Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film
2000 ◽
Vol 23
(3)
◽
pp. 171-176
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2009 ◽
Vol 32
(2)
◽
pp. 339-346
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Keyword(s):
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2005 ◽
Vol 34
(11)
◽
pp. 1455-1461
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2012 ◽
Vol 52
(6)
◽
pp. 1174-1181
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1999 ◽
Vol 22
(4)
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pp. 575-581
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2015 ◽
Vol 36
(7)
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pp. 702-704
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2003 ◽
Vol 2003.16
(0)
◽
pp. 675-676
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