Computing method of thermal conductivity of heat dissipation vias in printed circuit board and its optimization

Circuit World ◽  
2015 ◽  
Vol 41 (1) ◽  
pp. 14-19 ◽  
Author(s):  
Shuo Xiao ◽  
Yang Zhao ◽  
Yuan Cao ◽  
Haifeng Jiang ◽  
Wenliang Zhu
Keyword(s):  
Thermal Conductivity ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Research Result ◽  
Circuit Board ◽  
Computational Formula ◽  
Filling Material ◽  
Content Type ◽  
Printed Circuit

Purpose – This paper aims to deduce a set of theory computational formula, and optimize and improve the heat conductivity of vias in printed circuit boards of electrical power apparatus. Design/methodology/approach – The authors adopted numerical simulation and experimental measurement to verify the reliability of this formula. Findings – Research result showed that 0.45 mm was the optimal bore diameter of vias; the conductivity had no obvious improvement when filling material was FR4 or Rogers, but if it was filled with texture of high thermal conductivity like soldering tine, the conductivity would improve a lot; the plating thickness of vias had a greater influence on thermal conductivity. Originality/value – Through the theory computational formula, this paper studied the influence of aperture of vias, filled materials and thickness of copper plated on vias on thermal conductivity.

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Circuit World ◽  
2016 ◽  
Vol 42 (1) ◽  
pp. 32-36 ◽  
Author(s):  
Michal Baszynski ◽  
Edward Ramotowski ◽  
Dariusz Ostaszewski ◽  
Tomasz Klej ◽  
Mariusz Wojcik ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Electronic Device ◽  
Circuit Board ◽  
New Materials ◽  
Content Type ◽  
Printed Circuit

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

2017 ◽  
Vol 29 (1) ◽  
pp. 34-41 ◽  
Author(s):  
Attila Geczy ◽  
Daniel Nagy ◽  
Balazs Illes ◽  
Laszlo Fazekas ◽  
Oliver Krammer ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Vapour Phase ◽  
Circuit Board ◽  
Efficient Production ◽  
Content Type ◽  
Printed Circuit ◽  
Heat Transfer Efficiency ◽  
Uneven Heating

Purpose The paper aims to present an investigation of heating during vapour phase soldering (VPS) on inclined printed circuit board (PCB) substrates. The PCB is a horizontal rectangular plate from the aspect of filmwise condensation with a given inclination setting. Design/methodology/approach The paper focuses on the measurement of temperature distribution on the PCBs with a novel setup immersed in the saturated vapour space. The measuring instrumentation is optimized to avoid and minimize vapour perturbing effects. Findings The inhomogeneity of the heating is presented according to the lateral dimensions of the PCB. The inclination improves temperature uniformity, improves heat transfer efficiency; however, a minor misalignment may affect the flow and result in uneven heating. Practical implications The results can be implemented for practical improvements in industrial ovens with the use of intended inclination. The improvements may consequently point to more efficient production and better joint quality. Originality/value The novel method can be used for deeper investigation of inclination during and can be complemented with numerical calculations. The results highlight the importance of precise PCB holding instrumentation in VPS ovens.

scholarly journals Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 55-60 ◽  
Author(s):  
Yuanming Chen ◽  
Shouxu Wang ◽  
Xuemei He ◽  
Wei He ◽  
Vadim V. Silberschmidt ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Thermal Simulation ◽  
Circuit Board ◽  
Reflow Soldering ◽  
Content Type ◽  
Printed Circuit ◽  
Flatness Control ◽  
Copper Coin

Purpose – The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation. Design/methodology/approach – Manufacturing optimization of copper coin-embedded PCB involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper coin-embedded PCB. Findings – The copper coin-embedded PCB had good agreement with resin flush removal and flatness control. Thermal simulation results indicated that copper coin could significantly enhance the heat-dissipation rate by means of a direct contact with the high-power integrated circuit chip. The copper coin-embedded PCB exhibited a reliable structure capable of withstanding high-temperature reflow soldering and high thrust testing. Originality/value – The use of a copper coin-embedded PCB could lead to higher heat dissipation for the stable performance of high-power electronic components. The copper coin-embedded method could have important potential for improving the design for heat dissipation in the PCB industry.

Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approach

2018 ◽  
Vol 30 (3) ◽  
pp. 171-181 ◽  
Author(s):  
Mohammad Gharaibeh
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Axial Strain ◽  
Mechanical Vibration ◽  
Factorial Analysis ◽  
Circuit Board ◽  
Electronic Packages ◽  
Content Type ◽  
Printed Circuit ◽  
Reliability Performance

Purpose This paper aims to present a reliability performance assessment of electronic packages subjected to harmonic vibration loadings by using a statistical factorial analysis technique. The effects of various geometric parameters, the size and thickness of the printed circuit board and component and solder interconnect dimensions on the fundamental resonant frequency of the assembly and the axial strain of the most critical solder joint were thoroughly investigated. Design/methodology/approach A previously published analytical solution for the problem of electronic assembly vibration was adopted. This solution was modified and used to generate the natural frequency and solder axial strains data for various package geometries. Statistical factorial analysis was used to analyze these data. Findings The results of the present study showed that the reliability of electronic packages under vibration could be significantly enhanced by selecting larger and thicker printed circuit boards and thinner and smaller electrical components. Additionally, taller and thinner solders might also produce better reliability behavior. Originality/value The results of this investigation can be very useful in the design process of electronic products in mechanical vibration environments.

