Thermally conductive, super flexible and flame-retardant BN-OH/PVA composite film reinforced by lignin nanoparticles

2019 ◽  
Vol 7 (45) ◽  
pp. 14159-14169 ◽  
Author(s):  
Xiu Wang ◽  
Song-Lin Ji ◽  
Xin-Qi Wang ◽  
Hui-Yang Bian ◽  
Ling-Rui Lin ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Flame Retardant ◽  
Flame Retardancy ◽  
Thermally Conductive ◽  
Functional Fillers

LNPs were utilized as functional fillers to enhance the thermal conductivity, flame-retardancy, and flexibility of BN-OH/PVA composite film.

Enhanced thermal conductivity and flame retardancy of polyamide 6/flame retardant composites with hexagonal boron nitride

2018 ◽  
Vol 38 (8) ◽  
pp. 767-774 ◽  
Author(s):  
Liang Wang ◽  
Luchong Zhang ◽  
Andreas Fischer ◽  
Yuhua Zhong ◽  
Dietmar Drummer ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Flame Retardant ◽  
Flame Retardancy ◽  
High Performance ◽  
Heat Dissipation ◽  
Hexagonal Boron Nitride ◽  
Light Emitting Diode ◽  
Polyamide 6 ◽  
Twin Screw

Abstract High performance composite of polyamide 6 (PA6)/flame retardant (FR)/hexagonal boron nitride (hBN) was prepared via twin screw extrusion, followed by injection molding. The heat dissipation of the composite was significantly improved by incorporating 40 vol% of hBN, and the corresponding thermal conductivity was up to 5.701 W/(m·K), nearly 17 times that of the PA6/FR composites. In addition, the combination effect of hBN and FR to the flame retardancy of the composites was observed, and the addition of hBN could dramatically enhance the flame retardancy of composites, achieving a UL94 V-0 rating with a limited oxygen index (LOI) value of 37%. This multifunctional modification would broaden the application field of PA6 composites in light-emitting diode (LED) lamps, electronic products, and so on.

scholarly journals Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

Polymers ◽  
2021 ◽  
Vol 13 (3) ◽  
pp. 379
Author(s):  
Seonmin Lee ◽  
Jooheon Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Boron Nitride ◽  
Composite Film ◽  
Vinyl Alcohol ◽  
Composite Films ◽  
Poly Vinyl Alcohol ◽  
Thermal And Mechanical Properties ◽  
Conduction Path ◽  
Thermally Conductive

Aggregated boron nitride (ABN) is advantageous for increasing the packing and thermal conductivity of the matrix in composite materials, but can deteriorate the mechanical properties by breaking during processing. In addition, there are few studies on the use of Ti3C2 MXene as thermally conductive fillers. Herein, the development of a novel composite film is described. It incorporates MXene and ABN into poly(vinyl alcohol) (PVA) to achieve a high thermal conductivity. Polysilazane (PSZ)-coated ABN formed a heat conduction path in the composite film, and MXene supported it to further improve the thermal conductivity. The prepared polymer composite film is shown to provide through-plane and in-plane thermal conductivities of 1.51 and 4.28 W/mK at total filler contents of 44 wt.%. The composite film is also shown to exhibit a tensile strength of 11.96 MPa, which is much greater than that without MXene. Thus, it demonstrates that incorporating MXene as a thermally conductive filler can enhance the thermal and mechanical properties of composite films.

scholarly journals Aerogel Perfusion-Prepared h-BN/CNF Composite Film with Multiple Thermally Conductive Pathways and High Thermal Conductivity

Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 1051 ◽  
Author(s):  
Xiu Wang ◽  
Zhihuai Yu ◽  
Liang Jiao ◽  
Huiyang Bian ◽  
Weisheng Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Hexagonal Boron Nitride ◽  
Traditional Approach ◽  
Synthetic Polymer ◽  
Electrical Insulation ◽  
High Thermal Conductivity ◽  
Polymer Materials ◽  
Thermally Conductive ◽  
Electrical Insulation Properties

