Three-Dimensional High-Density Hierarchical Nanowire Architecture for High-Performance Photoelectrochemical Electrodes

Nano Letters ◽  
2011 ◽  
Vol 11 (8) ◽  
pp. 3413-3419 ◽  
Author(s):  
Jian Shi ◽  
Yukihiro Hara ◽  
Chengliang Sun ◽  
Marc A. Anderson ◽  
Xudong Wang
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
High Density

scholarly journals A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-Via and Solder Bumping Process

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung
Keyword(s):  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Density ◽  
Internal Stresses ◽  
Deep Reactive Ion Etching ◽  
Fifth Generation ◽  
Precise Understanding ◽  
Fabrication Defects

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.

A review on manufacture of polymeric foam cores for sandwich structures of complex shape in automotive applications

2021 ◽  
pp. 109963622110305
Author(s):  
Youming Chen ◽  
Raj Das
Keyword(s):  
Mechanical Properties ◽  
High Performance ◽  
Complex Shape ◽  
Complex Geometry ◽  
Sandwich Structures ◽  
Three Dimensional ◽  
High Density ◽  
Automotive Applications ◽  
Polymeric Foam ◽  
High Level

In this work, polymeric foam thermoforming, foam injection moulding, bead foaming and film foaming were reviewed in an effort to explore feasible processes to manufacture sandwich structures of complex geometry for automotive applications. Injection moulded foams generally suffer from high density, poor cell morphologies and unnecessary skin layers. Foamable films currently available are pressure-induced. In order for foamable films to produce foam, high uniformly-distributed pressure needs to be applied, which makes it difficult to manufacture foam parts of three-dimensional complex geometry with foamable films. The majority of commercial high-performance foam cores can be thermoformed. Ideally, thermoformed foam cores would have good mechanical properties if high-performance foam sheets are used. However, the mechanical properties of foams might be reduced during the process of thermoforming, especially around corners. Bead foaming offers a high level of freedom in foam geometry to be moulded, and inserts can be integrated into foam cores during the process of moulding. Moreover, foam cores with high density in high stressed areas and low density in low stressed areas can be manufactured with foam beads of different densities. However, due to nonhomogeneous degree of fusion and weak bonds and voids between beads, bead foams generally show mechanical properties lower than their block counterpart. Relatively speaking, thermoforming with high-performance foam sheets and moulding with high-performance foam beads hold great potentials for mass production of sandwich cores of complex geometry for automotive applications. However, further investigation on the mechanical properties of thermoformed foams and high-performance bead foams is still in need to confirm their suitability.

scholarly journals Highly efficient lattice Boltzmann multiphase simulations of immiscible fluids at high-density ratios on CPUs and GPUs through code generation

2021 ◽  
pp. 109434202110165
Author(s):  
Markus Holzer ◽  
Martin Bauer ◽  
Harald Köstler ◽  
Ulrich Rüde
Keyword(s):  
Code Generation ◽  
Lattice Boltzmann ◽  
High Performance ◽  
Three Dimensional ◽  
Coupled Model ◽  
Immiscible Fluids ◽  
High Density ◽  
Density Ratios ◽  
Optimized Code ◽  
High Level

A high-performance implementation of a multiphase lattice Boltzmann method based on the conservative Allen-Cahn model supporting high-density ratios and high Reynolds numbers is presented. Meta-programming techniques are used to generate optimized code for CPUs and GPUs automatically. The coupled model is specified in a high-level symbolic description and optimized through automatic transformations. The memory footprint of the resulting algorithm is reduced through the fusion of compute kernels. A roofline analysis demonstrates the excellent efficiency of the generated code on a single GPU. The resulting single GPU code has been integrated into the multiphysics framework waLBerla to run massively parallel simulations on large domains. Communication hiding and GPUDirect-enabled MPI yield near-perfect scaling behavior. Scaling experiments are conducted on the Piz Daint supercomputer with up to 2048 GPUs, simulating several hundred fully resolved bubbles. Further, validation of the implementation is shown in a physically relevant scenario—a three-dimensional rising air bubble in water.

Improved 3-D reconstruction using stereo computer graphics and multiple tilt EM images

1995 ◽  
Vol 53 ◽  
pp. 630-631
Author(s):  
Lee D. Peachey ◽  
Lou Fodor ◽  
John C. Haselgrove ◽  
Stanley M. Dunn ◽  
Junqing Huang
Keyword(s):  
Computer Graphics ◽  
High Performance ◽  
Transverse Section ◽  
Three Dimensional ◽  
Stereo Pair ◽  
3D Reconstructions ◽  
Video Cameras ◽  
Biological Objects ◽  
Microscope Images ◽  
High Performance Computer

Stereo pairs of electron microscope images provide valuable visual impressions of the three-dimensional nature of specimens, including biological objects. Beyond this one seeks quantitatively accurate models and measurements of the three dimensional positions and sizes of structures in the specimen. In our laboratory, we have sought to combine high resolution video cameras with high performance computer graphics systems to improve both the ease of building 3D reconstructions and the accuracy of 3D measurements, by using multiple tilt images of the same specimen tilted over a wider range of angles than can be viewed stereoscopically. Ultimately we also wish to automate the reconstruction and measurement process, and have initiated work in that direction.Figure 1 is a stereo pair of 400 kV images from a 1 micrometer thick transverse section of frog skeletal muscle stained with the Golgi stain. This stain selectively increases the density of the transverse tubular network in these muscle cells, and it is this network that we reconstruct in this example.

