Planarization of Passivation Layers during Manufacturing Processes of Image Sensors

2006 ◽  
Author(s):  
Alireza Sheikholeslami ◽  
Siegfried Selberherr ◽  
Farnaz Parhami ◽  
Helmut Puchner
Keyword(s):  
Image Sensors ◽  
Manufacturing Processes ◽  
Passivation Layers

DIELECTRICAL ENHANCEMENT AND PASSIVATION LAYERS FOR MAGNETO-OPTICAL THIN FILMS

1988 ◽  
Vol 49 (C8) ◽  
pp. C8-1959-C8-1960 ◽  
Author(s):  
W. Reim ◽  
D. Weller
Keyword(s):  
Thin Films ◽  
Passivation Layers

Impact of fiber structure on edge-wicking of highly-sized paperboard

TAPPI Journal ◽  
2018 ◽  
Vol 17 (08) ◽  
pp. 437-443
Author(s):  
Lebo Xu ◽  
Jeremy Meyers ◽  
Peter Hart
Keyword(s):  
Fiber Surface ◽  
Manufacturing Processes ◽  
Paper Machine ◽  
Liquid Penetration ◽  
Fiber Structure ◽  
Cut Edge ◽  
Local Fiber

Coffee edge-wicking testing was conducted on two groups of highly-sized paperboard manufactured at two mills with similar manufacturing processes, but with vastly different local fiber sources. Although the Hercules size test (HST) indicated similar internal size levels between the two types of board, the edge-wicking behavior was noticeably different. Analysis of fiber structure revealed that the board with more edge-wicking had fibers with thicker fiber walls, which kept the fiber lumen more open after pressing and drying on a paper machine. It was demonstrated that liquid penetration through voids between fibers in highly-sized paperboard was limited, because the fiber surface was well protected by the presence of sufficient sizing agent. Nevertheless, freshly exposed fiber walls and lumens at the cut edge of the sheet were not protected by sizing material, which facilitated edge-wicking. The correlation between fiber structure and edge-wicking behavior was highlighted in this work to inspire development of novel sizing strategies that protect the freshly cut edge of the sheet from edge-wicking.

Object Detection Using an Ideal Observer Model

2020 ◽  
Vol 2020 (16) ◽  
pp. 41-1-41-7
Author(s):  
Orit Skorka ◽  
Paul J. Kane
Keyword(s):  
Object Detection ◽  
Matched Filter ◽  
Image Sensors ◽  
Ideal Observer ◽  
Noise Power ◽  
Relative Evaluation ◽  
Detection And Identification ◽  
Cross Correlation Analysis ◽  
Observer Model ◽  
The Ideal

Many of the metrics developed for informational imaging are useful in automotive imaging, since many of the tasks – for example, object detection and identification – are similar. This work discusses sensor characterization parameters for the Ideal Observer SNR model, and elaborates on the noise power spectrum. It presents cross-correlation analysis results for matched-filter detection of a tribar pattern in sets of resolution target images that were captured with three image sensors over a range of illumination levels. Lastly, the work compares the crosscorrelation data to predictions made by the Ideal Observer Model and demonstrates good agreement between the two methods on relative evaluation of detection capabilities.

Localized Die Metallization Damage Induced During Laser-Marking of a Semiconductor Package

2007 ◽  
Author(s):  
Paul Eric B. Parañal
Keyword(s):  
Laser Beam ◽  
Direct Interaction ◽  
Silica Spheres ◽  
Layer By Layer ◽  
Laser Marking ◽  
Molding Compound ◽  
Molding Material ◽  
Die Surface ◽  
Passivation Layers ◽  
Propagation Medium

Abstract This paper presents a new fail mechanism for laser-marking induced die damage. Discovered during package qualification, silica spheres – commonly used as fillers in the molding material, was shown to act as a propagation medium that promote the direct interaction of the scribing laser beam and the die surface. Critical to the understanding of the fail mechanism is the deprocessing technique devised to allow layer by layer examination of the metallization and passivation layers in an encapsulated silicon die. The technique also made possible the inspection of the molding compound profile directly on top of the affected die area.

An Overview of 300 mm SOI Starting Wafer Quality and Its Yield Detractors

2005 ◽  
Author(s):  
Pei Y. Tsai ◽  
Junedong Lee ◽  
Paul Ronsheim ◽  
Lindsay Burns ◽  
Richard Murphy ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Device Fabrication ◽  
Sampling Plan ◽  
Silicon On Insulator ◽  
Manufacturing Processes ◽  
Circuit Performance ◽  
Characterization Techniques ◽  
Wafer Manufacturing

Abstract A stringent sampling plan is developed to monitor and improve the quality of 300mm SOI (silicon on insulator) starting wafers procured from the suppliers. The ultimate goal is to obtain the defect free wafers for device fabrication and increase yield and circuit performance of the semiconductor integrated circuits. This paper presents various characterization techniques for QC monitor and examples of the typical defects attributed to wafer manufacturing processes.

Studies on a Novel Qualification Method of Silicon Nitride Layer

2016 ◽  
Author(s):  
Younan Hua ◽  
Bingsheng Khoo ◽  
Henry Leong ◽  
Yixin Chen ◽  
Eason Chan ◽  
...  
Keyword(s):  
Silicon Nitride ◽  
Silicon Substrate ◽  
Nitride Layer ◽  
Passivation Layer ◽  
Wafer Fabrication ◽  
Wafer Surface ◽  
Si3n4 Layer ◽  
Silicon Nitride Layer ◽  
Passivation Layers ◽  
Pinhole Test

Abstract In wafer fabrication, a silicon nitride (Si3N4) layer is widely used as passivation layer. To qualify the passivation layers, traditionally chemical recipe PAE (H3PO4+ HNO3) is used to conduct passivation pinhole test. However, it is very challenging for us to identify any pinholes in the Si3N4 layer with different layers underneath. For example, in this study, the wafer surface is Si3N4 layer and the underneath layer is silicon substrate. The traditional receipt of PAE cannot be used for passivation qualification. In this paper, we will report a new recipe using KOH solution to identify the pinhole in the Si3N4 passivation layer.

Towards High Accuracy Fault Diagnosis of Digital Circuits

2004 ◽  
Author(s):  
Camelia Hora ◽  
Stefan Eichenberger
Keyword(s):  
Fault Diagnosis ◽  
Fault Location ◽  
Digital Circuits ◽  
High Accuracy ◽  
Manufacturing Processes ◽  
Diagnosis Method ◽  
Technology Trend

Abstract Due to the development of smaller and denser manufacturing processes most of the hardware localization techniques cannot keep up satisfactorily with the technology trend. There is an increased need in precise and accurate software based diagnosis tools to help identify the fault location. This paper describes the software based fault diagnosis method used within Philips, focusing on the features developed to increase its accuracy.

Turbocharging bio-based manufacturing processes

2020 ◽  
Author(s):  
Ilan Gur
Keyword(s):  
Manufacturing Processes
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