Statistical modeling tools, methods and applications for integrated circuit manufacturability

2002 ◽  
Author(s):  
F. Iravani ◽  
M. Habu ◽  
E. Khalily
Keyword(s):  
Statistical Modeling ◽  
Integrated Circuit ◽  
Modeling Tools

scholarly journals Artificial neural network prediction of the aluminum extraction from bauxite in the Bayer process

2012 ◽  
Vol 77 (9) ◽  
pp. 1259-1271
Author(s):  
Isidora Djuric ◽  
Ivan Mihajlovic ◽  
Zivan Zivkovic
Keyword(s):  
Statistical Modeling ◽  
Linear Regression Analysis ◽  
Sodium Aluminate ◽  
Multiple Linear Regression Analysis ◽  
Modeling Tools ◽  
Alumina Production ◽  
Leaching Process ◽  
Artificial Neural ◽  
Input Variables ◽  
Degree Of Recovery

This paper presents the results of statistical modeling of the bauxite leaching process, as part of Bayer technology for an alumina production. Based on the data, collected during the period between 2008 - 2009 (659 days) from the industrial production in the alumina factory Birac, Zvornik (Bosnia and Herzegovina), the statistical modeling of the above mentioned process was performed. The dependant variable, which was the main target of the modeling procedure, was the degree of Al2O3 recovery from boehmite bauxite during the leaching process. The statistical model was developed as an attempt to define the dependence of the Al2O3 degree of recovery as a function of input variables of the leaching process: composition of bauxite, composition of the sodium aluminate solution and the caustic module of the solution before and after the leaching process. As the statistical modeling tools, Multiple Linear Regression Analysis (MLRA) and Artificial Neural Networks (ANNs) were used. The fitting level, obtained by using the MLRA, was R2 = 0.463, while ANN resulted with the value of R2 = 0.723. This way, the model, defined by using the ANN methodology, can be used for the efficient prediction of the Al2O3 degree of recovery as a function of the process inputs, under the industrial conditions of the alumina factory Birac, Zvornik. The proposed model also has got a universal character and, as such, is applicable in other factories practicing the Bayer technology for alumina production.

scholarly journals Topology Optimization of Dual Octagonal Array antenna for low frequency applications

2018 ◽  
Vol 7 (2.17) ◽  
pp. 13
Author(s):  
P Venu Madhav ◽  
Dr M SivaGanga Prasad
Keyword(s):  
Integrated Circuit ◽  
Communication Systems ◽  
Low Cost ◽  
Low Frequency ◽  
Patch Antennas ◽  
Modeling Tools ◽  
The Face ◽  
Increasing Demand ◽  
Industrial Needs ◽  
Matching Techniques

Objectives: Efficient antenna design for use in communication systems is altering the face of the antenna modeling. The ever-increasing demand for portable and efficient antennas is making researchers to develop innovative models [1] using advanced antenna modeling tools that comply with industrial needs and standards.  Methods/Statistical Analysis: Antennas with lower operating frequencies have the major constraints on its size, efficiency and gain. Study on matching techniques, feeding techniques was also to be considered.Findings: Micro strip patch antennas offers considerable amount of radiation, low cost when fabricated on FR4, light weight and are conformable to suite any application. This paper projects the design, simulation and testing of a dual octagonal patch, the topology algorithm [3] is used to optimize the size and shape of the patch where octagons are spaced in the form of an array to address optimization on size and fits into wireless applications. Application/Improvements: The proposed model is tested in the standard antenna test bench comprising of microwave integrated circuit analyzer receiver MIC10kit and found to operate at a resonant frequency of 1.8 GHz with good radiation characteristics.  

The Precipitation of Si in AlCuSi Thin Films

1973 ◽  
Vol 31 ◽  
pp. 34-35 ◽  
Author(s):  
R. M. Anderson
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Heat Treatment ◽  
Solid Solution ◽  
Integrated Circuit ◽  
Copper Film ◽  
Solution Concentration ◽  
X Ray ◽  
Silicon Thin Films ◽  
Before And After

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

Characterization of RF Sputtered ZnO Piezoelectric Films Using Transmission Electron Microscope

1975 ◽  
Vol 33 ◽  
pp. 86-87
Author(s):  
Kemining W. Yeh ◽  
Richard S. Muller ◽  
Wei-Kuo Wu ◽  
Jack Washburn
Keyword(s):  
Integrated Circuit ◽  
Acoustic Waves ◽  
New Technology ◽  
Surface Acoustic Waves ◽  
Electromechanical Properties ◽  
Leading Role ◽  
Saw Devices ◽  
Transmission Electron ◽  
High Degree

Considerable and continuing interest has been shown in the thin film transducer fabrication for surface acoustic waves (SAW) in the past few years. Due to the high degree of miniaturization, compatibility with silicon integrated circuit technology, simplicity and ease of design, this new technology has played an important role in the design of new devices for communications and signal processing. Among the commonly used piezoelectric thin films, ZnO generally yields superior electromechanical properties and is expected to play a leading role in the development of SAW devices.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

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