Epitaxial growth of lead zirconium titanate thin films on Ag buffered Si substrates using rf sputtering

2007 ◽  
Vol 90 (17) ◽  
pp. 172903 ◽  
Author(s):  
Chun Wang ◽  
David E. Laughlin ◽  
Mark H. Kryder
2001 ◽  
Vol 40 (Part 1, No. 2A) ◽  
pp. 713-717 ◽  
Author(s):  
Sriram Kalpat ◽  
X. Du ◽  
Issac R. Abothu ◽  
Akira Akiba ◽  
Hiroshi Goto ◽  
...  

1999 ◽  
Vol 604 ◽  
Author(s):  
S. Kalpat ◽  
X. Du ◽  
I.R. Abothu ◽  
A. Akiba ◽  
H. Goto ◽  
...  

AbstractHighly (100) and (111) oriented lead zirconium titanate (PZT) thin films have been grown by using reactive rf-sputtering. PZT thin films with rhombohedral composition have been grown in different orientations using selective rapid thermal annealing cycles. The polarization versus electric field curves and the resistivity of the films were measured using a standardized RT66A ferroelectric test system. The dielectric constant and the loss were determined using an impedence analyzer. The PZT(100) oriented films showed larger dielectric constant and loss than the PZT(111) films. The PZT(100) films possessed sharper square-like hysteresis loops compared to the PZT(111) films, as expected from our phenomenological calculations.


2004 ◽  
Vol 264 (1-3) ◽  
pp. 463-467 ◽  
Author(s):  
D. Akai ◽  
K. Hirabayashi ◽  
M. Yokawa ◽  
K. Sawada ◽  
M. Ishida

1999 ◽  
Vol 74 (12) ◽  
pp. 1743-1745 ◽  
Author(s):  
J. Fontcuberta ◽  
M. Bibes ◽  
B. Martínez ◽  
V. Trtik ◽  
C. Ferrater ◽  
...  

2002 ◽  
Vol 415 (1-2) ◽  
pp. 272-275 ◽  
Author(s):  
J Tashiro ◽  
A Sasaki ◽  
S Akiba ◽  
S Satoh ◽  
T Watanabe ◽  
...  

2008 ◽  
Vol 516 (18) ◽  
pp. 6052-6057 ◽  
Author(s):  
Omar Zohni ◽  
Gregory Buckner ◽  
Taeyun Kim ◽  
Angus Kingon ◽  
Jeff Maranchi ◽  
...  

2012 ◽  
Vol 26 (31) ◽  
pp. 1250137 ◽  
Author(s):  
M. AMIRHOSEINY ◽  
Z. HASSAN ◽  
S. S. NG ◽  
L. S. CHUAH ◽  
M. A. AHMAD ◽  
...  

We have fabricated photoconductors of indium nitride (InN) grown by radio frequency (RF) sputtering. The InN thin films were deposited on Si (100), Si (110) and Si (111) substrates at room temperature. The Ag/Al contact has been deposited by thermal evaporation in vacuum (10-5 Torr ) and then annealed under the flowing of the nitrogen gas environment in order to relieve stress and also induce any favorable reactions between metals and the semiconductor. Current–voltage (I–V) measurements after heat treatment at 400°C were carried out for samples in dark and illumination conditions. It was found that Ag/Al formed a good ohmic contact on top of InN . In addition, the characteristics of the contacts were significantly affected by the orientation of substrates.


1977 ◽  
Vol 14 (1) ◽  
pp. 114-114
Author(s):  
J. E. Greene ◽  
C. E. Wickersham ◽  
J. L. Zilko

2011 ◽  
Vol 110 (2) ◽  
pp. 024114 ◽  
Author(s):  
C. Ostos ◽  
O. Raymond ◽  
N. Suarez-Almodovar ◽  
D. Bueno-Baqués ◽  
L. Mestres ◽  
...  

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