Sub-20nm Device Voltage-Sensitive SRAM Characterization and Failure Analysis

2018 ◽  
Author(s):  
Seng Nguon Ting ◽  
Hsien-Ching Lo ◽  
Donald Nedeau ◽  
Aaron Sinnott ◽  
Felix Beaudoin
Keyword(s):  
Failure Analysis ◽  
High Performance ◽  
Yield Loss ◽  
Technology Development ◽  
High Density ◽  
High K ◽  
Yield Learning ◽  
Oxide Deposition ◽  
Edge Profile ◽  
High K Dielectric

Abstract With rapid scaling of semiconductor devices, new and more complicated challenges emerge as technology development progresses. In SRAM yield learning vehicles, it is becoming increasingly difficult to differentiate the voltage-sensitive SRAM yield loss from the expected hard bit-cells failures. It can only be accomplished by extensively leveraging yield, layout analysis and fault localization in sub-micron devices. In this paper, we describe the successful debugging of the yield gap observed between the High Density and the High Performance bit-cells. The SRAM yield loss is observed to be strongly modulated by different active sizing between two pull up (PU) bit-cells. Failure analysis focused at the weak point vicinity successfully identified abnormal poly edge profile with systematic High k Dielectric shorts. Tight active space on High Density cells led to limitation of complete trench gap-fill creating void filled with gate material. Thanks to this knowledge, the process was optimized with “Skip Active Atomic Level Oxide Deposition” step improving trench gap-fill margin.

Rationally Designed Three-Dimensional Porous Nico 2n@C Reticular Structure for High-Performance Li-Ion Batteries

2020 ◽  
Author(s):  
Peiyao Wang ◽  
Bangchuan Zhao ◽  
Jin Bai ◽  
Kunzhen Li ◽  
Hongyang Ma ◽  
...  
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Li Ion Batteries ◽  
Reticular Structure ◽  
Li Ion

scholarly journals Polarization-sensitive photodetectors based on three-dimensional molybdenum disulfide (MoS2) field-effect transistors

Nanophotonics ◽  
2020 ◽  
Vol 9 (16) ◽  
pp. 4719-4728
Author(s):  
Tao Deng ◽  
Shasha Li ◽  
Yuning Li ◽  
Yang Zhang ◽  
Jingye Sun ◽  
...  
Keyword(s):  
Molybdenum Disulfide ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Three Dimensional ◽  
Polarized Light ◽  
Optical Field ◽  
Two Dimensional ◽  
Polarization Ratio ◽  
Two Dimensional Materials

AbstractThe molybdenum disulfide (MoS2)-based photodetectors are facing two challenges: the insensitivity to polarized light and the low photoresponsivity. Herein, three-dimensional (3D) field-effect transistors (FETs) based on monolayer MoS2 were fabricated by applying a self–rolled-up technique. The unique microtubular structure makes 3D MoS2 FETs become polarization sensitive. Moreover, the microtubular structure not only offers a natural resonant microcavity to enhance the optical field inside but also increases the light-MoS2 interaction area, resulting in a higher photoresponsivity. Photoresponsivities as high as 23.8 and 2.9 A/W at 395 and 660 nm, respectively, and a comparable polarization ratio of 1.64 were obtained. The fabrication technique of the 3D MoS2 FET could be transferred to other two-dimensional materials, which is very promising for high-performance polarization-sensitive optical and optoelectronic applications.

Interpenetrating Gels as Conducting/Adhering Matrices Enabling High-Performance Silicon Anodes

2021 ◽  
Author(s):  
Tingting Xia ◽  
Chengfei Xu ◽  
Pengfei Dai ◽  
Xiaoyun Li ◽  
Riming Lin ◽  
...  
Keyword(s):  
Energy Storage ◽  
High Performance ◽  
Electrode Materials ◽  
Three Dimensional ◽  
Electrochemical Energy Storage ◽  
Active Materials ◽  
Silicon Anodes ◽  
Weak Binding ◽  
Binding Forces

Three-dimensional (3D) conductive polymers are promising conductive matrices for electrode materials toward electrochemical energy storage. However, their fragile nature and weak binding forces with active materials could not guarantee long-term...

scholarly journals 3D Printing of High Viscosity Reinforced Silicone Elastomers

Polymers ◽  
2021 ◽  
Vol 13 (14) ◽  
pp. 2239
Author(s):  
Nicholas Rodriguez ◽  
Samantha Ruelas ◽  
Jean-Baptiste Forien ◽  
Nikola Dudukovic ◽  
Josh DeOtte ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Viscosity ◽  
Layer By Layer ◽  
Silicone Elastomers ◽  
Uv Curable ◽  
Octet Truss ◽  
Tunable Mechanical Properties

Recent advances in additive manufacturing, specifically direct ink writing (DIW) and ink-jetting, have enabled the production of elastomeric silicone parts with deterministic control over the structure, shape, and mechanical properties. These new technologies offer rapid prototyping advantages and find applications in various fields, including biomedical devices, prosthetics, metamaterials, and soft robotics. Stereolithography (SLA) is a complementary approach with the ability to print with finer features and potentially higher throughput. However, all high-performance silicone elastomers are composites of polysiloxane networks reinforced with particulate filler, and consequently, silicone resins tend to have high viscosities (gel- or paste-like), which complicates or completely inhibits the layer-by-layer recoating process central to most SLA technologies. Herein, the design and build of a digital light projection SLA printer suitable for handling high-viscosity resins is demonstrated. Further, a series of UV-curable silicone resins with thiol-ene crosslinking and reinforced by a combination of fumed silica and MQ resins are also described. The resulting silicone elastomers are shown to have tunable mechanical properties, with 100–350% elongation and ultimate tensile strength from 1 to 2.5 MPa. Three-dimensional printed features of 0.4 mm were achieved, and complexity is demonstrated by octet-truss lattices that display negative stiffness.

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