Reliability test to key components of radio fuze under high impact and high temperature

2009 ◽  
Author(s):  
Ya Zhang ◽  
Bo Li ◽  
Hongxiang Zhang
Keyword(s):  
High Temperature ◽  
High Impact ◽  
Reliability Test

First Demonstration of High Temperature SiC CMOS Gate Driver in Bridge Leg for Hybrid Power Module Application

2018 ◽  
Vol 924 ◽  
pp. 854-857
Author(s):  
Ming Hung Weng ◽  
Muhammad I. Idris ◽  
S. Wright ◽  
David T. Clark ◽  
R.A.R. Young ◽  
...  
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Initial Increase ◽  
Reliability Test ◽  
Power Devices ◽  
Power Module ◽  
Hybrid Power ◽  
Gate Driver ◽  
Passive Circuit

A high-temperature silicon carbide power module using CMOS gate drive technology and discrete power devices is presented. The power module was aged at 200V and 300 °C for 3,000 hours in a long-term reliability test. After the initial increase, the variation in the rise time of the module is 27% (49.63ns@1,000h compared to 63.1ns@3,000h), whilst the fall time increases by 54.3% (62.92ns@1,000h compared to 97.1ns@3,000h). The unique assembly enables the integrated circuits of CMOS logic with passive circuit elements capable of operation at temperatures of 300°C and beyond.

scholarly journals Coupling physics in machine learning to predict properties of high-temperatures alloys

2020 ◽  
Vol 6 (1) ◽  
Author(s):  
Jian Peng ◽  
Yukinori Yamamoto ◽  
Jeffrey A. Hawk ◽  
Edgar Lara-Curzio ◽  
Dongwon Shin
Keyword(s):  
Machine Learning ◽  
High Temperature ◽  
Yield Strength ◽  
Strengthening Mechanism ◽  
Current Approach ◽  
High Impact ◽  
Data Driven ◽  
High Temperature Alloy ◽  
High Temperature Alloys ◽  
Verification Process

Abstract High-temperature alloy design requires a concurrent consideration of multiple mechanisms at different length scales. We propose a workflow that couples highly relevant physics into machine learning (ML) to predict properties of complex high-temperature alloys with an example of the 9–12 wt% Cr steels yield strength. We have incorporated synthetic alloy features that capture microstructure and phase transformations into the dataset. Identified high impact features that affect yield strength of 9Cr from correlation analysis agree well with the generally accepted strengthening mechanism. As a part of the verification process, the consistency of sub-datasets has been extensively evaluated with respect to temperature and then refined for the boundary conditions of trained ML models. The predicted yield strength of 9Cr steels using the ML models is in excellent agreement with experiments. The current approach introduces physically meaningful constraints in interrogating the trained ML models to predict properties of hypothetical alloys when applied to data-driven materials.

Reliability Test Integrating Electrical and Mechanical Stress at High Temperature for a-InGaZnO Thin Film Transistors

2019 ◽  
Vol 19 (2) ◽  
pp. 433-436 ◽  
Author(s):  
Yu-Ching Tsao ◽  
Ting-Chang Chang ◽  
Shin-Ping Huang ◽  
Yu-Lin Tsai ◽  
Yu-Chieh Chien ◽  
...  
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
Mechanical Stress ◽  
Thin Film Transistors ◽  
Reliability Test

scholarly journals Simulation-Based Design and Optimization of Accelerometers Subject to High-Temperature and High-Impact Loads

Sensors ◽  
2019 ◽  
Vol 19 (17) ◽  
pp. 3759 ◽  
Author(s):  
Ji Li ◽  
Yaling Tian ◽  
Junjie Dan ◽  
Zhuming Bi ◽  
Jinhui Zheng ◽  
...  
Keyword(s):  
High Temperature ◽  
High Impact ◽  
Impact Loads ◽  
Sensing Element ◽  
Design And Optimization ◽  
Static And Dynamic Analysis ◽  
Simulation Based Design ◽  
Coupling Behavior ◽  
Simulation Based ◽  
Complete Failure

Due to multi-factor coupling behavior, the performance evaluation of an accelerometer subject to high-temperature and high-impact loads poses a significant challenge during its design phase. In this paper, the simulation-based method is applied to optimize the design of the accelerometer. The proposed method can reduce the uncertainties and improve the fidelity of the simulation in the sense that (i) the preloading conditions of fasteners are taken into consideration and modeled in static analysis; (ii) all types of loadings, including bolt preloads, thermal loads, and impact loads, are defined in virtual dynamic prototype of the accelerometer. It is our finding that from static and dynamic analysis, an accelerometer is exposed to the risk of malfunction and even a complete failure if the temperature rises to a certain limit; it has been proved that the thermal properties of sensing components are the most critical factors for an accelerometer to achieve its desired performance. Accordingly, we use a simulation-based method to optimize the thermal expansion coefficient of the sensing element and get the expected design objectives.

