Localized Die Metallization Damage Induced During Laser-Marking of a Semiconductor Package

Author(s):  
Paul Eric B. Parañal

Abstract This paper presents a new fail mechanism for laser-marking induced die damage. Discovered during package qualification, silica spheres – commonly used as fillers in the molding material, was shown to act as a propagation medium that promote the direct interaction of the scribing laser beam and the die surface. Critical to the understanding of the fail mechanism is the deprocessing technique devised to allow layer by layer examination of the metallization and passivation layers in an encapsulated silicon die. The technique also made possible the inspection of the molding compound profile directly on top of the affected die area.

Author(s):  
Luis A. Curiel ◽  
Andrew J. Komrowski ◽  
Daniel J.D. Sullivan

Abstract Acoustic Micro Imaging (AMI) is an established nondestructive technique for evaluation of electronic packages. Non-destructive evaluation of electronic packages is often a critical first step in the Failure Analysis (FA) process of semiconductor devices [1]. The molding compound to die surface interface of the Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) packages is an important interface to acquire for the FA process. Occasionally, with these packages, the standard acoustic microscopy technique fails to identify defects at the molding compound to die surface interface. The hard to identify defects are found at the edge of the die next to the bond pads or under the bonds wires. This paper will present a technique, Backside Acoustic Micro Imaging (BAMI) analysis, which can better resolve the molding compound to die surface interface at the die edge by sending the acoustic signal through the backside of the PBGA and PQFP packages.


2015 ◽  
Vol 806 ◽  
pp. 83-87 ◽  
Author(s):  
Oksana Ganzulenko ◽  
Ani Petkova

The article is devoted to some aspects of laser marking technology for machine parts. We consider the local impact zone effect of the pulse laser beam on the surface of metal materials. The results describing the influence of process parameters on the quality of the being marked images by pulsed laser are submitted. The examples of using barcode marking on several materials for machine parts in selected technological modes of installation are given.


1969 ◽  
Vol 41 (2) ◽  
pp. 424-430 ◽  
Author(s):  
Yasukazu Tanaka

With pinacyanol as the supravital stain, a preferential effect on mitochondria of KB cells was achieved by the irradiation with the ruby laser beam. The observation confirmed the results of other workers using janus green B in the same experimental system. The preferential effect on mitochondria was noted in the area extending 8–10 µ beyond the nonpreferential damage of 4–5 µ in diameter. The opaque material associated with mitochondria possibly represented coagulated protein. The effect involved cristae mitochondriales without severe disarrangement of their structure. The opaque material could be interpreted as the result of direct interaction between mitochondria and the laser beam, even though the mitochondria were noted outside of the previously estimated focal spot size of about 3 µ Within the thickness of 2–4 µ of monolayered cells, larger areas of damage can be accounted for by divergence of the beam which is focused by a microscope objective of very short focal length. A threshold of biologic effectiveness is probably also involved.


2017 ◽  
Vol 11 (1) ◽  
pp. 33-41 ◽  
Author(s):  
Xiaobing Wei ◽  
Cairong Gong ◽  
Xujuan Chen ◽  
Guoliang Fan ◽  
Xinhua Xu

2016 ◽  
Vol 2016 ◽  
pp. 1-7
Author(s):  
K. Ermalitskaia ◽  
E. Voropay

The possibility for double pulse LIBS in the process of a direct layer-by-layer analysis of the titanium-based PVD-coatings on polished flat blank samples of steel and silicon and also of the TiAlN/TiN-coating on a milling cutter is considered. A method is proposed to control thickness of the radiation evaporated layer by defocusing the laser beam with respect to the surface, making it possible to attain the depth resolution of 0.1 μm. The Ti and Ti-Zr-coatings produced using the ion-assisted condensation method and subjected to streams of the nitrogen plasma in a magnetic-plasma compressor are studied.


2011 ◽  
Vol 12 ◽  
pp. 465-469 ◽  
Author(s):  
Rainer J Beck ◽  
Andrew J Waddie ◽  
Jonathan P Parry ◽  
Jonathan D Shephard ◽  
Mohammad R Taghizadeh ◽  
...  