Hexagonal boron nitride (h-BN)-based heat-spreading materials have drawn considerable attention in electronic diaphragm and packaging fields because of their high thermal conductivity and desired electrical insulation properties. However, the traditional approach to fabricate thermally conductive composites usually suffers from low thermal conductivity, and cannot meet the requirement of thermal management. In this work, novel h-BN/cellulose-nano fiber (CNF) composite films with excellent thermal conductivity in through plane and electrical insulation properties are fabricated via an innovative process, i.e., the perfusion of h-BN into porous three dimensional (3D) CNF aerogel skeleton to form the h-BN thermally conductive pathways by filling the CNF aerogel voids. When at an h-BN loading of 9.51 vol %, the thermal conductivity of h-BN/CNF aerogel perfusion composite film is 1.488 W·m−1·K−1 at through plane, an increase by 260.3%. The volume resistivity is 3.83 × 1014 Ω·cm, superior to that of synthetic polymer materials (about 109~1013 Ω·cm). Therefore, the resulting h-BN/CNF film is very promising to replace the traditional synthetic polymer materials for a broad spectrum of applications, including the field of electronics.

Green reduction of graphene oxide by polydopamine to a construct flexible film: superior flame retardancy and high thermal conductivity

2017 ◽  
Vol 5 (35) ◽  
pp. 18542-18550 ◽  
Author(s):  
Fubin Luo ◽  
Kun Wu ◽  
Jun Shi ◽  
Xiangxiang Du ◽  
Xiaoya Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Flame Retardant ◽  
Flame Retardancy ◽  
Reducing Agent ◽  
High Thermal Conductivity ◽  
Flexible Film

Inspired by mussels, dopamine (DOPA) was used as a green reducing agent for graphene oxide (GO) to prepare a superior flame retardant and high thermal conductive flexible film.

scholarly journals Enhanced thermal conductivity of flexible h-BN/polyimide composites films with ethyl cellulose

e-Polymers ◽  
2019 ◽  
Vol 19 (1) ◽  
pp. 305-312 ◽  
Author(s):  
Lin Liu ◽  
Siyu Shen ◽  
Yiyao Wang
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Thermal Conduction ◽  
Ethyl Cellulose ◽  
Heat Dissipation ◽  
Hexagonal Boron Nitride ◽  
Flexible Substrate ◽  
Thermally Conductive ◽  
Polyimide Composites ◽  
Enhanced Thermal Conductivity

AbstractThe present work focuses on fabricating a flexible and thermally conductive PI composite film. The PI composite film was obtained by blending hexagonal boron nitride (h-BN) combined with ethyl cellulose and 2,2’-Bis(trifluoromethyl) benzidine (TFMB) functionalized GO (TFMB- GO) in polyimide (PI). The ethyl cellulose successfully formed the thermal conduction network by promoting the dispersion of h-BN in PI matrix. Thus, the thermal conductivity of the PI composite film with ethyl cellulose could be twice than PI film without ethyl cellulose. Besides, the PI composite film containing 30 wt% of h-BN could still exhibit excellent flexibility. Moreover, the combination of TFMB-GO could increase the tensile strength of the PI composite film by up to 80%. Overall, we provided a novel idea for the preparation of flexible substrate materials with efficient heat dissipation which was convenient and possible to apply widely in the industrial production.

scholarly journals Effect of Thermal Conductive Fillers on the Flame Retardancy, Thermal Conductivity, and Thermal Behavior of Flame-Retardant and Thermal Conductive Polyamide 6

Materials ◽  
2019 ◽  
Vol 12 (24) ◽  
pp. 4114 ◽  
Author(s):  
Fang Wang ◽  
Wenbo Shi ◽  
Yuliang Mai ◽  
Bing Liao
Keyword(s):  
Thermal Conductivity ◽  
Flame Retardant ◽  
Flame Retardancy ◽  
Combustion Process ◽  
Polyamide 6 ◽  
Gravimetric Analysis ◽  
Limiting Oxygen Index ◽  
Conductive Fillers ◽  
Ul 94 ◽  
The Impact

