Effects of etching time on the morphology of porous silicon structure formed by potential-assisted electrochemical etching

2012 ◽  
Author(s):  
Nurul Izni Rusli ◽  
Mastura Shafinaz Zainal Abidin ◽  
Budi Astuti ◽  
Nihad K. Ali ◽  
Abdul Manaf Hashim
Keyword(s):  
Porous Silicon ◽  
Electrochemical Etching ◽  
Etching Time ◽  
Silicon Structure

Structural and Morphological Properties of Nano Photonic Silicon Structure for Photonics Applications

2020 ◽  
Vol 398 ◽  
pp. 29-33 ◽  
Author(s):  
Mariam M. Hassan ◽  
Makram A. Fakhri ◽  
Salah Aldeen Adnan
Keyword(s):  
Porous Silicon ◽  
Surface Morphology ◽  
Pore Diameter ◽  
Electrochemical Etching ◽  
Morphological Properties ◽  
Etching Time ◽  
Silicon Structure ◽  
Si Substrate ◽  
Etching Technique ◽  
Structure Surface

Porous silicon (n-PS) with diverse morphologies was prepared on silicon (Si) substrate via photo-electrochemical etching technique. We studies the structure, surface morphology, pore diameter, roughness, based on (XRD), (AFM), (SEM) at different etching time (5, 10 min) and current (10mA/cm2).

Effects of Electrochemical Etching Time on the Performance of Porous Silicon Solar Cells on Crystalline n-Type (100) and (111)

2017 ◽  
Vol 46 ◽  
pp. 45-56 ◽  
Author(s):  
Khalid Omar ◽  
Khaldun A. Salman
Keyword(s):  
Solar Cells ◽  
Porous Silicon ◽  
Crystalline Silicon ◽  
Electrochemical Etching ◽  
Silicon Layer ◽  
Porous Silicon Layer ◽  
Silicon Solar Cells ◽  
Etching Time ◽  
Crystalline Silicon Solar Cells ◽  
Coating Layers

Electrochemical etching was carried out to produce porous silicon based on crystalline silicon n-type (100) and (111) wafers. Etching times of 10, 20, and 30 min were applied. Porous silicon layer was used as anti-reflection coating on crystalline silicon solar cells. The optimal etching time is 20 min for preparing porous silicon layers based on crystalline silicon n-type (100) and (111) wafers. Nanopores with high porosity were produced on the porous silicon layer based on crystalline silicon n-type (100) and (111) wafers with average diameters of 5.7 and 5.8 nm, respectively. Average crystallite sizes for the porous silicon layer based on crystalline silicon n-type (100) and (111) wafers were 20.57 and 17.45 nm at 20 and 30 min, respectively, due to the increase in broadening of the full width at half maximum. Photoluminescence peaks for porous silicon layers based on crystalline silicon n-type (100) and (111) wafers increased with growing porosity and a great blue shift in luminescence. The minimum effective coefficient of reflection was obtained from porous silicon layers based on the crystalline silicon n-type (100) wafer compared with n-type (111) wafer and as-grown at different etching times. Porous silicon layers based on the crystalline silicon n-type (100) wafer at 20 min etching time exhibited excellent light trapping at wavelengths ranging from 400 to 1000 nm. Thus, fabricated crystalline silicon solar cells based on porous silicon (100) anti-reflection coating layers achieved the highest efficiency at 15.50% compared to porous silicon (111) anti-reflection coating layers. The efficiency is characterized applying I-V characterization system under 100 mW/cm2 illumination conditions.

Influence of Electrochemical Etching Parameters on Morphology of Porous Silicon

2014 ◽  
Vol 1055 ◽  
pp. 68-72 ◽  
Author(s):  
Lan Liu ◽  
Yan Xue ◽  
Xiao Ming Ren ◽  
Rui Zhen Xie
Keyword(s):  
Porous Silicon ◽  
Specific Surface ◽  
Surface Area ◽  
Specific Surface Area ◽  
High Speed ◽  
Electrochemical Etching ◽  
Etching Time ◽  
Adsorption Surface ◽  
Etching Parameters ◽  
And Control

In order to protect porous silicon from break and enhance it’s porosity and specific surface area, porous silicon is prepared with electrochemical etching method. The charateristic of porous silicon is investigated with SEM and high-speed adsorption surface area and porosity analyzer. The results show that the porous silicon prepared with the method of gradient etching and control of etching time is mechanically stable. The porosity and specfic surface area are improved.

