Development of Direct Printing/Curing Process for 3D Structural Electronics

2013 ◽  
Author(s):  
Yanfeng Lu ◽  
Morteza Vatani ◽  
Ho-Chan Kim ◽  
Rae-Chan Lee ◽  
Jae-Won Choi
Keyword(s):  
Tool Path ◽  
Electronic Circuit ◽  
3D Structure ◽  
Radiation Energy ◽  
New Paradigm ◽  
Direct Printing ◽  
Pick And Place ◽  
Structural Electronics ◽  
3D Structural Electronics ◽  
Electrical Components

3D structural electronics is a new paradigm in fabricating electronics with high design complexity. Basically, manufacturing of 3D structural electronics consists of several processes: structure building, wire creation, and pick-and-place of electrical components. In this work, a 3D structure was built in a commercial AM machine, and conductive wires were created on the 3D structure with a predetermined design of an electronic circuit. Generally, 2D wire paths are projected to a 3D surface, and a tool path for the wire is generated in advance. And a direct printing device follows the tool path to draw the conductive wires on the surface, while a direct curing device simultaneously hardens the created wires using thermal/radiation energy. This direct printing/curing device was developed by combining a micro-dispensing device and a light focusing module installed in a motorized xyz stage. Several experiments were accomplished using photocrosslinkable materials filled with carbon nanotubes (CNTs). Finally, a 3D electronics prototype was fabricated to show the compelling evidence that the suggested manufacturing methods and materials would be promising in manufacturing 3D structural electronics.

scholarly journals Electrospun Three-Dimensional Nanofibrous Structure via Probe Arrays Inducing

Micromachines ◽  
2018 ◽  
Vol 9 (9) ◽  
pp. 427 ◽  
Author(s):  
Yifang Liu ◽  
Ruimin Liu ◽  
Xiang Wang ◽  
Jiaxin Jiang ◽  
Wenwang Li ◽  
...  
Keyword(s):  
Flow Rate ◽  
Applied Voltage ◽  
3D Structure ◽  
Three Dimensional ◽  
Development Trend ◽  
Processing Parameters ◽  
Industrial Applications ◽  
Nano Fabrication ◽  
Direct Printing ◽  
Deposition Area

The fast and precise direct-printing of micro three-dimensional (3D) structures is the important development trend for micro/nano fabrication technique. A novel method with probe arrays was built up to realize the controllable deposition of 3D electrospun nanofibrous structures. Firstly, several 3D nanofibrous structures were built on a single probe and 2-, 3-probes, which indicated that the probe height and probe interval played a key role on the 3D structure morphology. Then, different stereo nanofibrous structures based on multiprobe arrays were achieved accurately and the effects of processing parameters, including the probe height, probe interval, applied voltage and flow rate on the deposition behaviors of electrospun nanofiber over the probe arrays were investigated. The deposition area of 3D electrospun nanofibrous structures decreased with the increase of probe interval, applied voltage, and flow rate. Several 3D nanofibrous structures of special shapes including convex, triangle wave, inverted cone and complex curved surface were demonstrated by controlling the configuration of probe arrays and electrospinning parameters. This work provides an effective and simple way for the construction of 3D electrospun nanofibrous structures, which has great potentials in various medical and industrial applications.

Self-Assembly for Three Dimensional Integration of Functional Electrical Components

2005 ◽  
Author(s):  
Andrew H. Cannon ◽  
Yueming Hua ◽  
Clifford L. Henderson ◽  
William P. King
Keyword(s):  
Self Assembly ◽  
Manufacturing Process ◽  
Three Dimensional ◽  
Electronic Components ◽  
Active Components ◽  
Power Sources ◽  
Electrical Interconnects ◽  
Pick And Place ◽  
Pmma Surface ◽  
Electrical Components

Current microelectronics manufacturing and packaging rely on pick-and-place methods, a serial manufacturing process. Self-Assembly (SA) is a parallel manufacturing process that can be three dimensional and as such could improve the manufacture of systems that require diverse integration of sensors, actuators, electronics, and power sources. This paper describes SA of millimeter-scale parts in which functional electronic components and electrical interconnects were cast into 5 mm cubes of Polymethylmethacrylate (PMMA). Surface forces induced both gross and fine alignment of the cubes. The cubes were bonded using low-melting temperature solder (47°C), resulting in a self-assembled three dimensional circuit. This technique could be expanded for assembly of systems having more than 104 components. The ultimate goal is to combine a large number of diverse active components to allow the manufacture of systems having dense integrated functionality.