Computational Modeling of Anisotropic Thermal Conductivity and Joule Heating on Printed Circuit Boards

2011 ◽  
Author(s):  
M. Baris Dogruoz ◽  
Gokul Shankaran ◽  
Gregory Pitner ◽  
Manoj Nagulapally
Keyword(s):  
Thermal Conductivity ◽  
Joule Heating ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Dielectric Material ◽  
Circuit Board ◽  
System Level ◽  
Field Equations ◽  
Printed Circuit ◽  
Anisotropic Thermal Conductivity

A printed circuit board (PCB) consists of consecutive layers of dielectric material and current carrying traces and vias. Conducting system level simulations of PCB’s with detailed trace and via geometries is computationally very expensive. In the present study, the effects of the trace and via geometry in the physical model are taken into account by importing the corresponding ECAD data with which locally varying anisotrpoic thermal conductivity on the PCB is determined accordingly. Moreover, the effects of Joule heating in the current carrying traces are included by using a number of planar heat sources representing individual metal trace layers. The powermap on each of these layers is determined by solving the relevant electric field equations where the temperature dependency of the electrical field is also taken into account. The results are presented on a sample PCB and comparisons are made with the previous studies and conventional models. It is demonstrated that temperature values differ substantially depending on the method of Joule heating treatment used.

Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures

1996 ◽  
Author(s):  
P. Singh ◽  
G.T. Galyon ◽  
J. Obrzut ◽  
W.A. Alpaugh
Keyword(s):  
Experimental Data ◽  
Thermal Degradation ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Elevated Temperatures ◽  
Dielectric Breakdown ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Data Matching

Abstract A time delayed dielectric breakdown in printed circuit boards, operating at temperatures below the epoxy resin insulation thermo-electrical limits, is reported. The safe temperature-voltage operating regime was estimated and related to the glass-rubber transition (To) of printed circuit board dielectric. The TG was measured using DSC and compared with that determined from electrical conductivity of the laminate in the glassy and rubbery state. A failure model was developed and fitted to the experimental data matching a localized thermal degradation of the dielectric and time dependency. The model is based on localized heating of an insulation resistance defect that under certain voltage bias can exceed the TG, thus, initiating thermal degradation of the resin. The model agrees well with the experimental data and indicates that the failure rate and truncation time beyond which the probability of failure becomes insignificant, decreases with increasing glass-rubber transition temperature.

scholarly journals Estimating Recycling Return of Integrated Circuits Using Computer Vision on Printed Circuit Boards

2021 ◽  
Vol 11 (6) ◽  
pp. 2808
Author(s):  
Leandro H. de S. Silva ◽  
Agostinho A. F. Júnior ◽  
George O. A. Azevedo ◽  
Sergio C. Oliveira ◽  
Bruno J. T. Fernandes
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronic Waste ◽  
Decision Criterion ◽  
Economic Feasibility ◽  
Electronic Equipment ◽  
Circuit Board ◽  
Mechanical Recycling ◽  
Printed Circuit

The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC’s weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB’s ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs’ ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.

scholarly journals A Study on the Radiated Susceptibility of Printed Circuit Boards and the Effects of Via Fencing

Electronics ◽  
2021 ◽  
Vol 10 (5) ◽  
pp. 539
Author(s):  
Ryan P. Tortorich ◽  
William Morell ◽  
Elizabeth Reiner ◽  
William Bouillon ◽  
Jin-Woo Choi
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Ground Plane ◽  
Circuit Board ◽  
Electronic Systems ◽  
Coupling Mechanism ◽  
Electromagnetic Modeling ◽  
Printed Circuit ◽  
Edge Radiation ◽  
Area Of Concern

Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) environments, there is growing interest in understanding how electronic systems are affected by such environments. Backdoor coupling in particular is an area of concern for all electronics, but there is limited understanding about the mechanisms behind backdoor coupling. In this work, we present a study on printed circuit board (PCB) backdoor coupling and the effects of via fencing. Existing work focuses on ideal stackups and indicates that edge radiation is significantly reduced by via fencing. In this study, both full wave electromagnetic modeling and experimental verification are used to investigate both ideal and practical PCB stackups. In the ideal scenario, we find that via fencing substantially reduces coupling, which is consistent with prior work on emissions. In the practical scenario, we incorporate component footprints and traces which naturally introduce openings in the top ground plane. Both simulation and experimental data indicate that via fencing in the practical scenario does not substantially mitigate coupling, suggesting that PCB edge coupling is not the dominant coupling mechanism, even at varying angles of incidence and polarization.

Robotic system design and development for automated dismantling of PCB waste

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Ioan Doroftei ◽  
Daniel Chirita ◽  
Ciprian Stamate ◽  
Stelian Cazan ◽  
Carlos Pascal ◽  
...  
Keyword(s):  
Design Methodology ◽  
Printed Circuit Board ◽  
Vision System ◽  
Electronic Waste ◽  
Robotic System ◽  
Circuit Board ◽  
Short Introduction ◽  
Content Type ◽  
Printed Circuit ◽  
System A

Purpose The mass electronics sector is one of the most critical sources of waste, in terms of volume and content with dangerous effects on the environment. The purpose of this study is to provide an automated and accurate dismantling system that can improve the outcome of recycling. Design/methodology/approach Following a short introduction, the paper details the implementation layout and highlights the advantages of using a custom architecture for the automated dismantling of printed circuit board waste. Findings Currently, the amount of electronic waste is impressive while manual dismantling is a very common and non-efficient approach. Designing an automatic procedure that can be replicated, is one of the tasks for efficient electronic waste recovery. This paper proposes an automated dismantling system for the advanced recovery of particular waste materials from computer and telecommunications equipment. The automated dismantling architecture is built using a robotic system, a custom device and an eye-to-hand configuration for a stereo vision system. Originality/value The proposed approach is innovative because of its custom device design. The custom device is built using a programmable screwdriver combined with an innovative rotary dismantling tool. The dismantling torque can be tuned empirically.

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