A Parametric Simulative Study for Si and SiC Semiconductor Devices Under Various Accelerated Testing Conditions Using Rate- and Temperature Dependent Inelastic Material Data

2021 ◽  
Author(s):  
Freerik Forndran ◽  
Jens Heilmann ◽  
Martin Metzler ◽  
Markus Leicht ◽  
Bernhard Wunderle
Keyword(s):  
Semiconductor Devices ◽  
Accelerated Testing ◽  
Temperature Dependent ◽  
Testing Conditions ◽  
Material Data ◽  
Inelastic Material

Predicting and Comparing Electromigration Failure for Different Test Structures

1994 ◽  
Vol 338 ◽  
Author(s):  
D.D. Brown ◽  
M.A. Korhonen ◽  
P. Børgesen ◽  
C.-Y. Li
Keyword(s):  
Growth Rates ◽  
Void Growth ◽  
Semiconductor Industry ◽  
Standard Test ◽  
Test Structure ◽  
Accelerated Testing ◽  
Interfacial Diffusion ◽  
Testing Conditions ◽  
Long Line

ABSTRACTElectromigration and stress migration are important reliability concerns in the semiconductor industry. Relative and absolute assessments of lifetimes generally rely on the accelerated testing of ‘standard’ test structures. However, the sensitivity to various important electromigration phenomena is found to depend strongly on the type of test structure. Two common structures for electromigration testing are (i) a long line with large pads at either end and (ii) a more realistic interconnect line with W-studs at the line end. The effects of (a) different flux divergences at the line end, (b) interfacial diffusion, and (c) Cu-depletion generally result in different lifetimes for the two types of test structures under the same testing conditions. In this paper, we compare void growth rates and mean times to failure for both types of test structure taking these effects into account. Our results are used to explain differences in MTF values reported in the literature for different test structures.

Behaviour and Mean Life Prediction of Solar Mirrors from Parabolic Trough Collectors under Accelerated Degradation/Reliability Testing

2014 ◽  
Vol 656 ◽  
pp. 442-449 ◽  
Author(s):  
Sebastian Marian Zaharia ◽  
Camil Lancea ◽  
Lucia Antoneta Chicoș ◽  
Giampaolo Caputo
Keyword(s):  
Life Prediction ◽  
Salt Spray ◽  
Operating Conditions ◽  
Accelerated Testing ◽  
Reliability Testing ◽  
Parabolic Trough ◽  
Testing Conditions ◽  
Accelerated Degradation ◽  
Development Costs ◽  
The Mean

The scope of this paper is focuses on the study of the behaviour and of the mean life of materials (solar mirrors from parabolic - trough collectors) from the field of renewable energies, using accelerated degradation/reliability testing. This paper is focused on influence of environmental factors (temperature, humidity, UV and salt spray) at mean life of solar mirrors from parabolic - trough collectors under accelerated testing conditions. In today’s highly competitive environment, companies are pressured to shorten their development cycles, reduce development costs and produce highly reliable products. Accelerated reliability/durability tests are a very powerful tool in achieving these goals, providing the means to observe failures more rapidly under higher-stress operating conditions while accurately predicting reliability under normal operating conditions.

scholarly journals An Analytic Expression of Thermal Diffusion Coefficient for the Hydrodynamic Simulation of Semiconductor Devices

VLSI Design ◽  
2001 ◽  
Vol 13 (1-4) ◽  
pp. 131-134 ◽  
Author(s):  
Ting-Wei Tang ◽  
Xinlin Wang ◽  
Haitao Gan ◽  
Meikei Ieong
Keyword(s):  
Diffusion Coefficient ◽  
Thermal Diffusion ◽  
Transport Coefficient ◽  
Semiconductor Devices ◽  
Temperature Dependent ◽  
Hydrodynamic Simulation ◽  
Thermal Diffusion Coefficient ◽  
Analytical Expression ◽  
Analytic Expression

A new analytical expression of thermal diffusion coefficient DT is derived. To the firstorder approximation, it is given by (1+η)-1(D/Tn) rather than (1–η)(D/Tn) where η=–(Tn/η*)(∂η*/∂Tn ) and η* represents the temperature-dependent bulk mobility. This new transport coefficient is implemented in our 2-D hydrodynamic device simulator and it seems to produce more reasonable results.

