Impurity-controlled contrast in secondary-electron images of reaction-bonded silicon carbide
Reaction-bonded SiC is formed by the high temperature (>2100°C) heat treatment of a mixture of alpha-SiC powder and organic binders in the presence of elemental Si. The bonding occurs by the in-situ formation of beta-SiC from the reaction of the pyrolyzed binder and the Si. Substantial microstructural characterization of these materials has been carried out in the past. A particular feature of these analyses is the so-called trace-impurity-controlled contrast of secondary electron (SE) images of uncoated specimens. This report describes further attempts to elucidate the origin of this contrast mechanism.Samples of reaction-bonded SiC (Hexoloy KT, The Carborundum Co.) were prepared for multiple-technique analysis. This was accomplished by preparing an optical thin section for reflected and transmitted optical microscopy. Regions of interest were diamond-scribed on the optical microscope (Leitz, Orthoplan) and then SE and backscattered electron (BE) microscopy (CamScan, Series IV) of the same areas (both coated and uncoated with evaporated carbon) was conducted. Finally, the same areas were imaged in a secondary ion mass spectrometer (SIMS) (Cameca, IMS3F) to detect trace and major impurity levels.