In this work, polyamide 6 (PA6) composites with improved flame retardancy and thermal conductivity were prepared with different thermal conductive fillers (TC fillers) such as aluminum nitride (AlN) and boron nitride (BN) in a PA6 matrix with aluminum diethylphosphinate (AlPi) as a fire retardant. The resultant halogen-free flame retardant (HFFR) and thermal conductive (TC) PA6 (HFFR-TC-PA6) were investigated in detail with a mechanical property test, a limiting oxygen index (LOI), the vertical burning test (UL-94), a cone calorimeter, a thermal gravimetric analysis (TGA) and differential scanning calorimetry (DSC). The morphology of the impact fracture surface and char residue of the composites were analyzed by scanning electron microscopy (SEM). It was found that the thermal conductivity of the HFFR-TC-PA6 composite increased with the amount of TC fillers. The TC fillers exerted a positive effect for flame retardant PA6. For example, the HFFR-TC-PA6 composites with the thickness of 1.6 mm successfully passed the UL-94 V-0 rating with an LOI of more than 29% when the loading amount of AlN-550RFS, BN-SW08 and BN-NW04 was 30 wt%. The morphological structures of the char residues revealed that TC fillers formed a highly integrated char layer surface (without holes) during the combustion process, as compared to that of flame retardant PA6/AlPi composites. In addition, the thermal stability and crystallization behavior of the composites were studied.

scholarly journals Robust Biomimetic Nacreous Aramid Nanofiber Composite Films with Ultrahigh Thermal Conductivity by Introducing Graphene Oxide and Edge-Hydroxylated Boron Nitride Nanosheet

Nanomaterials ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 2544
Author(s):  
Cenkai Xu ◽  
Chengmei Wei ◽  
Qihan Li ◽  
Zihan Li ◽  
Zongxi Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Boron Nitride ◽  
Composite Film ◽  
Performance Enhancement ◽  
Composite Films ◽  
Dielectric Materials ◽  
Boron Nitride Nanosheet ◽  
Brick And Mortar ◽  
Thermally Conductive

Dielectric materials with excellent thermally conductive and mechanical properties can enable disruptive performance enhancement in the areas of advanced electronics and high-power devices. However, simultaneously achieving high thermal conductivity and mechanical strength for a single material remains a challenge. Herein, we report a new strategy for preparing mechanically strong and thermally conductive composite films by combining aramid nanofibers (ANFs) with graphene oxide (GO) and edge-hydroxylated boron nitride nanosheet (BNNS-OH) via a vacuum-assisted filtration and hot-pressing technique. The obtained ANF/GO/BNNS film exhibits an ultrahigh in-plane thermal conductivity of 33.4 Wm−1K−1 at the loading of 10 wt.% GO and 50 wt.% BNNS-OH, which is 2080% higher than that of pure ANF film. The exceptional thermal conductivity results from the biomimetic nacreous “brick-and-mortar” layered structure of the composite film, in which favorable contacting and overlapping between the BNNS-OH and GO is generated, resulting in tightly packed thermal conduction networks. In addition, an outstanding tensile strength of 93.3 MPa is achieved for the composite film, owing to the special biomimetic nacreous structure as well as the strong π−π interactions and extensive hydrogen bonding between the GO and ANFs framework. Meanwhile, the obtained composite film displays excellent thermostability (Td = 555 °C, Tg > 400 °C) and electrical insulation (4.2 × 1014 Ω·cm). We believe that these findings shed some light on the design and fabrication of multifunctional materials for thermal management applications.

Enhanced thermal management performance of nanofibrillated cellulose composite with highly thermally conductive boron phosphide

2021 ◽  
Author(s):  
Jiajun Hu ◽  
Hongyan Xia ◽  
Xinguang Hou ◽  
Ting Yang ◽  
Kang Si ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Molten Salt ◽  
Thermal Management ◽  
Nanofibrillated Cellulose ◽  
Molten Salt Method ◽  
Boron Phosphide ◽  
Thermally Conductive ◽  
Conductive Fillers ◽  
Cellulose Composite

BP powders with high thermal conductivity were synthesized by a facile molten salt method and used as thermal conductive fillers to prepare nanofibrillated cellulose composite film with higher thermal conductivity.

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