Author(s):  
Jyri Porter ◽  
Kauko Lappalainen

This paper presents how laser milling can replace conventional milling for producing selected features in thin-walled structures of space instrument parts. Example parts are shown. In the final stages of the manufacturing process the produced thin-walled structures require special attention to avoid vibration, unwanted deformation and even catastrophic destruction of the part. This requires careful planning of machining operations and fixture design which in turn can take considerable time. Laser milling is a slow material removal process. It is generally used only for finishing features that normal chip cutting tools cannot reach. However, in the case of the part having thin-walled structures, laser milling has the extra benefit of causing practically no deflection or vibration due to machining forces and consequently it requires minimal fixturing. Generally the laser beam should mill the material in the direction of its smallest depth to minimize recast and form errors that accumulate layer by layer. It is also possible to mill out solid chunks of material without fear of catastrophic collisions, unlike in chip cutting. This can reduce the milled volume thus speeding up the process considerably. Laser milling has special requirements with regard to the depth-width ratio of cavities, sidewall verticalness, and geometrical form of the raw stock. One must also consider where the laser beam hits after perforating the desired surface. In many cases combining laser milling with traditional machining is the fastest way to produce one-of-a-kind parts.


Author(s):  
Prasanna Gandhi ◽  
Kiran Bhole

Microstereolithography (MSL) has been a promising technology for fabrication of three-dimensional (3D) microstructure using layer-by-layer photopolymerization. However, this process produces 3D microstructures with a step corresponding to each layer. We propose in this paper a novel way, termed as ‘Bulk Lithography’, of generating 3D microstructures in single-pass scanning of laser beam over the photopolymer resin of unconstraint depth. In the proposed method, laser energy exposure, being one of the important parameters affecting cured depth, is varied along the line scan to enable fabrication of varying depth structure. Test structure is fabricated with proposed method to illustrate the capability of the proposed process. Lesser fabrication time and step-free 3D microfabrication in the direction perpendicular to the scan plane (z-axis) are the key features of the proposed method.


2020 ◽  
Vol 60 (5) ◽  
pp. 435-439
Author(s):  
Mihail Stoyanov Mihalev ◽  
Chavdar Momchilov Hardalov ◽  
Christo Georgiev Christov ◽  
Monika Rinke ◽  
Harald Leiste ◽  
...  

In this paper, the process of an additive laser marking on stainless steel parts for barcode printing is presented. It is based on the use of one transition metal oxide chemically-well bonded to the stainless steel substrate, without a usage of any additional materials and cleaning substances. The resulting additive coatings, produced from initial MoO3 powder by irradiation with a laser beam, reveal strong adhesion, high hardness, long durability and high optical contrast, which make the process suitable for barcode printing on materials such as high reflective stainless steel, which was always a challenge for the classical laser marking technologies. The obtained bar patterns are in a compliance with the requirements of the existing standards.


Author(s):  
Wahaizad Bin Safiei ◽  
Mohd Rashdan Bin Ab Rashid

High-quality products and shorten manufacturing lead time are very important factors addressed by many companies. Typically, low-quality products are induced by inconsistent of manufacturing process performance. To get a constant laser power in Infrared (IR) Laser Marking process was a common problem facing by many engineers in the manufacturing industry. This consequences might effect on laser marking characteristics such as the possibility of burn marking or blur marking particularly on the products. Therefore, the objective of this paper is to study the interaction between Infrared (IR) Laser Marking input parameters such as current (amp), frequency (Hz), water flow (l/min) and laser beam size (mm) on laser power (watt) as the main response. Furthermore, the response of laser power from Infra-Red laser process can be predicted when all combinations of parameters are tested. The IR marking machine was deployed and experimental studies were conducted in order to meet this objective. The experiments were based on Design of Experiment (DOE) and Response Surface Methodology (RSM) because second order model or polynomial equation was needed to fit for the response. The relationship between input and output parameters can be visualized by 3D graphs which were developed from Mathematical modeling. Based on the experiment results, the parameters that have significant effects on the laser power are current, laser beam size and water flow. However, frequency does not have a significant factor in this study.


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