scholarly journals Dynamics and Robust Control of a New Realizable Chaotic Nonlinear Model

Complexity ◽  
2021 ◽  
Vol 2021 ◽  
pp. 1-17
Author(s):  
M. Higazy ◽  
Emad E. Mahmoud ◽  
E. M. Khalil ◽  
S. Abdel-Khalek ◽  
S. M. Abo-Dahab ◽  
...  
Keyword(s):  
Genetic Algorithm ◽  
Graph Theory ◽  
Robust Control ◽  
Electronic Circuit ◽  
Signal Flow Graph ◽  
New Paradigm ◽  
Robust Controller ◽  
Flow Graph ◽  
System States ◽  
New System

We present a new viable nonlinear chaotic paradigm. This paradigm has four nonlinear terms. The essential features of the new paradigm have been investigated. Our new system is confirmed to have chaotic behaviors by calculating its Lyapunov exponents. The relations of the system states are displayed by a suggested new signal flow graph (SFG). The proposed SFG is discussed via some graph theory tools, and some of its hidden features are calculated. In addition, the system is realized via constructing its electronic circuit which helps in the real applications. Also, a robust controller for the system is designed with the aid of a genetic algorithm.

An Electromagnetic Sensing Method (ESM) to Detect the Short-Circuit in PCB

2013 ◽  
Vol 284-287 ◽  
pp. 446-450
Author(s):  
Chien Hung Chen ◽  
Jyi Jinn Chang ◽  
Tai Shan Liao ◽  
Kuo Cheng Huang
Keyword(s):  
Electronic Circuit ◽  
Short Circuit ◽  
Common Error ◽  
Electromagnetic Sensing ◽  
Fast Development ◽  
Space Limitation ◽  
Electromagnetic Signals ◽  
Working Distance ◽  
Electrical Components ◽  
Automatic Positioning

The short-circuit phenomenon is one common error in the operation of electronic circuit. Short-circuit will cause the electrical components damage and the incorrect function in PCB. In general, the detection of short-circuit is performed by using the electrode probe to contact each pad in single PCB or the probe card in mass production of PCD. Due to the fast development of circuit layout, the size of IC with pads is getting smaller; therefore, it is much difficult to detect short-circuit in PCB by the pads-contact inspection. This paper presents a method to detect short-circuit area in PCB without the use of electrode probe, which employs the electromagnetic signals to sense and identify the change of electromagnetic induced by short-circuit. We design an electromagnetic sensing probe which comprises of an equivalent circuit to detect the change of electromagnetism in PCB, and employ an X-Y table for automatic positioning. Instead of tiny electrode probe manufacturing, the electromagnetic sensing method (ESM) is able to detect the short-circuit area inside the multi-layer PCB. In addition, the inspective module with ESM can be designed to be a portable instrument without the space limitation. The article shows the verification of proposed system with the scanning pitch is from 5 to 20 mil line width, the working distance of sensing probe is from 1 to 20 mm, and 4 layers PCB measurement. We also experiment the real case detection by using the ESM in PCB and display ESM can successful indicate the probable area of short-circuit.

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
David A. Roberson ◽  
Ryan B. Wicker ◽  
Eric MacDonald
Keyword(s):  
Selection Process ◽  
Three Dimensional ◽  
Processing Parameters ◽  
Substrate Material ◽  
Direct Write ◽  
Conductive Inks ◽  
Structural Electronics ◽  
3D Structural Electronics ◽  
Substrate Resistance ◽  
Polymeric Substrates

