step-wise growth from commercial seeds were tested using one-armed polisher for the comparison with commercial slurries and showed the performance comparable to commercial slurries. Microstructures of polishing slurries were investigated using transmission electron microscopy and ARES rheometer. From the result, stability of the slurry was found to be more important than the primary particle sizes for the polishing performance.

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