Degradation mechanisms of embedded cooling systems for high heat flux power electronics: Particle erosion of silicon and silicon carbide

2017 ◽  
Author(s):  
D. Squiller ◽  
I. Movius ◽  
M. Ohadi ◽  
P. McCluskey
Keyword(s):  
Heat Flux ◽  
Silicon Carbide ◽  
Power Electronics ◽  
High Heat ◽  
High Heat Flux ◽  
Degradation Mechanisms ◽  
Particle Erosion ◽  
Cooling Systems

Development of Advanced High Heat Flux Cooling System for Power Electronics

2009 ◽  
Author(s):  
Yasuhisa Shinmoto ◽  
Shinichi Miura ◽  
Koichi Suzuki ◽  
Yoshiyuki Abe ◽  
Haruhiko Ohta
Keyword(s):  
Heat Flux ◽  
Power Electronics ◽  
Critical Heat Flux ◽  
Heating Surface ◽  
Narrow Channel ◽  
High Heat ◽  
High Heat Flux ◽  
Gap Size ◽  
Narrow Channels ◽  
Very High

Recent development in electronic devices with increased heat dissipation requires severe cooling conditions and an efficient method for heat removal is needed for the cooling under high heat flux conditions. Most researches are concentrated on small semiconductors with high heat flux density, while almost no existing researches concerning the cooling of a large semiconductor, i.e. power electronics, with high heat generation density from a large cooling area. A narrow channel between parallel plates is one of ideal structures for the application of boiling phenomena which uses the cooling for such large semiconductors. To develop high-performance cooling systems for power electronics, experiments on increase in critical heat flux (CHF) for flow boiling in narrow channels by improved liquid supply was conducted. To realize the cooling of large areas at extremely high heat flux under the conditions for a minimum gap size and a minimum flow rate of liquid supplied, the structure with auxiliary liquid supply was devised to prevent the extension of dry-patches underneath flattened bubbles generated in a narrow channel. The heating surface was experimented in two channels with different dimensions. The heating surfaces have the width of 30mm and the lengths of 50mm and 150mm in the flow direction. A large width of actual power electronics is realizable by the parallel installation of the same channel structure in the transverse direction. The cooling liquid is additionally supplied via sintered metal plates from the auxiliary unheated channels located at sides or behind the main heated channel. To supply the liquid to the entire heating surface, fine grooves are machined on the heating surface for enhance the spontaneous liquid supply by the aid of capillary force. The gap size of narrow channels are varied as 0.7mm, 2mm and 5mm. Distribution of liquid flow rate to the main heated channel and the auxiliary unheated channels were varied to investigate its effect on the critical heat flux. Test liquids employed are R113, FC72 and water. The systematic experiments by using water as a test liquid were conducted. Critical heat flux values larger than 2×106W/m2 were obtained at both gap sizes of 2mm and 5mm for a heated length of 150mm. A very high heat transfer coefficient as much as 1×105W/m2K was obtained at very high heat flux near CHF for the gap size of 2mm. This paper is a summary of experimental results obtained in the past by the present authors.

Model Predictive Control of a Pumped Two-Phase Cooling System With Microchannel Heat Exchangers

2018 ◽  
Author(s):  
Oyuna Angatkina ◽  
Andrew Alleyne
Keyword(s):  
Heat Flux ◽  
Model Predictive Control ◽  
Predictive Control ◽  
Heat Exchangers ◽  
Cooling System ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase ◽  
Cooling Systems ◽  
Two Phase Cooling

Two-phase cooling systems provide a viable technology for high–heat flux rejection in electronic systems. They provide high cooling capacity and uniform surface temperature. However, a major restriction of their application is the critical heat flux condition (CHF). This work presents model predictive control (MPC) design for CHF avoidance in two-phase pump driven cooling systems. The system under study includes multiple microchannel heat exchangers in series. The MPC controller performance is compared to the performance of a baseline PI controller. Simulation results show that while both controllers are able to maintain the two-phase cooling system below CHF, MPC has significant reduction in power consumption compared to the baseline controller.

scholarly journals Investigating the use of nanofluids to improve high heat flux cooling systems

2013 ◽  
Vol 88 (9-10) ◽  
pp. 2594-2597 ◽  
Author(s):  
Thomas R. Barrett ◽  
S. Robinson ◽  
K. Flinders ◽  
A. Sergis ◽  
Y. Hardalupas
Keyword(s):  
Heat Flux ◽  
High Heat ◽  
High Heat Flux ◽  
Cooling Systems

Integrated Vapor Chamber Heat Spreader for Power Module Applications

2017 ◽  
Author(s):  
Clayton L. Hose ◽  
Dimeji Ibitayo ◽  
Lauren M. Boteler ◽  
Jens Weyant ◽  
Bradley Richard
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Coefficient Of Thermal Expansion ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Power Module ◽  
Heat Spreader