Ohmic curing was utilized as a method to improve the conductivity of three-dimensional (3D) interconnects printed from silver-loaded conductive inks and pastes. The goal was to increase conductivity of the conductive path without inducing damage to the substrate. The 3D via/interconnect structure was routed within 3D polymeric substrates and had external and internal sections. The 3D structures were created by the additive manufacturing (AM) process of stereolithography (SL) and were designed to replicate manufacturing situations which are common in the fabrication of 3D structural electronics that involve a combination of AM and direct write (DW) processing steps. The photocurable resins the 3D substrates were made of possessed glass transition temperatures of 75 °C and 42 °C meaning that a nonthermal method to increase the conductivity of the printed traces was needed as the conductive inks tested in this study required oven cure temperatures greater than 100 °C to perform properly. Ohmic curing was shown to decrease the measured resistance of the via/interconnect structure without harming the substrate. Substrate damage was observed on thermally cured samples and was characterized by discoloration and scaling of the substrate. Resistance measurements of the via/interconnect structures revealed samples cured by the ohmic curing process performed equal or better than samples subjected to thermal curing. The work presented here demonstrates a method to overcome the thermal cure temperature limitations of polymeric substrates imposed on the processing parameters of conductive inks during the fabrication of 3D structural electronics and presents an example of overcoming a manufacturing process problem associated with this emerging technology. An ink selection process involving characterization of the compatibility of inks with the substrate material and the use of different inks for the via and interconnect sections was also discussed.

scholarly journals CryoGAN: A New Reconstruction Paradigm for Single-Particle Cryo-EM via Deep Adversarial Learning

2020 ◽  
Author(s):  
Harshit Gupta ◽  
Michael T. McCann ◽  
Laurène Donati ◽  
Michael Unser
Keyword(s):  
Single Particle ◽  
3D Structure ◽  
User Interaction ◽  
Real Data ◽  
New Paradigm ◽  
Contrast Transfer Function ◽  
Generative Adversarial Network ◽  
Volume Estimate ◽  
Adversarial Learning ◽  
Adversarial Network

We present CryoGAN, a new paradigm for single-particle cryo-EM reconstruction based on unsupervised deep adversarial learning. The major challenge in single-particle cryo-EM is that the imaged particles have unknown poses. Current reconstruction techniques are based on a marginalized maximum-likelihood formulation that requires calculations over the set of all possible poses for each projection image, a computationally demanding procedure. CryoGAN sidesteps this problem by using a generative adversarial network (GAN) to learn the 3D structure that has simulated projections that most closely match the real data in a distributional sense. The architecture of CryoGAN resembles that of standard GAN, with the twist that the generator network is replaced by a model of the cryo-EM image acquisition process. CryoGAN is an unsupervised algorithm that only demands projection images and an estimate of the contrast transfer function parameters. No initial volume estimate or prior training is needed. Moreover, CryoGAN requires minimal user interaction and can provide reconstructions in a matter of hours on a high-end GPU. In addition, we provide sound mathematical guarantees on the recovery of the correct structure. CryoGAN currently achieves a 8.6 Å resolution on a realistic synthetic dataset. Preliminary results on real β-galactosidase data demonstrate CryoGAN’s ability to exploit data statistics under standard experimental imaging conditions. We believe that this paradigm opens the door to a family of novel likelihood-free algorithms for cryo-EM reconstruction.

scholarly journals Cone-Beam Breast Computed Tomography: Time for a New Paradigm in Breast Imaging

2021 ◽  
Vol 10 (21) ◽  
pp. 5135
Author(s):  
Avice M. O'Connell ◽  
Thomas J. Marini ◽  
Daniel T. Kawakyu-O'Connor
Keyword(s):  
Computed Tomography ◽  
Breast Imaging ◽  
3D Structure ◽  
Contrast Material ◽  
Cone Beam ◽  
New Paradigm ◽  
New Era ◽  
Dense Breast Tissue ◽  
Breast Compression ◽  
Breast Computed Tomography

It is time to reconsider how we image the breast. Although the breast is a 3D structure, we have traditionally used 2D mammography to perform screening and diagnostic imaging. Mammography has been continuously modified and improved, most recently with tomosynthesis and contrast mammography, but it is still using modifications of compression 2D mammography. It is time to consider 3D imaging for this 3D structure. Cone-beam breast computed tomography (CBBCT) is a revolutionary modality that will assist in overcoming the limitations of current imaging for dense breast tissue and overlapping structures. It also allows easy administration of contrast material for functional imaging. With a radiation dose on par with diagnostic mammography, rapid 10 s acquisition, no breast compression, and true high-resolution isotropic imaging, CBBCT has the potential to usher in a new era in breast imaging. These advantages could translate into lower morbidity and mortality from breast cancer.

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