An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures
2014 ◽
Vol 54
(3)
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pp. 529-540
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2013 ◽
Vol 26
(3)
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pp. 281-296
2008 ◽
Vol 23
(6)
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pp. 1802-1808
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Keyword(s):
2017 ◽
Vol 35
(2)
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pp. 021509
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Keyword(s):