Measuring relative grain boundary energies and mobilities in an aluminum foil from triple junction geometry

2001 ◽  
Vol 44 (12) ◽  
pp. 2735-2740 ◽  
Author(s):  
C.-C Yang ◽  
A.D Rollett ◽  
W.W Mullins
Keyword(s):  
Grain Boundary ◽  
Triple Junction ◽  
Aluminum Foil ◽  
Junction Geometry

scholarly journals The drag effect of air bubbles on triple junction migration of pure ice

2021 ◽  
Vol 11 (1) ◽  
pp. 86-97
Author(s):  
Pastor Ignacio Achával ◽  
Carlos Leonardo Di Prinzio
Keyword(s):  
Monte Carlo ◽  
Monte Carlo Method ◽  
Grain Boundary ◽  
Numerical Simulations ◽  
Triple Junction ◽  
Optical Microscope ◽  
Air Bubbles ◽  
Drag Effect ◽  
Junction Geometry

The migration of a grain triple junction was studied on ice pure samples with bubbles at -2°C for almost 3 h. This work studies the interaction between Grain Boundary (GB) and bubbles. The evolution of the triple junction was recorded from successive photographs obtained from a LEICA® optical microscope. Simultaneously, numerical simulations of grain triple junction with mobile bubbles were carried out using Monte Carlo method with the following conditions: The bubbles in the bulk were kept immobile and those in the GB were allowed to move. In addition, mobile bubbles were forced to stay inside the GB. The simulations show that bubbles slow down the movement of the GB and of the triple junction. What’s more, the simulated triple junction obtained fits very well the experimental triple junction geometry, and the GB diffusivity values obtained coincide with those measured experimentally at the same temperature and reported by other authors. Finally, the drag effect of the mobile bubbles on the GB migration was verified.

Extraction of Grain Boundary Energies from Triple Junction Geometry

1999 ◽  
Vol 5 (S2) ◽  
pp. 230-231
Author(s):  
A. D. Rollett ◽  
C.-C. Yang ◽  
W. W. Mullins ◽  
B. L. Adams ◽  
C. T. Wu ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Triple Junction ◽  
Preliminary Analysis ◽  
Boundary Energy ◽  
Orientation Imaging Microscopy ◽  
Dihedral Angles ◽  
Grain Boundary Energy ◽  
Boundary Character ◽  
Junction Geometry

Measurement of the geometry of triple junctions between grain boundaries in polycrystalline materials is used to generate large sets of dihedral angles from which maps of the grain boundary energy are extracted. A preliminary analysis has been performed for samples of magnesia and aluminum based on a three-parameter description of grain boundaries. An extended form of orientation imaging microscopy (OIM) was used to measure both triple junction geometry via image analysis in the SEM and local grain orientation via electron back scatter diffraction. Serial sectioning with registry of both in-plane images and successive sections characterizes triple junction tangents from which true dihedral angles are calculated. If there is local equilibrium at each triple junction, we may apply Herring's relation. By limiting grain boundary character to a (three parameter) specification of misorientation for the preliminary analysis, we can neglect the torque terms and apply the sine law to the three boundaries. This provides two independent relations per triple junction between grain boundary energies and dihedral angles. By discretizing the misorientation and employing multiscale statistical analysis on large data sets, (relative) grain boundary energy as a function of boundary character can be extracted from triple junction geometry. The results are discussed with respect to current understanding of grain boundary structure based on their crystallography. The results suggest that a three parameter characterization of grain boundaries (lattice disorientation) is not an adequate description of boundary character. A full analysis including torque terms and a five parameter boundary description is under development.

STUDY OF THE GRAIN BOUNDARY MIGRATION IN A TRICRISTAL PURE ICE WITH BUBBLES

Anales AFA ◽  
2019 ◽  
Vol 30 (3) ◽  
pp. 47-51
Author(s):  
P.I. Achával ◽  
C. L. Di Prinzio
Keyword(s):  
Monte Carlo ◽  
Grain Boundary ◽  
Numerical Simulations ◽  
Triple Junction ◽  
Boundary Migration ◽  
Optical Microscope ◽  
Physical Parameters ◽  
Grain Boundary Migration

In this paper the migration of a grain triple junction in apure ice sample with bubbles at -5°C was studied for almost 3hs. This allowed tracking the progress of the Grain Boundary (BG) and its interaction with the bubbles. The evolution of the grain triple junction was recorded from successive photographs obtained witha LEICA® optical microscope. Simultaneously, numerical simulations were carried out using Monte Carlo to obtain some physical parameters characteristic of the BG migration on ice.