High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys

2017 ◽  
Vol 28 (10) ◽  
pp. 7277-7285 ◽  
Author(s):  
Bakhtiar Ali ◽  
Mohd Faizul Mohd Sabri ◽  
Suhana Mohd Said ◽  
Nazatul Liana Sukiman ◽  
Iswadi Jauhari ◽  
...  
Keyword(s):  
High Temperature ◽  
High Impact ◽  
Solder Alloys ◽  
Temperature Performance ◽  
Impact Reliability

Impact of Threading Dislocations Detected by KOH Etching on 4H-SiC 650 V MOSFET Device Failure after Reliability Test

2020 ◽  
Vol 1004 ◽  
pp. 472-476
Author(s):  
Andrea Severino ◽  
Ruggero Anzalone ◽  
Nicolò Piluso ◽  
Elisa Vitanza ◽  
Beatrice Carbone ◽  
...  
Keyword(s):  
High Temperature ◽  
Wet Etching ◽  
Underlying Structure ◽  
Reliability Test ◽  
Defect Classification ◽  
Threading Dislocations ◽  
Dislocation Defects ◽  
Failure Location ◽  
Failure Site ◽  
Koh Etching

In this study, the correlation between the Emission Microscopy (Em.Mi.) related to the failure site of the 4H-SiC 650V MOSFET devices after reliability test and epitaxial dislocation defects is presented. Devices failed at the High-Temperature Reverse Bias (HTRB) test were considered. Device layers have been stripped out by chemical wet etching and etched in a high temperature KOH solution to characterize defects emerging at the SiC surface. This approach was used to correlate failure emission spots with underlying structure of the material. KOH etching process on delayered devices was performed at 500°C for 10 minutes and then analysis by optical microscopy and SEM was carried out for defect classification and correlation with failure location.

TLP NINE

Alloy Digest ◽  
2001 ◽  
Vol 50 (4) ◽  
Keyword(s):  
Wear Resistance ◽  
High Temperature ◽  
Powder Metallurgy ◽  
Impact Toughness ◽  
Physical Properties ◽  
Heat Treating ◽  
High Impact ◽  
High Wear Resistance ◽  
Temperature Performance ◽  
Very High

Abstract Timken Latrobe Steel TLP Nine is made by powder metallurgy. It is an air-hardening tool steel with very high wear resistance and high impact toughness. This datasheet provides information on composition, physical properties, hardness, and elasticity. It also includes information on high temperature performance as well as heat treating and machining. Filing Code: TS-585. Producer or source: Timken Latrobe Steel.

Lumen Maintenance of Ternary Ag-Alloy Wire Bonded LED Package after Reliability Tests

2020 ◽  
Vol 1003 ◽  
pp. 275-280 ◽  
Author(s):  
Jui Hung Yuan ◽  
Tung Han Chuang ◽  
Ju Hui Chuang
Keyword(s):  
High Temperature ◽  
White Light ◽  
Electrical Resistance ◽  
Oxidation Reaction ◽  
Reliability Test ◽  
Bonding Wire ◽  
Dynamic Reliability ◽  
Alloy Wire ◽  
Brightness Decay ◽  
Maintenance Performance

In this investigation, ternary Ag-alloy wires were doped with different Pd and Au concentrations, and each wire was encapsulated in an LED package. The static and dynamic reliability were tested, and the lumen maintenance performance was examined. The static reliability tests included the sulfur test, LTSL, HTSL, and WHTSL. According to the sulfur test data, higher Pd and Au contents led to better lumen maintenance. Furthermore, the bonding wire of the LED with better lumen maintenance in the sulfur test had higher electrical resistance. The brightness decay rate of the white light LEDs was low in low-and high-temperature environments, but it was significantly higher after the WHTSL test. The dynamic reliability test after 1,000 hours of HTOL and WHTOL showed that the lumen maintenance improved with higher Pd and Au contents, indicating that doping Ag-alloy wires with sufficient amounts of Pd and Au can retard degradation due to thermal and humidity aging and oxidation reaction. Therefore, ternary Ag-Pd-Au alloy wires produced with specific drawing and annealing processes are suitable for application to mid-power white light LEDs.

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