Thermally Controlled Acceleration of Epoxy Resin Curing through Polymer-Bound Imidazole Derivatives with High Latency

The article discusses the results of experiments on the further development of the method for monitoring the state of the small samples of resin and polymers during curing. The applied method is based on a change in the structure of oscillating transducers leading to variations in the form and/or mode of oscillation. The thin layer of epoxy resin was placed between two piezoelectric transducers in the form of piezoceramic plates. Curing epoxy resin forms a bimorph and its characteristics change along with variations in viscosity or, after the gel point, stiffness. It is possible to establish the level of epoxy resin curing by monitoring changes in the resonance parameters of bimorph elements. The main purpose of cure monitoring of small samples is to develop a new method for evaluating the parameters of resin both before and after the gel point thus taking into consideration that the use of rheological data measured with reference to small samples will be applied for designing or interpreting bulk-flow processes where epoxy may be considered a continuum.

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Mechanical and Thermal Properties of Siloxane Reinforced Biphenyldiol Formaldehyde Resin Curing Epoxy Resin Composites

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.936.3 ◽

2014 ◽

Vol 936 ◽

pp. 3-7

Author(s):

Shi Hui Chen ◽

Jun Gang Gao ◽

Hong Zhe Han ◽

Chao Wang

Keyword(s):

Epoxy Resin ◽

Impact Resistance ◽

Resin Matrix ◽

Formaldehyde Resin ◽

Mechanical And Thermal Properties ◽

Reinforced Composites ◽

Interfacial Bonding Strength ◽

Resin Curing ◽

Degradation Properties ◽

The Impact

In order to modify the properties of the epoxy composites, an alkali catalyzed biphenyldiol formaldehyde resin (BPFR) was synthesized and used to cure epoxy resin (ER). γ-Glycidoxypropyl trimethoxysilane (KH-560) was used as a reinforcer of the composites. Laminates of the BPFR/ER fiberglass reinforced composites with different (KH-560) contents were prepared. The influence of the KH-560 content on the glass transition temperature (Tg) and thermal degradation properties of the composites was researched by dynamic mechanical analyzer (DMA) and thermogravimetric analysis (TG). The mechanical, electrical properties of the composites were determined. The results showed that the interfacial bonding strength between resin matrix and fiberglass can be efficiently improved with the presence of KH-560. When the ratio of BPFR and ER is 3 : 7, the content of KH-560 is 5 ~7 wt%, the impact resistance of the fiberglass reinforced composites is 61.35~78.59 kJ/m2, the tensile resistance is 150.37~162.54 MPa, which are all 30 % higher than that of no added; The dielectric constant ε and dielectric loss tanδ of the composites is between 0.50~0.68 and between 0.008~0.01, respectively.

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HIGH TECHNIQUE FOR T-PEEL STRENGTH ENHANCEMENT OF Al/AFRP HYBRID COMPOSITE

International Journal of Modern Physics B ◽

10.1142/s0217979206041215 ◽

2006 ◽

Vol 20 (25n27) ◽

pp. 4273-4278

Author(s):

CHEOL-WOONG KIM ◽

DONG-JOON OH

Keyword(s):

Tensile Strength ◽

Epoxy Resin ◽

Hybrid Composite ◽

Equivalence Ratio ◽

Peel Strength ◽

Aramid Fiber ◽

Curing Agent ◽

Mixture Ratio ◽

Resin Mixture ◽

Resin Curing

The interlaminar peel strength of Al / AFRP (Aluminum alloy/Aramid Fiber Reinforced Plastic) hybrid composite is affected by the adhesive strength between the Al alloy layer and the aramid fiber layer. The study of the tensile strength and the T-peel strength of the Al / AFRP should be accomplished first. Therefore, this study focused on the effect of the resin mixture ratio as the Al / AFRP on the tensile strength and T-peel strength. In conclusions, the resin mixture ratio by equivalence ratio of 〈epoxy resin : curing agent〉 equal to 〈1:1〉 of Al / AFRP -I and the resin mixture ratio by equivalence ratio of 〈epoxy resin : curing agent : accelerator〉 equal to 〈1:1:0.2〉 of Al / AFRP -II showed the highest ultimate tensile strength. After the T-peel test, it is found that the T-peel strength of Al / AFRP -II is approximately 1.5 times higher than that of Al / AFRP -I. Reviewing the characteristics of the tensile and T-peel strengths, the resin mixture ratio 〈1:1:0.2〉 of Al / AFRP -II showed the highest tensile strength and T-peel strength.

