scholarly journals Non-equilibrium thermal annealing of a polymer blend in bilayer settings for complex micro/nano-patterning

RSC Advances ◽  
2021 ◽  
Vol 11 (17) ◽  
pp. 10183-10193
Author(s):  
Ankur Pandey ◽  
Kaniska Murmu ◽  
Partho Sarathi Gooh Pattader

Fast morphological evolution of polymer blend dictated by underlying polymer thin film upon rapid thermal annealing at high temperature.

1995 ◽  
Vol 402 ◽  
Author(s):  
Takamaro Kikkawa ◽  
Isami Sakai

AbstractThis paper describes silicide and salicide technologies in Japan for 0.35 μm CMOS ULSIs and beyond. Polycide gate electrodes have been developed for CMOS devices from 1.0 μm to 0.35 μm design rule regime, in which Wsi2 has been used dominantly as a silicide gate material. On the other hand, silicide films are formed selectively on source/drain diffusion layers by salicide techniques, in which TiSi2 is used as a salicide material. TiSi2 is also used as a salicide material of both gate electrodes and source/drain diffusion layers for dual gate (n+/p+) CMOS. The TiSi2 thin film is formed by Ti sputtering and subsequent rapid thermal annealing. A preamorphization technique before Ti sputtering has been developed to obtain equal silicide properties on p+ and n+ diffusion layers. A high-temperature Ti sputtering technique has been developed in conjunction with pre-amorphization. CoSi2 and NiSi have also been developed as salicide materials for quartermicron CMOS and beyond.


2015 ◽  
Vol 66 (5) ◽  
pp. 721-725 ◽  
Author(s):  
Junghyup Hong ◽  
Woochool Jang ◽  
Hyoseok Song ◽  
Chunho Kang ◽  
Hyeongtag Jeon

2009 ◽  
Vol 55 (5(1)) ◽  
pp. 1925-1930 ◽  
Author(s):  
Duck-Kyun Choi ◽  
Chan Jun Park ◽  
Sung Bo Lee ◽  
Young-Woong Kim

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