Method for system-level signal and power integrity modeling of high-speed electronic packages

2009 ◽  
Author(s):  
En-Xiao Liu ◽  
Xingchang Wei ◽  
Zaw Zaw OO ◽  
Yao-Jiang Zhang ◽  
Wenzu Zhang ◽  
...  
Keyword(s):  
High Speed ◽  
System Level ◽  
Electronic Packages ◽  
Power Integrity

Enhanced Mpilog macromodels for Signal and Power Integrity Simulations

2015 ◽  
Vol 2015 (1) ◽  
pp. 000306-000311
Author(s):  
Gianni Signorini ◽  
Claudio Siviero ◽  
Igor Simone Stievano ◽  
Stefano Grivet-Talocia
Keyword(s):  
High Speed ◽  
Supply Voltage ◽  
State Of The Art ◽  
Low Cost ◽  
System Level ◽  
Power Integrity ◽  
Mobile Platforms ◽  
Power Supply Voltage ◽  
Dynamic Components ◽  
Small Form Factor

Due to increasingly stringent low-cost and small form-factor design constraints, Signal and Power Integrity analyses (SI&PI) have gained a paramount importance in the definition and optimization of mobile platforms. Operating margins are dramatically reduced in order to meet all the required design targets and constraints (extensive re-use, time-to-market, etc.). In this scenario, transistor-level simulations for platform-level analyses are inefficient and often, impractical. I/O-buffer models become essential and their accuracy is crucial for the reliability of SI&PI studies. As data-rates increase, signaling swing reduces and power-supply voltage noise becomes inevitable, state-of-the-art legacy models are limited for SI&PI co-simulations. This work summarizes the recent enhancements of “Mpilog”-class macromodels for high-speed I/O-buffers. Mpilog macromodels reproduce voltage and currents at I/O and (multiple) supply ports as weighted combinations of pull-up/pull-down static and dynamic components. The static parts are extracted via nested DC sweeps simulations and reproduced by tensor representations obtained via high-order singular value decomposition (SVD) processes. The dynamic components are described by linear state-space models identified from device's transient responses to suitable stimuli. For transmitters, the weighting functions match the output-port transitions and the dynamic supply-current profiles, capturing also the dependency of switching delays upon supply-voltage fluctuations; this is a key feature that enables Mpilog macromodels to precisely reproduce simultaneous-switching-noise (SSN) effects in complex system-level SI&PI simulations. The macromodels can be readily synthesized as SPICE netlists (including resistors, capacitors and controlled-sources) or Verilog-A codes; this allows their use in any SPICE-type electrical solver. Several examples of realistic SI&PI simulations for single-ended and differential interfaces are presented. Transistor-level simulations are compared with the corresponding ones based on Mpilog-macromodels: the resulting accuracy and the speed-up factors are extensively discussed. Comparisons with state-of-the-art legacy models (IBIS) are also discussed.

High-speed singulation of electronic packages using a frequency-doubled Nd:YAG laser in a water jet and realization of a 200-W green laser

2003 ◽  
Author(s):  
Frank R. Wagner ◽  
Wentao Hu ◽  
Akos Spiegel ◽  
Nandor Vago ◽  
Bernold Richerzhagen
Keyword(s):  
Nd:Yag Laser ◽  
High Speed ◽  
Green Laser ◽  
Water Jet ◽  
Electronic Packages

Assessment of Viscous Flows in High-Speed Micro Rotating Machinery for Energy Conversion Applications

2001 ◽  
Author(s):  
Luc G. Fréchette
Keyword(s):  
Shear Flow ◽  
Energy Conversion ◽  
Viscous Flow ◽  
High Speed ◽  
Applied Pressure ◽  
Secondary Flows ◽  
System Level ◽  
Flow Profile ◽  
System Level Design ◽  
Level Design

Abstract This paper investigates the characteristics of viscous flow in the micron-scale clearances surrounding high-speed micro-rotors currently being developed for miniature energy conversion applications. Analysis and experimental results from 4 mm diameter microfabricated rotors operated above 1 million rpm are used to describe the viscous flow characteristics, and provide guidelines for system-level design. To first order, the flow is characterized as fully developed shear flow (Couette flow) across the small gaps, induced by the rotor motion. However, secondary flows are induced perpendicular to the direction of rotor motion when externally applied pressure gradients exist along the small gaps. The developing flow in the entrance region of the small gaps in this secondary flow direction impacts the shear flow profile, hence affecting the drag on the disk. The effect of other inertial forces, such as Coriolis and centrifugal forces, are investigated analytically and numerically and found to affect the shear flow profile on the fluid in the motor gap at high rotational speeds. Since viscous losses are prevelant in microsystems, appropriate modeling is necessary for system-level design.