The Stepwise Cross-sectional Crystalline Analysis of the Stress Induced Voiding in Cu Interconnect

2006 ◽  
Vol 914 ◽  
Author(s):  
Hyo-Jong Lee ◽  
Heung Nam Han ◽  
Suk Hoon Kang ◽  
Jeong-Yun Sun ◽  
Kyu Hwan Oh
Keyword(s):  
Grain Boundary ◽  
Twin Boundary ◽  
Triple Junction ◽  
Hydrostatic Stress ◽  
Electron Backscattered Diffraction ◽  
Cross Sectional ◽  
Copper Interconnect ◽  
Crystallographic Study ◽  
Cu Interconnect ◽  
Planar Electron

AbstractIn a crystallographic study of stress induced voiding of copper interconnect, the planar electron backscattered diffraction analysis showed that the void was initiated at the triple junction of the grain boundaries, not at the junction of the twin boundary and grain boundary. By using stepwise cross-sectional crystalline investigation for the void, it was possible to rebuild 3D crystalline structure near the void. From the stress calculation based on the measured crystalline structures, the hydrostatic stress was highly concentrated at the triple junction of the twin boundary and grain boundary, but experimentally, there was no voiding at that. The voiding in the copper interconnect may depend mainly on the boundary instability.

Thermodynamics and Kinetics of 1D Structural Elements and Stability of Nanocrystalline Materials

2015 ◽  
Vol 5 ◽  
pp. 173-195
Author(s):  
Günter Gottstein ◽  
Lazar S. Shvindlerman
Keyword(s):  
Grain Boundary ◽  
Grain Growth ◽  
Triple Junction ◽  
Nanocrystalline Materials ◽  
Triple Line ◽  
Second Phase ◽  
Structural Elements ◽  
Triple Junctions ◽  
Line Energy ◽  
The Impact

Grain boundary triple junctions are the structural elements of a polycrystal. Recently it was recognized that they can strongly impact the microstructural evolution, and therefore there engender new opportunities to control and to design the grain microstructure of fine-grained and nanocrystalline materials due to their effect on recovery, recrystallization and grain growth. The measurement of triple junction energy and mobility is thus of great importance. The line energy of a triple junction constructs an additional driving force of grain growth. Taking the triple line energy into account, a modified form of the Zener force and the Gibbs-Thomson relation can be derived to reveal the influence of the triple line energy on second phase particles and the change of the equilibrium concentration of vacancies in the vicinity of voids at a grain boundary. The impact of triple junctions on the sintering of nanopowders is discussed. The role of “grain boundary - free surface” triple lines in the adhesive contact formation between spherical nanoparticles is considered. It is shown that there is a critical value of the triple line energy above which the nanoparticles do not stick together. Based on this result, a new nanoparticle agglomeration mechanism is proposed, which accounts for the formation of large agglomerates of crystallographically aligned nanoparticles during the nanopowder processing.

An Electro-Optical X-Ray Diffraction System for Grain Boundary Migration Measurements at Temperature

1971 ◽  
Vol 15 ◽  
pp. 435-445
Author(s):  
Robert E. Green
Keyword(s):  
Grain Boundary ◽  
Test Specimen ◽  
Boundary Migration ◽  
Aluminum Foil ◽  
Average Diameter ◽  
Absolute Measurement ◽  
Grain Boundary Migration ◽  
X Ray ◽  
Cold Worked ◽  
Considerable Work

