Advanced Confocal Microscopy An Essential Technique for Microfluidics Development

Many believe that microfluidics has the potential to do for chemistry and biology what the integrated circuit has done for electronics — integrating tremendously complex chemical and biological processes into simple easy-to-use devices that will eventually pervade our lives. While microfluidics has made great progress in the last decade — addressing many of the fundamental questions related to manipulating nanoliter volumes of chemicals and solutions — it still faces some very basic challenges as it moves out of the laboratory and into use. Perhaps most basic is the need for fast, accurate characterization of the size and shape of the microfluidic devices themselves. Conventional imaging and measurement techniques have proven adequate for initial development, but are unable to provide the speed and accuracy needed to support the continued development of microfluidic technologies.

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Characterization of RF Sputtered ZnO Piezoelectric Films Using Transmission Electron Microscope

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100114050 ◽

1975 ◽

Vol 33 ◽

pp. 86-87

Author(s):

Kemining W. Yeh ◽

Richard S. Muller ◽

Wei-Kuo Wu ◽

Jack Washburn

Keyword(s):

Integrated Circuit ◽

Acoustic Waves ◽

New Technology ◽

Surface Acoustic Waves ◽

Electromechanical Properties ◽

Leading Role ◽

Saw Devices ◽

Transmission Electron ◽

High Degree

Considerable and continuing interest has been shown in the thin film transducer fabrication for surface acoustic waves (SAW) in the past few years. Due to the high degree of miniaturization, compatibility with silicon integrated circuit technology, simplicity and ease of design, this new technology has played an important role in the design of new devices for communications and signal processing. Among the commonly used piezoelectric thin films, ZnO generally yields superior electromechanical properties and is expected to play a leading role in the development of SAW devices.

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Failure Analysis of CDM-ESD Damage in a GaAs RFIC

ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2000p0215 ◽

2000 ◽

Author(s):

Amy Poe ◽

Steve Brockett ◽

Tony Rubalcava

Keyword(s):

Radio Frequency ◽

Failure Analysis ◽

Integrated Circuit ◽

Production Test ◽

Analysis Techniques ◽

Device Model ◽

Charged Device ◽

Subsequent Failure

Abstract The intent of this work is to demonstrate the importance of charged device model (CDM) ESD testing and characterization by presenting a case study of a situation in which CDM testing proved invaluable in establishing the reliability of a GaAs radio frequency integrated circuit (RFIC). The problem originated when a sample of passing devices was retested to the final production test. Nine of the 200 sampled devices failed the retest, thus placing the reliability of all of the devices in question. The subsequent failure analysis indicated that the devices failed due to a short on one of two capacitors, bringing into question the reliability of the dielectric. Previous ESD characterization of the part had shown that a certain resistor was likely to fail at thresholds well below the level at which any capacitors were damaged. This paper will discuss the failure analysis techniques which were used and the testing performed to verify the failures were actually due to ESD, and not caused by weak capacitors.

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Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2008p0121 ◽

2008 ◽

Author(s):

Nicholas Randall ◽

Rahul Premachandran Nair

Keyword(s):

Mechanical Properties ◽

Quality Control ◽

Integrated Circuits ◽

Integrated Circuit ◽

Manufacturing Process ◽

Solder Bumps ◽

Initial Work ◽

Circuit Components ◽

Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

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Measurement techniques for the characterization of the European mini test chip

10.3403/00779226u ◽

2015 ◽

Keyword(s):

Measurement Techniques ◽

Test Chip

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Isolation, Identification and Degradation Characterization of Synthetic Dyes Degrading Strain

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.610-613.3140 ◽

2012 ◽

Vol 610-613 ◽

pp. 3140-3143

Author(s):

Hui Xing Liang

Keyword(s):

Pseudomonas Aeruginosa ◽

Synthetic Dyes ◽

Complex Chemical ◽

Chemical Structures ◽

Cultural Conditions ◽

Cultural Medium ◽

Initial Ph

Dyes are usually difficult to be decolorized due to their complex chemical structures. In this work, a bacterium which had the ability of decoloration on synthetic dyes was isolated from Yancheng printworks and was identified as Pseudomonas aeruginosa. The effects of concentration of the dye concentration, cultural time, cultural temperature and initial pH of cultural medium on the efficiency of decoloration were investigated. The result showed that the optimal cultural conditions was: dye concentration was 50mg.L-1, cultural time was 72 h, cultural temperature was 28°C, initial pH of cultural medium was 7.0.

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A Fresh Insight into Film Morphology Measurement Techniques for Advanced Ulsi Manufacturing

MRS Proceedings ◽

10.1557/proc-309-429 ◽

1993 ◽

Vol 309 ◽

Author(s):

Seshadri Ramaswami

Keyword(s):

Grain Size ◽

Integrated Circuit ◽

Measurement Techniques ◽

Film Morphology ◽

Integrated Circuit Fabrication ◽

Circuit Fabrication ◽

Non Destructive ◽

Fresh Insight ◽

Insight Into

AbstractA laser based non-destructive technique has been used to study the morphology of sputterdeposited aluminum alloy films. The data emanating from the Therma-wave Imager that makes use of this principle, has been correlated with reflectivity, grain size and micro-roughness of the film. In addition, through the use of a case study, this paper demonstrates the utility of this application as an in-line monitor in an integrated circuit fabrication line.

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Impact of spineless cactus cultivation (O. Ficus-indica) on the thermal characteristics of soil

Ambiente e Agua - An Interdisciplinary Journal of Applied Science ◽

10.4136/ambi-agua.2148 ◽

2018 ◽

Vol 13 (1) ◽

pp. 1

Author(s):

Willames De Albuquerque Soares

Keyword(s):

Heat Capacity ◽

Thermal Characteristics ◽

Thermal Characterization ◽

Biological Processes ◽

Volumetric Heat Capacity ◽

Average Value ◽

Brazilian Semiarid ◽

Cultivation Techniques ◽

Soil Changes

Temperature is a fundamentally important factor for understanding the physical, chemical, and biological processes that occur in soil. However, there are few studies in the Brazilian semiarid zone that seek to understand how soil degradation affects its thermal characteristics. The objective of this study was to evaluate the influence of cultivation techniques on the thermal characterization of soil, using the model proposed by Johansen. The study was conducted in the Agreste region of the state of Pernambuco, Brazil on two plots of land, one with native vegetation (Caatinga) and the other with spineless cactus (O. ficus - indica). It was observed that the procedures used to prepare the soil for cultivation of spineless cactus caused a reduction in the capacity to transmit the surface temperature to the interior of the soil. Changes in the physical properties of the soil required for cultivation resulted in a reduction in the average value of the volumetric heat capacity of about 22%; an increase of approximately 5% in the average volumetric heat capacity and a 26% increase in the thermal diffusivity of the soil, as well as a reduction of approximately 50% in the heat flux from the surface of the soil.

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