Effect of Etching Time on Electrical and Optical Properties of Porous Silicon

2013 ◽  
Vol 667 ◽  
pp. 397-401
Author(s):  
S.F.M. Yusop ◽  
N. Azaman ◽  
Hartini Ahmad Rafaie ◽  
S. Amizam ◽  
Saifollah Abdullah ◽  
...  
Keyword(s):  
Optical Properties ◽  
Porous Silicon ◽  
Electrochemical Etching ◽  
Silicon Layer ◽  
Porous Silicon Layer ◽  
Constant Current ◽  
Voltage Source ◽  
Etching Time ◽  
Constant Current Density ◽  
Wafer Substrate

The characterized on porous silicon layer by using photoluminescence (PL) and I-V measurement (I-V) has been done. Porous silicon was formed by electrochemical etching on (100) p-type Si wafer substrate with the constant current density (20mA/cm2) and variable the etching time. The samples ware prepared under various etching time and properties of porous silicon depend on an etching time. Porous silicon has been used in humidity sensors to detect humidity through changes of its electrical properties. The samples of porous silicon were characterized by using Photoluminescence Spectroscopy (PL) that used to characterize optical properties while I-V Measurement (I-V) used to characterize porous silicon junction properties using a linear voltage source. The result shows PL intensity is increase while the wavelength is decrease for etching time of PSi is longer. For the I-V measurement result shows the etching time affect the resistance of sample due to its porosity.

Surface Morphology and Si 2p Binding Energy Investigation of Multilayer Porous Silicon Nanostructure

2012 ◽  
Vol 620 ◽  
pp. 17-21 ◽  
Author(s):  
Ahmad Afif Safwan Mohd Radzi ◽  
M.A. Yarmo ◽  
M. Rusop ◽  
Saifollah Abdullah
Keyword(s):  
Porous Silicon ◽  
Surface Morphology ◽  
Photoelectron Spectroscopy ◽  
Multilayer Structure ◽  
Electrochemical Etching ◽  
Binding Energies ◽  
Etching Time ◽  
Potential Candidate ◽  
Silicon Nanostructure ◽  
Porous Silicon Nanostructure

Multilayer structure of porous silicon was fabricated using electrochemical etching method. Average thickness of multilayer structure was verified. Surface morphology from Atomic Force Microscopy (AFM) shows that surface roughness was decreased when higher etching time applied to the samples. Si 2p binding energies were corresponded to the composition of void within the silicon which prompted the formation of porous silicon nanostructure. Depth profiling technique from X-Ray photoelectron spectroscopy (XPS) was used for compositional determination of porous silicon layers since samples porosity varied according to current density applied during the electrochemical etching process. Multilayer porous silicon is a high potential candidate for Bragg grating waveguide device.

scholarly journals Optical Properties of Porous Silicon Solar Cells for Use in Transport

2019 ◽  
Vol 21 (3) ◽  
pp. 53-58
Author(s):  
Martin Kralik ◽  
Michaela Hola ◽  
Stanislav Jurecka
Keyword(s):  
Solar Cells ◽  
Porous Silicon ◽  
Spectral Reflectance ◽  
High Efficiency ◽  
Electrochemical Etching ◽  
Electrical Potential ◽  
Etching Time ◽  
Si Substrate ◽  
Etching Parameters ◽  
P Type

Porous silicon (pSi) samples were prepared by electrochemical etching of p-type silicon (p-type Si) substrate. Three pSi samples with different parameters of electrochemical etching (electrical potential, etching time, etching current) were prepared and analyzed. We studied the influence of electrochemical etching parameters on spectral reflectance of pSi structure. A modification of interference pattern was observed due to changes of microstructure. We determined the thickness of pSi layers from spectral reflectance. Solar cells with a porous structure achieve high efficiency and long life. These solar cells are predestined for use in transport.

