Study and Application of In-Situ Phosphorus Doped Thick Polysilicon Films at Low Temperature for Post CMOS-MEMS Integration

Author(s):  
Ian Chaung ◽  
Aron Michael ◽  
Chee Yee Kwok
1993 ◽  
Vol 03 (C3) ◽  
pp. C3-123-C3-130
Author(s):  
A. TOUNSI ◽  
E. SCHEID ◽  
C. AZZARO ◽  
P. DUVERNEUIL ◽  
J. P. COUDERC

1996 ◽  
Vol 74 (S1) ◽  
pp. 186-188
Author(s):  
S. Mohajerzadeh ◽  
C. R. Selvakumar

We report the results of fabricating n+-n iso-type diodes using in-situ phosphorus–doped polysilicon films on n-type 1 Ω cm <100> Si substrates. The electrical characteristics of this structure give evidence of the presence of an energy barrier at the film–substrate interface reminiscent of Schottky-barrier diodes. The current–voltage characteristics show exponential behavior over three decades of current. An ideality factor of 1.2 is extracted from the experimental results. An energy barrier height of about 0.2 eV is obtained from the current–temperature analysis.


1996 ◽  
Vol 51-52 ◽  
pp. 379-384 ◽  
Author(s):  
F. Le Bihan ◽  
B. Fortin ◽  
H. Lhermite ◽  
O. Bonnaud ◽  
D. Briand

1987 ◽  
Vol 106 ◽  
Author(s):  
R. Sinclair ◽  
A. H. Carim ◽  
J. Morgiel ◽  
J. C. Bravman

ABSTRACTSome typical microstructural studies of polycrystalline silicon using transmission electron microscopy (TEM) are described, including the application of this material for assisting TEM investigations themselves. Examples include oxidation and realignment of polysilicon thin films, the structure of polysilicon in EEPROM devices, polysilicon in trench capacitors and measurement of SiO2 layer thicknesses with polysilicon overlayers. It is also shown tha grain growth in heavily phosphorus doped polysilicon films can be followed by in situ heating in the TEM.


1994 ◽  
Vol 247 (2) ◽  
pp. 156-161 ◽  
Author(s):  
V.P Lesnikova ◽  
A.S Turtsevich ◽  
V.Y Krasnitsky ◽  
V.A Emelyanov ◽  
O.Y Nalivaiko ◽  
...  

1993 ◽  
Vol 33 (1-2) ◽  
pp. 145-149
Author(s):  
M. Mokhtari ◽  
B. Fortin ◽  
O. Bonnaud ◽  
A. Liba ◽  
M. Sarret

2000 ◽  
Vol 369 (1-2) ◽  
pp. 185-188
Author(s):  
Kyu-Hwan Shim ◽  
Hong-Seung Kim ◽  
Jeong-Yong Lee ◽  
Jin-Yeoung Kang ◽  
Min Kyu Song

1987 ◽  
Vol 65 (8) ◽  
pp. 1030-1032 ◽  
Author(s):  
D. Waechter ◽  
N. G. Tarr

A method has been developed for producing low-resistivity phosphorus-doped polysilicon films with a minimum thermal budget. The method involves low-pressure chemical-vapor deposition of amorphous silicon at 560 °C followed by crystallization at 650 °C. Films formed in this manner are compared to films deposited polycrystalline at 627 °C. In both cases, in situ doping is achieved by addition of PH3 diluted in SiH4 to the gas mixture. For a given SiH4: PH3 flow ratio, the phosphorus concentration determined from secondary-ion mass spectroscopy is four times larger in the amorphous-deposited material. Moreover, the resistivity is substantially lower in this material even when the dopant concentrations are similar. The latter result may be due in part to reduced dopant segregation to grain boundaries. The internal strain determined from the Raman line width is larger in the polycrystalline-deposited material but could be reduced by high-temperature annealing.


Author(s):  
F. H. Louchet ◽  
L. P. Kubin

Experiments have been carried out on the 3 MeV electron microscope in Toulouse. The low temperature straining holder has been previously described Images given by an image intensifier are recorded on magnetic tape.The microtensile niobium samples are cut in a plane with the two operative slip directions [111] and lying in the foil plane. The tensile axis is near [011].Our results concern:- The transition temperature of niobium near 220 K: at this temperature and below an increasing difference appears between the mobilities of the screw and edge portions of dislocations loops. Source operation and interactions between screw dislocations of different slip system have been recorded.


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