The Defense Industry Initiative: From Business Conduct Program Innovator to Industry Standard?

2011 ◽  
pp. 123-160
Author(s):  
Andrea Bonime-Blanc
Keyword(s):  
Defense Industry ◽  
Industry Standard

The aspects of the innovation of the military-industrial complex and its significance for the national security of Russia

2020 ◽  
Vol 10 (1) ◽  
pp. 15-20
Author(s):  
Irina Orlova ◽  
Artem Sukharev ◽  
Maria Sukhareva ◽  
Mikhail Deikun
Keyword(s):  
National Security ◽  
Systematic Approach ◽  
Defense Industry ◽  
World Market ◽  
Modern World ◽  
High Tech ◽  
Industrial Complex ◽  
Military Industrial Complex ◽  
The Russian Federation ◽  
The Military

The main objective of the article is to substantiate a systematic approach to the introduction of all types of innovations in the development of the military-industrial complex of the Russian Federation. The relevance of the study is due to the fact that in the modern world it is especially important to ensure the national security of the country and the defense industry plays a crucial role in this. At the same time, one cannot but note the importance of the defense industry in the production of high-tech civilian products and dual-use products, which enhances the country's competitiveness in the world market. In addition, the relevance of the topic is due to the presence of rather serious problems in the Russian defense industry, which require immediate resolution. The article uses the methodology of structurally functional analysis, the institutional approach and the method of comparative assessments. The authors conclude that technological innovation alone will not be able to achieve strategic results for ensuring national security, only in conjunction with organizational, product, social and marketing innovations, the domestic defense industry is able to solve its tasks.

Ru Passivated and Ru Doped e-TaN surfaces as Combined Barrier and Liner Material for Copper Interconnects: A First Principles Study

2018 ◽  
Author(s):  
Suresh Natarajan ◽  
Cara-Lena Nies ◽  
Michael Nolan
Keyword(s):  
First Principles ◽  
Film Growth ◽  
Early Stage ◽  
Copper Interconnects ◽  
Liner Material ◽  
Critical Dimensions ◽  
Industry Standard ◽  
Cu Film ◽  
Improved Performance ◽  
And Diffusion

<div>As the critical dimensions of transistors continue to be scaled down to facilitate improved performance and device speeds, new ultrathin materials that combine diffusion barrier and seed/liner properties are needed for copper interconnects at these length scales. Ideally, to facilitate coating of high aspect ratio structures, this alternative barrier+liner material should only consist of one or as few layers as possible. We studied TaN, the current industry standard for Cu diffusion barriers, and Ru, which is a</div><div>suitable liner material for Cu electroplating, to explore how combining these two materials in a barrier+liner material influences the adsorption of Cu atoms in the early stage of Cu film growth. To this end, we carried out first-principles simulations of the adsorption and diffusion of Cu adatoms at Ru-passivated and Ru-doped e-TaN(1 1 0) surfaces. For comparison, we also studied the behaviour of Cu and Ru adatoms at the low index surfaces of e-TaN, as well as the interaction of Cu adatoms with the (0 0 1) surface of hexagonal Ru. Our results confirm the barrier and liner properties of TaN and Ru, respectively while also highlighting the weaknesses of both materials. Ru passivated TaN was found to have improved binding with Cu adatoms as compared to the bare TaN and Ru surfaces.</div><div>On the other hand, the energetic barrier for Cu diffusion at Ru passivated TaN surface was lower than at the bare TaN surface which can promote Cu agglomeration. For Ru-doped TaN however, a decrease in Cu binding energy was found in addition to favourable migration of the Cu adatoms toward the doped Ru atom and unfavourable migration away from it or into the bulk. This suggests that Ru doping sites in the TaN surface can act as nucleation points for Cu growth with high migration barrier preventing agglomeration and allow electroplating of Cu. Therefore Ru-doped TaN is proposed as a candidate for a combined barrier+liner material with reduced thickness.</div>

Evaluasi Telemarketing Kartu Kredit Bank Menggunakan Algoritma Genetika untuk Seleksi Fitur dan Naive Bayes

2020 ◽  
Vol 10 (1) ◽  
pp. 12
Author(s):  
Ekka Pujo Ariesanto Akhmad
Keyword(s):  
Data Mining ◽  
Naive Bayes ◽  
Naïve Bayes ◽  
Standard Process ◽  
Industry Standard

<strong> </strong>Bagian pemasaran bank sudah menampung data dari nasabah atau pelanggan bank dengan cara memasarkan atau mensosialisasikan kartu kredit lewat telepon (telemarketing). Evaluasi telemarketing kartu kredit yang sudah dilakukan bank masih kurang membawa hasil dan berdaya guna. Salah satu cara yang tepat untuk evaluasi laporan telemarketing kartu kredit bank adalah menggunakan teknik data mining. Tujuan penggunaan data mining untuk mengetahui kecenderungan dan pola nasabah yang berpeluang untuk berlangganan kartu kredit yang ditawarkan bank. Metode penelitian menggunakan Cross Industry Standard Process for Data Mining (CRISP-DM) dengan Algoritma Genetika untuk Seleksi Fitur (GAFS) dan Naive Bayes (NB). Hasil penelitian menunjukkan jumlah atribut pada dataset telemarketing kartu kredit bank sejumlah 15 atribut terdiri dari 14 atribut biasa dan 1 atribut spesial. Dataset telemarketing bank mengandung data berdimensi tinggi, sehingga diterapkan metode GAFS. Setelah menerapkan metode GAFS diperoleh 7 atribut optimal terdiri dari 6 atribut biasa dan 1 atribut spesial. Enam atribut biasa meliputi pekerjaan, balance, rumah, pinjaman, durasi, poutcome. Sedangkan atribut spesial adalah target. Hasil penelitian menunjukkan algoritma NB mempunyai nilai akurasi <em>86,71</em>%. Algoritma GAFS dan NB meningkatkan nilai akurasi menjadi <em>90,27</em>% untuk prediksi nasabah bank yang mengambil kartu kredit.

