HSIO Technologies has developed several interconnect technologies that enable very high speed, fine pitch separable interconnect between a semiconductor package, flex cable or printed circuit assembly and a system level printed circuit board. In basic terms, connector technology has been produced that allows of direct socketing of the SoC, PoP, CPU, RF Module or Memory device directly in a mobile platform in an ultra-low profile interface that also extends to a ganged RF capable interface for flex cable and board to board applications. The technology revolves around matching very small metallic contacts with fusion bonded Liquid Crystal Polymer materials to create a high speed interface on very fine pitch. Applications to be detailed are socketing of mobile processors, memory devices, and RF modules directly in a cell phone handset, tablet and notebook computer. Emerging complexity with mobile platforms dictates that traditional methods of validating platform performance is not adequate with significant value in the ability to plug packaged IC devices into the actual consumer platform to validate silicon and performance. The paper will document the package substrate to connector interface as well as introduce very high performance connector and flex cable interconnects on 0.35 mm pitch area array for mobile, desktop, and server applications.
