Room temperature direct bonding and debonding of polymer film on glass wafer for fabrication of flexible electronic devices

2015 ◽  
Author(s):  
K. Takeuchi ◽  
M. Fujino ◽  
T. Suga ◽  
M. Koizumi ◽  
T. Someya
Keyword(s):  
Polymer Film ◽  
Room Temperature ◽  
Electronic Devices ◽  
Glass Wafer ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

scholarly journals Nanoscale Analysis of Surface Bending Strain in Film Substrates for Preventing Fracture in Flexible Electronic Devices

2021 ◽  
pp. 2001662
Author(s):  
Ryo Taguchi ◽  
Norihisa Akamatsu ◽  
Kohei Kuwahara ◽  
Kayoko Tokumitsu ◽  
Yoshiaki Kobayashi ◽  
...  
Keyword(s):  
Electronic Devices ◽  
Bending Strain ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

Highly transparent, all-oxide, heteroepitaxy ferroelectric thin film for flexible electronic devices

2018 ◽  
Vol 458 ◽  
pp. 540-545 ◽  
Author(s):  
Chuanlai Ren ◽  
Congbing Tan ◽  
Lunjun Gong ◽  
Mingkai Tang ◽  
Min Liao ◽  
...  
Keyword(s):  
Thin Film ◽  
Electronic Devices ◽  
Ferroelectric Thin Film ◽  
Flexible Electronic ◽  
Flexible Electronic Devices
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