This work presents a demonstration of a coefficient of thermal expansion (CTE) matched, high heat flux vapor chamber directly integrated onto the backside of a direct bond copper (DBC) substrate to improve heat spreading and reduce thermal resistance of power electronics modules. Typical vapor chambers are designed to operate at heat fluxes > 25 W/cm2 with overall thermal resistances < 0.20 °C/W. Due to the rising demands for increased thermal performance in high power electronics modules, this vapor chamber has been designed as a passive, drop-in replacement for a standard heat spreader. In order to operate with device heat fluxes >500 W/cm2 while maintaining low thermal resistance, a planar vapor chamber is positioned onto the backside of the power substrate, which incorporates a specially designed wick directly beneath the active heat dissipating components to balance liquid return and vapor mass flow. In addition to the high heat flux capability, the vapor chamber is designed to be CTE matched to reduce thermally induced stresses. Modeling results showed effective thermal conductivities of up to 950 W/m-K, which is 5 times better than standard copper-molybdenum (CuMo) heat spreaders. Experimental results show a 43°C reduction in device temperature compared to a standard solid CuMo heat spreader at a heat flux of 520 W/cm2.

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

2021 ◽  
Vol 143 (3) ◽  
Author(s):  
Fabio Battaglia ◽  
Farah Singer ◽  
David C. Deisenroth ◽  
Michael M. Ohadi
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Forced Convection ◽  
Heat Removal ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Two Phase ◽  
Total Thermal Resistance

Abstract In this paper, we present the results of an experimental study involving low thermal resistance cooling of high heat flux power electronics in a forced convection mode, as well as in a thermosiphon (buoyancy-driven) mode. The force-fed manifold microchannel cooling concept was utilized to substantially improve the cooling performance. In our design, the heat sink was integrated with the simulated heat source, through a single solder layer and substrate, thus reducing the total thermal resistance. The system was characterized and tested experimentally in two different configurations: the passive (buoyancy-driven) loop and the forced convection loop. Parametric studies were conducted to examine the role of different controlling parameters. It was demonstrated that the thermosiphon loop can handle heat fluxes in excess of 200 W/cm2 with a cooling thermal resistance of 0.225 (K cm2)/W for the novel cooling concept and moderate fluctuations in temperature. In the forced convection mode, a more uniform temperature distribution was achieved, while the heat removal performance was also substantially enhanced, with a corresponding heat flux capacity of up to 500 W/cm2 and a thermal resistance of 0.125 (K cm2)/W. A detailed characterization leading to these significant results, a comparison between the performance between the two configurations, and a flow visualization in both configurations are discussed in this paper.

scholarly journals Experimental Characterization of the Heat Transfer in Multi-Microchannel Heat Sinks for Two-Phase Cooling of Power Electronics

Fluids ◽  
2021 ◽  
Vol 6 (2) ◽  
pp. 55
Author(s):  
Gennaro Criscuolo ◽  
Wiebke Brix Markussen ◽  
Knud Erik Meyer ◽  
Björn Palm ◽  
Martin Ryhl Kærn
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Power Electronics ◽  
Flow Boiling ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Average Heat

This study aims to characterize experimentally the heat transfer in micro-milled multi-microchannels copper heat sinks operating with flow boiling, in the attempt to contribute to the development of novel and high heat flux thermal management systems for power electronics. The working fluid was R-134a and the investigation was conducted for a nominal outlet saturation temperature of 30 ∘C. The microchannels were 1 cm long and covered a square footprint area of 1 cm2. Boiling curves starting at low vapor quality and average heat transfer coefficients were obtained for nominal channel mass fluxes from 250 kg/m2s to 1100 kg/m2s. The measurements were conducted by gradually increasing the power dissipation over a serpentine heater soldered at the bottom of the multi-microchannels, until a maximum heater temperature of 150 ∘C was reached. Infrared thermography was used for the heater temperature measurements, while high-speed imaging through a transparent top cover provided visual access over the entire length of the channels. The average heat transfer coefficient increased with the dissipated heat flux until a decrease dependent on hydrodynamic effects occurred, possibly due to incomplete wall wetting. Depending on the channel geometry, a peak value of 200 kW/m2K for the footprint heat transfer coefficient and a maximum dissipation of 620 W/cm2 at the footprint with a limit temperature of 150 ∘C could be obtained, showing the suitability of the investigated geometries in high heat flux cooling of power electronics. The experimental dataset was used to assess the prediction capability of selected literature correlations. The prediction method by Bertsch et al. gave the best agreement with a mean absolute percent error of 24.5%, resulting to be a good design tool for flow boiling in high aspect ratio multi-microchannels as considered in this study.

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