System Design and Modeling of a Thermally Activated Reconfigurable Wing

2010 ◽  
Author(s):  
Richard Beblo ◽  
Darrel Robertson ◽  
James Joo ◽  
Brian Smyers ◽  
Gregory Reich
Keyword(s):  
Thermal Energy ◽  
High Speed ◽  
Frictional Heating ◽  
Mechanical Analysis ◽  
Design Tool ◽  
System Level ◽  
Morphing Aircraft ◽  
Thermal Actuation ◽  
Short Period ◽  
Reconfigurable Structures

Reconfigurable structures such as morphing aircraft generally require an on board energy source to function. Frictional heating during the high speed deployment of a blunt nosed low speed reconnaissance air vehicle can provide a large amount of thermal energy during a short period of time. This thermal energy can be collected, transferred, and utilized to reconfigure the deployable aircraft. Direct utilization of thermal energy has the ability to significantly decrease or eliminate the losses associated with converting thermal energy to other forms, such as electric. The following work attempts to describe possible system designs and components that can be utilized to transfer the thermal energy harvested at the nose of the aircraft during deployment to internal components for direct thermal actuation of a reconfigurable wing structure. A model of a loop heat pipe is presented and used to predict the time dependant transfer of energy. Previously reported thermal profiles of the nose of the aircraft calculated based on trajectory and mechanical analysis of the actuation mechanism are reviewed and combined with the model of the thermal transport system providing a system level feasibility investigation and design tool. The efficiency, implementation, benefits, and limitations of the direct use thermal system are discussed and compared with currently utilized systems.

High Performance Storage for Big Data Analytics and Visualization

2018 ◽  
pp. 254-275
Author(s):  
Armando Fandango ◽  
William Rivera
Keyword(s):  
Big Data ◽  
High Speed ◽  
High Performance ◽  
File System ◽  
Predictive Analytics ◽  
Big Data Analytics ◽  
File Systems ◽  
Distributed Applications ◽  
System Level ◽  
File Formats

Scientific Big Data being gathered at exascale needs to be stored, retrieved and manipulated. The storage stack for scientific Big Data includes a file system at the system level for physical organization of the data, and a file format and input/output (I/O) system at the application level for logical organization of the data; both of them of high-performance variety for exascale. The high-performance file system is designed with concurrent access, high-speed transmission and fault tolerance characteristics. High-performance file formats and I/O are designed to allow parallel and distributed applications with easy and fast access to Big Data. These specialized file formats make it easier to store and access Big Data for scientific visualization and predictive analytics. This chapter provides a brief review of the characteristics of high-performance file systems such as Lustre and GPFS, and high-performance file formats such as HDF5, NetCDF, MPI-IO, and HDFS.

Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Dhananjay Panchagade ◽  
Prakriti Choudhary ◽  
Jeff Suhling ◽  
Sameep Gupte
Keyword(s):  
Electronic Packaging ◽  
Wavelet Transforms ◽  
High Speed ◽  
Damage Index ◽  
Test Method ◽  
System Level ◽  
Failure Envelope ◽  
Ball Grid Arrays ◽  
Cost Constraints ◽  
Damage Progression

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints. Presently, one of the primary methodologies for evaluating shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method. In this paper, a failure-envelope approach based on wavelet transforms and damage proxies has been developed to model drop and shock survivability of electronic packaging. Data on damage progression under transient-shock and vibration in both 95.5Sn4.0Ag0.5Cu and 63Sn37Pb ball-grid arrays has been presented. Component types examined include — flex-substrate and rigid substrate ball-grid arrays. Dynamic measurements like acceleration, strain and resistance are measured and analyzed using high-speed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per second. Ultra high-speed video at 150,000 fps per second has been used to capture the deformation kinematics. The concept of relative damage index has been used to both evaluate and predict damage progression during transient shock. The failure-envelope provides a fundamental basis for development of component integration guidelines to ensure survivability in shock and vibration environments at a user-specified confidence level. The approach is scalable to application at system-level. Explicit finite-element models have been developed for prediction of shock survivability based on the failure envelope. Model predictions have been correlated with experimental data for both leaded and leadfree ball-grid arrays.

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