Thermal stress characteristics of Cu interconnects using Air-Gap

Author(s):  
Xiao-ling Lin ◽  
Tong-xian Hou ◽  
Zhang Xiao-wen ◽  
Ruo-he Yao
Author(s):  
T. Harada ◽  
A. Ueki ◽  
K. Tomita ◽  
K. Hashimoto ◽  
J. Shibata ◽  
...  
Keyword(s):  
Air Gap ◽  

2011 ◽  
Vol 50 (1R) ◽  
pp. 016503 ◽  
Author(s):  
Yukio Takigawa ◽  
Nobuaki Tarumi ◽  
Morio Shiohara ◽  
Eiichi Soda ◽  
Noriaki Oda ◽  
...  

2007 ◽  
Vol 515 (12) ◽  
pp. 4960-4965 ◽  
Author(s):  
Shoichi Uno ◽  
Kiyomi Katsuyama ◽  
Junji Noguchi ◽  
Kiyohiko Sato ◽  
Takayuki Oshima ◽  
...  
Keyword(s):  
Air Gap ◽  

2011 ◽  
Vol 50 ◽  
pp. 016503 ◽  
Author(s):  
Yukio Takigawa ◽  
Nobuaki Tarumi ◽  
Morio Shiohara ◽  
Eiichi Soda ◽  
Noriaki Oda ◽  
...  

2011 ◽  
Vol 332-334 ◽  
pp. 1520-1526
Author(s):  
Ye Hu Lu ◽  
Xiao Hui Li ◽  
Jun Li ◽  
Dai Wei Wu

Various intensity heat fluxes firefighters encountered will produce thermal stress on skin, resulting in thermal pain and tissue damage. In this paper, a new approach to evaluate thermal stress under flashover with short duration was carried out based on plain-stress theory. Instant heat flux under fabric was calculated so as to determine temperature and thermal stress distribution. The results obtained were as follows: temperature increased slightly at initial stage and then sharply increased linearly, moreover, temperature was much higher when sensor directly contacted with specimen, comparing with that of 6mm air gap; heat flux under fabric quickly reached its maximum, and higher heat flux was observed as no air gap generated; thermal stress rapidly increased and then gradually decreased, moreover, higher thermal stress produced without air gap. The newly proposed method could well distinct heat transfer performance of fabric under different conditions, which might provide helpful guideline to performance evaluation of thermal protective clothing.


2020 ◽  
Vol 62 (3) ◽  
pp. 461-475
Author(s):  
Yang Hao ◽  
Liu Heng ◽  
Yang Fan ◽  
Ji Zhenwei ◽  
Gao Bing ◽  
...  
Keyword(s):  
Air Gap ◽  

2000 ◽  
Vol 612 ◽  
Author(s):  
Dhananjay M. Bhusari ◽  
Michael D. Wedlake ◽  
Paul A. Kohl ◽  
Carlye Case ◽  
Fred P. Klemens ◽  
...  

AbstractWe present here a method for fabrication of air-gaps between Cu-interconnects to achieve low intralevel dielectric constant, using a sacrificial polymer as a ‘place holder’. IC compatible metallization and CMP processes were used in a single damascene process. The air-gap occupies the entire intralevel volume between the copper lines with fully densified SiO2 as the planer interlevel dielectric. The width of the air-gaps was 286 nm and the width of the copper lines was 650 nm. The effective intralevel dielectric constant was calculated to be 2.19. The thickness of the interlevel SiO2 and copper lines were 1100 nm and 700 nm, respectively. Further reduction in the value of intralevel dielectric constant is possible by optimization of the geometry of the metal/air-gap structure, and by use of a low k interlevel dielectric material.In this method of forming air-gaps, the layer of sacrificial polymer was spin-coated onto the substrate and formed into the desired pattern using an oxide or metal mask and reactive-ion-etching. The intralevel Cu trench is then inlaid using a damascene process. After the CMP of copper, interlevel SiO2 is deposited by plasma-CVD. Finally, the polymer place-holder is thermally decomposed with the decomposition products permeating through the interlevel dielectric material. The major advantages of this method over other reported methods of formation of air-gaps are excellent control over the geometry of the air-gaps; no protrusion of air-gaps into the interlevel dielectric; no deposition of SiO2 over the side-walls, and no degradation of the interlevel dielectric during the formation of air-gap.


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