Temperature- and time-dependent conduction controlled by activation energy in PCM

Author(s):  
D. Fugazza ◽  
D. Ielmini ◽  
G. Montemurro ◽  
A. L. Lacaita
2020 ◽  
Vol 9 (3) ◽  
pp. 216-229
Author(s):  
Hussan Zeb ◽  
Hafiz Abdul Wahab ◽  
Umar Khan

In this work we demonstrated the impacts of zero mass flux in Powell-Eyring fluid over time dependent stretching sheet. We analyzed the Arrhenius activation energy in heat transfer with momentum and thermal slip boundary condition. The governing model is very complex to solve it directly therefore we transform these governed model into a coupled nonlinear ODEs via similarity transformation. After that, we solve these ODEs by using numerica method so calledshooting technique with RK-technique. The characteristics of different beneficial physical parameters on momentum, energy and concentration fields are represented through graphs. We concluded in this work the arising or reducing in the velocity, temperature and concentration fields for the existence of physical parameters. The impact of physical quantities namely skin fraction (Cf), Nusselt (Nux) and Sherwood (Shx) numbers are calculated numerically via tables. In this paper we concluded that the decreases occurring in velocity field for higher values of (M) (H) and (β). Moreover the characteristics of concentration Φ(ζ), temperature θ(ζ) and velocity f′(ζ) gradients are presented for important physical parameters see in detailed Result and discussion section.


2008 ◽  
Vol 23 (6) ◽  
pp. 1802-1808 ◽  
Author(s):  
T.L. Tan ◽  
C.L. Gan ◽  
A.Y. Du ◽  
Y.C. Tan ◽  
C.M. Ng

Delamination at an interface with the weakest adhesion strength, which is found to be between the SiC(N) capping layer and the SiOCH low-k dielectric, is a potential failure mechanism contributing to time-dependent dielectric breakdown (TDDB) reliability. Bond breaking at that interface is believed to be driven by a field-enhanced thermal process and catalyzed by leakage current through the capping layer based on physical analyses and TDDB measurements. Delamination is found to be easier in terminated tips and corners than in parallel comb lines due to the layout orientation of the Cu lines. Moreover, TDDB activation energy Ea can be an indicator of the ease of delamination, whereby a lower Ea corresponds to an easier delamination.


2000 ◽  
Vol 39 (Part 1, No. 7B) ◽  
pp. 4687-4691 ◽  
Author(s):  
Yoshinao Harada ◽  
Koji Eriguchi ◽  
Masaaki Niwa ◽  
Takanobu Watanabe ◽  
Iwao Ohdomari

1977 ◽  
Vol 55 (13) ◽  
pp. 2517-2522 ◽  
Author(s):  
D. Ceccaldi

A general kinetic theory is used to explain the shapes of photoionized sample luminescence curves perturbed by thermal jumps (Δ ∼ 1 K, rise time ∼ 1 s). The samples studied are photoactivated organic vitreous solutions of TMPD/MCH 10−3 M and TMPD/3-MP 10−3 M. The experiments are performed within a temperature range (63–91 K) which includes the glass transition temperature Tg. It is shown that there is a slow diffusion of the trapped electrons towards the cation and competition between thermal detrapping and tunneling. The tunneling/thermal detrapping ratio Y is not time dependent during an isothermal luminescence and is only slowly temperature dependent if T ≤ Ty. Ty is very close to Tg. For T > Ty, Y decreases rapidly with T. The activation energy for thermal detrapping shows a maximum when the temperature reaches [Formula: see text] The glass transition temperature Tg may therefore be defined empirically as:[Formula: see text]Finally we obtain a glassy matrix relaxation time, τ, which decreases with T.


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