Considerable work has been undertaken in order to gain an understanding of the mechanisms responsible for the generation of recrystallization textures developed upon annealing of cold-worked metals. Most direct measurements have consisted of measuring the increase in average diameter of the largest grain growing into a polycrystalline aggregate. Experimental measurements of individual boundaries migrating into deformed single crystals, though of a more fundamental nature, have been made by far fewer investigators. This is probably due to the increased experimental difficulties associated with careful control of such experiments. Most previous investigators have made grain boundary migration measurements by the heat-cool-etch method, despite the fact that it has several marked disadvantages. Other investigators have constructed an X-ray goniometer furnace and used it to measure grain boundary migration rates while the test specimen was maintained at temperature. Since there have been no published reports of the use of such a system in the past thirteen years, it must be concluded that the technique was unsuccessful in general.The system described in the present work is relatively simple in design and extremely simple to use. Not only does it permit absolute measurement of grain boundary position at temperature but it also permits boundary migration measurements to be made of extremely fast moving boundaries. The basic components of the system are as follows. A continuous spectrum X-ray beam is converted by a slit collimating system into a beam which is incident along the entire length of the test specimen. This beam is interrupted by a wire grid just prior to impingement on the test specimen. The test specimen is supported vertically in a furnace maintained at the temperature required for grain boundary migration. The various diffracted X-ray beams pass out of the furnace through a highly reflecting insulating baffle made from very thin aluminum foil and impinge on a fluorescent screen. This screen converts the X-ray image into a visible one which is amplified and recorded using the electro-optical system.

Computer Modeling of Ceramics Sintering: Effects of Inhomogeneity on Sintering Kinetics

2018 ◽  
Vol 281 ◽  
pp. 918-933
Author(s):  
Wen Dong Luo ◽  
Hai Peng Qiu ◽  
Jing Zhe Pan
Keyword(s):  
Surface Tension ◽  
Grain Size ◽  
Grain Boundary ◽  
Computational Model ◽  
Numerical Solution ◽  
Surface Diffusion ◽  
Triple Junction ◽  
Diffusion Mechanism ◽  
Sintering Kinetics ◽  
Effect Of Surface

In the sintering of ceramics, cracks are inevitably encountered after sintering. But very few studies have been presented in the literature for qualifying and quantifying effects of inhomogeneity on sintering kinetics. Therefore, a series of detailed sintering variables such as grain size, surface tension and diffusivity are chosen to study the effects of their inhomogeneity on sintering kinetics through a computational model calculated by computer.Furthermore, there are two main achievements in this computational model that first one is providing a numerical solution for the curvature at triple junction (pore tip) of microscopic particles, and second one is considering the effect of surface diffusion on first-stage sintering where diffusion mechanism is coupled by grain-boundary and surface diffusion.

New Understanding of Abnormal Grain Growth Approached by Solid-State Wetting along Grain Boundary or Triple Junction

2004 ◽  
Vol 467-470 ◽  
pp. 745-750 ◽  
Author(s):  
Nong Moon Hwang
Keyword(s):  
Solid State ◽  
Grain Boundary ◽  
Grain Growth ◽  
Triple Junction ◽  
Boundary Energy ◽  
Growth Front ◽  
Abnormal Grain Growth ◽  
Boundary Mobility ◽  
Grain Boundary Mobility ◽  
Mc Simulation

Although it has been generally believed that the advantage of the grain boundary mobility induces abnormal grain growth (AGG), it is suggested that the advantage of the low grain boundary energy, which favors the growth by solid-state wetting, induces AGG. Analyses based on Monte Carlo (MC) simulation show that the approach by solid-state wetting could explain AGG much better than that by grain boundary mobility. AGG by solid-state wetting is supported not only by MC simulations but also by the experimental observation of microstructure evolution near or at the growth front of abnormally growing grain. The microstructure shows island grains and solid-state wetting along grain boundary and triple junction.

The Influence of Anisotropic Grain Boundary Energy on Triple Junction Morphology and Grain Growth

1998 ◽  
Vol 529 ◽  
Author(s):  
Alexander H. King
Keyword(s):  
Grain Boundary ◽  
Triple Junction ◽  
Driving Force ◽  
Boundary Migration ◽  
Boundary Energy ◽  
Dihedral Angles ◽  
Grain Boundary Migration ◽  
Grain Boundary Energy ◽  
Boundary Curvature ◽  
Energy Anisotropy

AbstractWe consider some examples of triple junction equilibration in the presence of grain boundary energy anisotropy. It is shown that the presence of one or two cusp-trapped grain boundaries can reduce the restrictions upon the dihedral angles formed with the remaining (isotropic) boundaries This allows for a reduction in the average grain boundary curvature, and thus in the driving force for grain boundary migration.

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