Thermal design of heat spreader and analysis of thermal interface materials (TIM) for multi-chip package

2003 ◽  
Author(s):  
D. Pinjala ◽  
N. Khan ◽  
Xie Ling ◽  
Poi-Siong Teo ◽  
E.H. Wong ◽  
...  
Keyword(s):  
Thermal Design ◽  
Thermal Interface Materials ◽  
Heat Spreader ◽  
Thermal Interface ◽  
Interface Materials

Surface Chemistry and Characteristics Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials

2001 ◽  
Vol 123 (5) ◽  
pp. 969-975 ◽  
Author(s):  
Ravi S. Prasher
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Materials ◽  
Heat Spreader ◽  
Thermal Interface ◽  
Thermal Solution ◽  
Interface Materials

Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in flip chip technology utilizes two levels of thermal interface materials: between the die and the heat spreader, and between the heat spreader and the heat sink. Phase change materials and thermal greases are among the most prominent interstitial thermal interface materials (TIM) used in electronic packaging. These TIMs are typically polymeric matrix loaded with highly conducting filler particles. The dwindling thermal budget has necessitated a better understanding of the thermal resistance of each component of the thermal solution. Thermal conductivity of these particle-laden materials is better understood than their contact resistance. A careful review of the literature reveals the lack of analytical models for the prediction of contact resistance of these types of interstitial materials, which possess fluidic properties. This paper introduces an analytical model for the thermal contact resistance of these types of interstitial materials. This model is compared with the experimental data obtained on the contact resistance of these TIMs. The model, which depends on parameters such as, surface tension, contact angle, thermal conductivity, roughness and pressure matches very well with the experimental data at low pressures and is still within the error bars at higher pressures.

Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials

2003 ◽  
Author(s):  
Ravi S. Prasher ◽  
Jim Shipley ◽  
Suzana Prstic ◽  
Paul Koning ◽  
Jin-Lin Wang
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Volume Fraction ◽  
Applied Pressure ◽  
Electronics Cooling ◽  
Thermal Design ◽  
Thermal Interface Materials ◽  
Particle Volume ◽  
Thermal Interface ◽  
Interface Materials

Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research has primarily dealt with the understanding of the thermal conductivity of these types of TIMs. For thermal design, reduction of the thermal resistance is the end goal. Thermal resistance is not only dependent on the thermal conductivity, but also on the bond line thickness (BLT) of these TIMs. It is not clear which material property(s) of these particle laden TIMs affects the BLT and eventually the thermal resistance. This paper introduces a rheology based semi-empirical model for the prediction of the BLT of these TIMs. BLT depends on the yield stress of the particle laden polymer and the applied pressure. The BLT model combined with the thermal conductivity model can be used for modeling the thermal resistance of these TIMs for factors such as particle volume faction, particle shape, base polymer viscosity, etc. This paper shows that there exists an optimal filler volume fraction at which thermal resistance is minimum. Finally this paper develops design rules for the optimization of thermal resistance for particle laden TIMs.

Hierarchical Modeling and Trade-Off Studies in Design of Thermal Interface Materials

2005 ◽  
Author(s):  
X. Zhang ◽  
S. Kanuparthi ◽  
G. Subbarayan ◽  
B. Sammakia ◽  
S. Tonapi
Keyword(s):  
Thermal Conductivity ◽  
Effective Thermal Conductivity ◽  
Volume Fraction ◽  
Particle Volume Fraction ◽  
Thermal Interface Materials ◽  
Particle Volume ◽  
Heat Spreader ◽  
Thermal Interface ◽  
Volume Fractions ◽  
Interface Materials

Particle laden polymer composites are widely used as thermal interface materials in the electronics cooling industry. The projected small chip-sizes and high power applications in the near future demand higher values of effective thermal conductivity of the thermal interface materials (TIMs) used between the chip and the heat-spreader and the heat-spreader and heat-sink. However, over two decades of research has not yielded materials with significantly improved effective thermal conductivities. A critical need in developing these TIMs is apriori modeling using fundamental physical principles to predict the effect of particle volume fraction and arrangements on effective behavior. Such a model will enable one to optimize the structure and arrangement of the material. The existing analytical descriptions of thermal transport in particulate systems under predict (as compared to the experimentally observed values) the effective thermal conductivity since these models do not accurately account for the effect of inter-particle interactions, especially when particle volume fractions approach the percolation limits of approximately 60%. Most existing theories are observed to be accurate when filler material volume fractions are less than 30–35%. In this paper, we present a hierarchical, meshless, computational procedure for creating complex microstructures, explicitly analyzing their effective thermal behavior, and mathematically optimizing particle sizes and arrangements. A newly developed object-oriented symbolic, java language framework termed jNURBS implementing the developed procedure is used to generate and analyze representative random microstructures of the TIMs.

Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials

2003 ◽  
Vol 125 (6) ◽  
pp. 1170-1177 ◽  
Author(s):  
Ravi S. Prasher ◽  
Jim Shipley ◽  
Suzana Prstic ◽  
Paul Koning ◽  
Jin-lin Wang
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Volume Fraction ◽  
Applied Pressure ◽  
Electronics Cooling ◽  
Thermal Design ◽  
Thermal Interface Materials ◽  
Semiempirical Model ◽  
Thermal Interface ◽  
Interface Materials

Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research has primarily dealt with the understanding of the thermal conductivity of these types of TIMs. For thermal design, reduction of the thermal resistance is the end goal. Thermal resistance is not only dependent on the thermal conductivity, but also on the bond line thickness (BLT) of these TIMs. It is not clear which material property(s) of these particle laden TIMs affects the BLT and eventually the thermal resistance. This paper introduces a rheology based semiempirical model for the prediction of the BLT of these TIMs. BLT depends on the yield stress of the particle laden polymer and the applied pressure. The BLT model combined with the thermal conductivity model can be used for modeling the thermal resistance of these TIMs for factors such as particle volume faction, particle shape, base polymer viscosity, etc. This paper shows that there exists an optimal filler volume fraction at which thermal resistance is minimum. Finally this paper develops design rules for the optimization of thermal resistance for particle laden TIMs.

Advanced Thermal Interface Materials for Thermal Management

2018 ◽  
Author(s):  
Wei Yu ◽  
◽  
Changqing Liu ◽  
Lin Qiu ◽  
Ping Zhang ◽  
...  
Keyword(s):  
Thermal Management ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

scholarly journals Carbon Nanotube Films for Energy Applications

Energies ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1890
Author(s):  
Monika Rdest ◽  
Dawid Janas
Keyword(s):  
Carbon Nanotube ◽  
Mechanical Energy ◽  
Research Community ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Conductive Coatings ◽  
Storage Devices ◽  
Energy Applications ◽  
Wide Range ◽  
Interface Materials

This perspective article describes the application opportunities of carbon nanotube (CNT) films for the energy sector. Up to date progress in this regard is illustrated with representative examples of a wide range of energy management and transformation studies employing CNT ensembles. Firstly, this paper features an overview of how such macroscopic networks from nanocarbon can be produced. Then, the capabilities for their application in specific energy-related scenarios are described. Among the highlighted cases are conductive coatings, charge storage devices, thermal interface materials, and actuators. The selected examples demonstrate how electrical, thermal, radiant, and mechanical energy can be converted from one form to another using such formulations based on CNTs. The article is concluded with a future outlook, which anticipates the next steps which the research community will take to bring these concepts closer to implementation.

Sign in / Sign up

Export Citation Format

Share Document