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Studies on Mechanical and Thermal Properties of Epoxy Resin Modified by Fluorine-Containing Silicone

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.401-403.713 ◽

2013 ◽

Vol 401-403 ◽

pp. 713-716

Author(s):

Cheng Fang ◽

Dong Bo Guan ◽

Wei Guo Yao ◽

Shou Jun Wang ◽

Hui An

Keyword(s):

Glass Transition ◽

Thermal Properties ◽

Epoxy Resin ◽

Bending Strength ◽

Mechanical And Thermal Properties ◽

Curing Agent ◽

Epoxy System ◽

Resin Curing ◽

The Impact ◽

Modified Epoxy

The epoxy resin was modified with the mixture of α,ω-dihydroxy poly-(3,3,3-trifluoropropyl) siloxane (PTFPMS), KH560 and stannous octoate. KH560 can react with PTFPMS and also epoxy resin curing agent. The two reactions were characterized by FI-IR. The modified epoxy resin was characterized by FI-IR. The result showed that fluorine-containing silicone had been successfully introduced into the epoxy system. The mechanical and thermal properties of the modified epoxy resin were analyzed. The results showed that with the increase of PTFPMS the impact strength of epoxy resin increased, hardness and bending strength correspondingly reduced, slight decrease in the glass transition temperature.

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Fully exfoliated graphene oxide accelerates epoxy resin curing, and results in dramatic improvement of the polymer mechanical properties

Composites Part B Engineering ◽

10.1016/j.compositesb.2019.01.020 ◽

2019 ◽

Vol 162 ◽

pp. 685-691 ◽

Cited By ~ 11

Author(s):

Albina Surnova ◽

Dinar Balkaev ◽

Delus Musin ◽

Rustem Amirov ◽

Ayrat M. Dimiev

Keyword(s):

Mechanical Properties ◽

Graphene Oxide ◽

Epoxy Resin ◽

Dramatic Improvement ◽

Exfoliated Graphene ◽

Resin Curing

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Influence of aluminosilsesquioxane on epoxy resin curing process (Rapid Communication)

Polimery ◽

10.14314/polimery.2014.855 ◽

2014 ◽

Vol 59 (11/12) ◽

pp. 855-858 ◽

Cited By ~ 2

Author(s):

Danuta Matykiewicz ◽

Beata Dudziec ◽

Tomasz Sterzynski

Keyword(s):

Epoxy Resin ◽

Curing Process ◽

Rapid Communication ◽

Resin Curing

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Study on the Preparation of 2-Phenyl Imidazole Microcapsule and its Effect on Curing Epoxy Resin

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.690-693.1649 ◽

2013 ◽

Vol 690-693 ◽

pp. 1649-1652

Author(s):

Ai Jie Ma ◽

Qiu Yu Zhang ◽

You Qiang Shi

Keyword(s):

Epoxy Resin ◽

Raw Materials ◽

Curing Kinetics ◽

Curing Temperature ◽

Curing Agent ◽

Thermal Analyzer ◽

Epoxy Resin System ◽

Curing Kinetic ◽

Resin Curing ◽

Micro Morphology

In this paper, 2-phenyl imidazole (2-PZ) microcapsule-type curing agent of epoxy resin were prepared through solvent volatilization with 2-PZ and polymethyl acrylic glycidyl ester (PGMA) as the raw materials. The micro-morphology, shape and structure of the microcapsules were studied by scanning electronic microscope (SEM) and fourier transform infrared spectrum (FT-IR). The curing kinetics of microcapsule curing agent/epoxy resin E-44 curing system were studied using TGA/DSC simultaneous thermal analyzer. Results showed that the preparation method is simple and effective and the prepared 2-PZ microcapsules have smooth surfaces and monodisperse size. And the curing kinetic study of epoxy resin system suggested epoxy resin curing temperature was rising with the increase of heating rate.

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