AbstractIn this paper, a detailed study is presented for the growth kinetics of rapid thermal chemical vapor deposition (RTCVD) of nitrogen-doped polysilicon using silane and ammonia chemistry. It is found that nitrogen doping has reduced the surface roughness and grain size of the RTCVD polysilicon film. Both the deposition rate and the incubation time of film growth depend strongly on the ammonia to silane flow ratio. We have proposed a novel structure of NICER (Nitrogen Incorporation into CMOS Gate Electrode by in-situ RTCVD). High performance and highly reliable dual gate CMOS can be formed by combining rapid thermal oxidation (RTO) with RTCVD.
