Lamination of dry film epoxy molding compounds for 3D packaging: advances and challenges

2021 ◽  
Author(s):  
Maxime Argoud ◽  
Raphael Eleouet ◽  
Jerome Dechamp ◽  
Nacima Allouti ◽  
Laurent Pain ◽  
...  
Keyword(s):  
Molding Compounds ◽  
3D Packaging ◽  
Dry Film

Magnetic Field Imaging on Stacked Flash Memories by Laser Probing and SQUID Scanning

2017 ◽  
Author(s):  
K. Sanchez ◽  
G. Bascoul ◽  
F. Infante ◽  
N. Courjault ◽  
T. Nakamura
Keyword(s):  
Magnetic Field ◽  
Failure Analysis ◽  
Two Dimensions ◽  
Analysis Tool ◽  
Active Device ◽  
Current Path ◽  
3D Packaging ◽  
Magnetic Field Imaging ◽  
The Magnetic Field ◽  
Field Imaging

Abstract Magnetic field imaging is a well-known technique which gives the possibility to study the internal activity of electronic components in a contactless and non-invasive way. Additional data processing can convert the magnetic field image into a current path and give the possibility to identify current flow anomalies in electronic devices. This technique can be applied at board level or device level and is particularly suitable for the failure analysis of complex packages (stacked device & 3D packaging). This approach can be combined with thermal imaging, X-ray observation and other failure analysis tool. This paper will present two different techniques which give the possibility to measure the magnetic field in two dimensions over an active device. Same device and same level of current is used for the two techniques to give the possibility to compare the performance.

Whisker Formation in Copper Electroplating

2011 ◽  
Author(s):  
Theresa Han ◽  
Eunin Cho ◽  
Jinwoo Heo ◽  
Seoung Jae Lee
Keyword(s):  
Copper Sulfate ◽  
Surface Stress ◽  
Whisker Formation ◽  
Printed Wiring Boards ◽  
Copper Electroplating ◽  
Cu Electroplating ◽  
Solution Surface ◽  
Dry Film

Abstract In the manufacture of Printed Wiring Boards (PWB), unwelcome structures, such as nodules and whiskers can be formed during copper electroplating with copper sulfate. Copper (Cu) whiskers with lengths of up to a few hundred micrometers can lead to electrical shorts between layers or patterns. In this paper, we document factors that can affect the growth of Cu whiskers; decomposition of additives in the Cu electroplating solution, surface stress, acidic cleaner, and the ingredients of a dry film. Contaminants from outside of the electroplating bath and the ingredients of the dry film were shown as key components in the formation of Cu whiskers.

Microstructural Considerations on the Reliability of 3D Packaging

2012 ◽  
Author(s):  
Zhiheng Huang ◽  
Zhiyong Wu ◽  
Hua Xiong ◽  
Yucheng Ma
Keyword(s):  
Mechanical Behavior ◽  
Grain Growth ◽  
Spinodal Decomposition ◽  
Elastic Energy ◽  
Modeling Approach ◽  
3D Packaging ◽  
Ultrafine Interconnects

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.

Multipurpose quick 3D packaging process

2011 ◽  
Author(s):  
Zhao Yongrui ◽  
Ma Hongbo ◽  
Bi Minglu ◽  
Huang Zhanwu ◽  
Jia Jun ◽  
...  
Keyword(s):  
Packaging Process ◽  
3D Packaging

scholarly journals 3D packaging architecture using paper as a dielectric medium

2008 ◽  
Author(s):  
Amin Rida ◽  
Li Yang ◽  
Napol Chaisilwattana ◽  
Scott Travis ◽  
Swapan Bhattacharya ◽  
...  
Keyword(s):  
Dielectric Medium ◽  
3D Packaging

scholarly journals Transient Three-Dimensional Flow Field Measurements by Means of 3D µPTV in Drying Poly(Vinyl Acetate)-Methanol Thin Films Subject to Short-Scale Marangoni Instabilities

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1223
Author(s):  
Max Tönsmann ◽  
Philip Scharfer ◽  
Wilhelm Schabel
Keyword(s):  
Flow Field ◽  
Vinyl Acetate ◽  
Three Dimensional ◽  
Field Measurements ◽  
Initial Assessment ◽  
Ambient Conditions ◽  
Three Dimensional Flow ◽  
Dimensional Flow ◽  
Short Scale ◽  
Dry Film

Convective Marangoni instabilities in drying polymer films may induce surface deformations, which persist in the dry film, deteriorating product performance. While theoretic stability analyses are abundantly available, experimental data are scarce. We report transient three-dimensional flow field measurements in thin poly(vinyl acetate)-methanol films, drying under ambient conditions with several films exhibiting short-scale Marangoni convection cells. An initial assessment of the upper limit of thermal and solutal Marangoni numbers reveals that the solutal effect is likely to be the dominant cause for the observed instabilities.

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