3D Integrated Power—A Discrete Perspective

2015 ◽  
Author(s):  
Ian Kearney ◽  
Stephen Brink
Keyword(s):  
Heat Dissipation ◽  
Automatic Test Equipment ◽  
Systematic Analysis ◽  
Power Mosfet ◽  
Root Cause ◽  
Industry Standard ◽  
Bona Fide ◽  
Process Issue ◽  
Board Level ◽  
3D Package

Abstract The shift in power conversion and power management applications to thick copper clip technologies and thinner silicon dies enable high-current connections (overcoming limitations of common wire bond) and enhance the heat dissipation properties of System-in-Package solutions. Powerstage innovation integrates enhanced gate drivers with two MOSFETs combining vertical current flow with a lateral power MOSFET. It provides a low on-resistance and requires an extremely low gate charge with industry-standard package outlines - a combination not previously possible with existing silicon platforms. These advancements in both silicon and 3D Multi-Chip- Module packaging complexity present multifaceted challenges to the failure analyst. The various height levels and assembly interfaces can be difficult to deprocess while maintaining all the critical evidence. Further complicating failure isolation within the system is the integration of multiple chips, which can lead to false positives. Most importantly, the discrete MOSFET all too often gets overlooked as just a simple threeterminal device leading to incorrect deductions in determining true root cause. This paper presents the discrete power MOSFET perspective amidst the competing forces of the system-to-board-level failure analysis. It underlines the requirement for diligent analysis at every step and the importance as an analyst to contest the conflicting assumptions of challenging customers. Automatic Test Equipment (ATE) data-logs reported elevated power MOSFET leakage. Initial assumptions believed a MOSFET silicon process issue existed. Through methodical anamnesis and systematic analysis, the true failure was correctly isolated and the power MOSFET vindicated. The authors emphasize the importance of investigating all available evidence, from a macro to micro 3D package perspective, to achieve the bona fide path forward and true root cause.

Machine Learning Based Predictive Action on Categorical Non-Sequential Data

2020 ◽  
Vol 13 (5) ◽  
pp. 1020-1030
Author(s):  
Pradeep S. ◽  
Jagadish S. Kallimani
Keyword(s):  
Machine Learning ◽  
Data Analysis ◽  
Categorical Data ◽  
Numerical Data ◽  
Processing Technique ◽  
Machine Learning Algorithms ◽  
Sequential Data ◽  
Industry Standard ◽  
Robust Model ◽  
Future Work

Background: With the advent of data analysis and machine learning, there is a growing impetus of analyzing and generating models on historic data. The data comes in numerous forms and shapes with an abundance of challenges. The most sorted form of data for analysis is the numerical data. With the plethora of algorithms and tools it is quite manageable to deal with such data. Another form of data is of categorical nature, which is subdivided into, ordinal (order wise) and nominal (number wise). This data can be broadly classified as Sequential and Non-Sequential. Sequential data analysis is easier to preprocess using algorithms. Objective: The challenge of applying machine learning algorithms on categorical data of nonsequential nature is dealt in this paper. Methods: Upon implementing several data analysis algorithms on such data, we end up getting a biased result, which makes it impossible to generate a reliable predictive model. In this paper, we will address this problem by walking through a handful of techniques which during our research helped us in dealing with a large categorical data of non-sequential nature. In subsequent sections, we will discuss the possible implementable solutions and shortfalls of these techniques. Results: The methods are applied to sample datasets available in public domain and the results with respect to accuracy of classification are satisfactory. Conclusion: The best pre-processing technique we observed in our research is one hot encoding, which facilitates breaking down the categorical features into binary and feeding it into an Algorithm to predict the outcome. The example that we took is not abstract but it is a real – time production services dataset, which had many complex variations of categorical features. Our Future work includes creating a robust model on such data and deploying it into industry standard applications.

РАЗВИТИЕ ПРОДУКЦИИ ГРАЖДАНСКОГО И ДВОЙНОГО ПРИМЕНЕНИЯ АО «ЗПП»: КОНТАКТНЫЕ УСТРОЙСТВА, ОСНАСТКА

2020 ◽  
Vol 96 (3s) ◽  
pp. 480-482
Author(s):  
А.А. Грибин
Keyword(s):  
Defense Industry ◽  
Industrial Enterprise ◽  
Consumer Market ◽  
Domestic Industry

Рассмотрены тенденции диверсификации производств предприятий ОПК. Определена проблематика выхода на потребительский рынок для отечественной промышленности. Представлены результаты успешно реализуемых проектов отечественного промышленного предприятия: разработка и производство контактных устройств для тестирования ЭКБ, изготовление оснастки. The paper considers the trends of diversification production of defense industry enterprises, as well as identifies the problems of entering the consumer market for domestic industry. Besides, it presents the results of successfully implemented projects of a domestic industrial enterprise: the development and production of test sockets, the equipment.

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