Cavitation Behavior Observed in Three Monoleaflet Mechanical Heart Valves Under Accelerated Testing Conditions

ASAIO Journal ◽  
2008 ◽  
Vol 54 (2) ◽  
pp. 163-171 ◽  
Author(s):  
Chi-Wen Lo ◽  
Jia-Shing Liu ◽  
Chi-Pei Li ◽  
Po-Chien Lu ◽  
Ned H. Hwang
Keyword(s):  
Heart Valves ◽  
Accelerated Testing ◽  
Mechanical Heart Valves ◽  
Testing Conditions ◽  
Cavitation Behavior

scholarly journals On the Reliability of Accelerated Testing in AIGaAs/InGaAs/GaAs PHEMTs

2002 ◽  
Vol 26 (2) ◽  
pp. 115-127 ◽  
Author(s):  
K. F. Yarn ◽  
W. C. Chien ◽  
C. S. Wang
Keyword(s):  
Schottky Barrier ◽  
Accelerated Testing ◽  
Hot Electron ◽  
Degradation Mechanisms ◽  
Temperature Dependent ◽  
Barrier Effects

The study of different stress on device characteristics of AlGaAs/InGaAs/GaAs PHEMTs has been researched and developed in this report. Many catastrophic degradation mechanisms such as hot-electron, gate-drain breakdown,IDS,IG,VPand gate Schottky barrier effects are discussed in detail. In addition, the accelerated testing of the temperature-dependent effects onID,Gmand Schottky barrier are examined.

Wave-Front Stress Relaxation in a One-Dimensional Nonlinear Inelastic Material With Temperature and Position Dependent Properties

1971 ◽  
Vol 38 (1) ◽  
pp. 47-50 ◽  
Author(s):  
R. P. Shaw ◽  
F. A. Cozzarelli
Keyword(s):  
Temperature Field ◽  
Wave Front ◽  
Material Properties ◽  
Plastic Material ◽  
Nonuniform Temperature ◽  
Temperature Dependent ◽  
One Dimensional ◽  
Nonuniform Temperature Field ◽  
Nonlinear Viscoelastic ◽  
Inelastic Material

Analytical solutions are obtained for stress, velocity, and strain at the wave front in a suddenly loaded semi-infinite rod of a material with a linear instantaneous response and nonlinear inelastic response. The material properties are assumed to depend on position directly or through a dependence on a prescribed nonuniform temperature field. Detailed solutions are obtained for two examples—a nonlinear viscoelastic material with temperature dependent parameters and a rate-sensitive plastic material which may have temperature dependent parameters and yield point.

Using Nonlinear Kinematic Hardening Material Models for Elastic-Plastic Ratcheting Analysis

2015 ◽  
Author(s):  
Tim Gilman ◽  
Bill Weitze ◽  
Jürgen Rudolph ◽  
Adrian Willuweit ◽  
Arturs Kalnins
Keyword(s):  
Material Model ◽  
Pressure Vessels ◽  
Growth Strain ◽  
Temperature Dependent ◽  
Material Models ◽  
Hardening Material ◽  
Material Parameters ◽  
Elastic Plastic ◽  
Material Data ◽  
Inelastic Analysis

Applicable design codes for power plant components and pressure vessels demand for a design check against progressive plastic deformation. In the simplest case, this demand is satisfied by compliance with shakedown rules in connection with elastic analyses. The possible non-compliance implicates the requirement of ratcheting analyses on elastic-plastic basis. In this case, criteria are specified on maximum allowable accumulated growth strain without clear guidance on what material models for cyclic plasticity are to be used. This is a considerable gap and a challenge for the practicing CAE (Computer Aided Engineering) engineer. As a follow-up to two independent previous papers PVP2013-98150 ASME [1] and PVP2014-28772 [2] it is the aim of this paper to close this gap by giving further detailed recommendation on the appropriate application of the nonlinear kinematic material model of Chaboche on an engineering scale and based on implementations already available within commercial finite element codes such as ANSYS® and ABAQUS®. Consistency of temperature-dependent runs in ANSYS® and ABAQUS® is to be checked. All three papers together constitute a comprehensive guideline for elasto-plastic ratcheting analysis. The following issues are examined and/or referenced: • Application of monotonic or cyclic material data for ratcheting analysis based on the Chaboche material model • Discussion of using monotonic and cyclic data for assessment of the (non-stabilized) cyclic deformation behavior • Number of backstress terms to be applied for consistent ratcheting results • Consideration of the temperature dependency of the relevant material parameters • Consistency of temperature-dependent runs in ANSYS® and ABAQUS® • Identification of material parameters dependent on the number of backstress terms • Identification of material data for different types of material (carbon steel, austenitic stainless steel) including the appropriate determination of the elastic limit • Quantification of conservatism of simple elastic-perfectly plastic behavior • Application of engineering versus true stress-strain data • Visual checks of data input consistency • Appropriate type of allowable accumulated growth strain. This way, a more accurate inelastic analysis methodology for direct practical application to real world examples in the framework of the design code conforming elasto-plastic ratcheting check is proposed.

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