scholarly journals Modification of Surface Properties of Silicon Wafers by Laser-Assisted Electrochemical Etching

2018 ◽  
Vol 80 ◽  
pp. 30-39
Author(s):  
Hasan A Hadi
Keyword(s):  
Porous Silicon ◽  
Optical Microscopy ◽  
Surface Topography ◽  
Electrochemical Etching ◽  
Silicon Layer ◽  
Porous Silicon Layer ◽  
Diffraction Peak ◽  
Etching Time ◽  
Layer Formation ◽  
Xrd Patterns

In this paper, the structural properties of porous silicon layer PSL were reported. Photo-assisted (laser) electrochemical etching PECE technique used to fabrication PSL from n-type wafer silicon as a function of etching time. Optical microscopy OM image is confirmed that the surface topography of porous silicon layer formation was a mud-like structure. The porosity and thickness have been determined gravimetrically are varied from 61% to 82% and 7.2 µm to 9.4µm respectively. The XRD patterns show that one diffraction peak for all PSL through anodization duration and it is assigned to the (400) plane and data confirmed the porous silicon PS was nanocrystalline.

scholarly journals The Effect of Etching Time On Structural Properties of Porous Quaternary AlInGaN Thin Films

2021 ◽  
Vol 19 (50) ◽  
pp. 77-83
Author(s):  
Ghasaq Ali Tomaa ◽  
Alaa Jabbar Ghazai
Keyword(s):  
Porous Silicon ◽  
Crystal Size ◽  
Electrochemical Etching ◽  
Silicon Layer ◽  
Porous Silicon Layer ◽  
Etching Time ◽  
Etching Technique ◽  
Force Microscopy ◽  
Atomic Force ◽  
Homogeneous Pattern

Using photo electrochemical etching technique (PEC), porous silicon (PS) layers were produced on n-type silicon (Si) wafers to generate porous silicon for n-type with an orientation of (111) The results of etching time were investigated at: (5,10,15 min). X-ray diffraction experiments revealed differences between the surface of the sample sheet and the synthesized porous silicon. The largest crystal size is (30 nm) and the lowest crystal size is (28.6 nm) The analysis of Atomic Force Microscopy (AFM) and Field Emission Scanning Electron Microscope (FESEM) were used to research the morphology of porous silicon layer. As etching time increased, AFM findings showed that root mean square (RMS) of roughness and porous silicon grain size decreased and FESEM showed a homogeneous pattern and verified the formation of uniform porous silicon.

IMPROVING THE PHOTORESPONSE OF POROUS SILICON FOR SOLAR CELL APPLICATIONS BY EMBEDDING OF CdTe NANOPARTICLES

2017 ◽  
Vol 24 (Supp01) ◽  
pp. 1850012 ◽  
Author(s):  
IBRAHIM R. AGOOL ◽  
AHMED N. ABD ◽  
MOHAMMED O. DAWOOD ◽  
HARITH M. ABD AL-AMEER ◽  
NADIR F. HABUBI ◽  
...  
Keyword(s):  
Solar Cell ◽  
Porous Silicon ◽  
Electrochemical Etching ◽  
Etching Time ◽  
Reverse Bias Voltage ◽  
Tunneling Microscopy ◽  
Laser Ablation In Liquid ◽  
Force Microscopy ◽  
Cdte Nanoparticles ◽  
Atomic Force

The present work is concerned with the preparation of thin films of nanocrystalline porous silicon (PSi) by the method of electrochemical etching. CdTe nanoparticles (NPs) have been prepared by utilizing the pulsed laser ablation in liquid. The measurements of tunneling microscopy, X-ray diffraction (XRD), Fourier transformation infrared spectroscopy (FTIR) and atomic force microscopy (AFE) were carried out and revealed that the PSi was nanostructured and the produced CdTe NPs were ball shaped, having good disposability. The diffusion of CdTe NPs on the properties of PSi solar cell assures that there was an improvement upon their properties. The relationship between [Formula: see text] and the reverse bias voltage was observed to be linear. Values of the built-in potential were observed to be dependent on the laser fluence, current density and the etching time.

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