Discrete Test Structure Device Degradation Analysis and Correlation to NAND Flash Circuit Operation

2010 ◽  
Author(s):  
Jasper Gibbons ◽  
Puneet Sharma ◽  
Steve Porter ◽  
Jim Fulford ◽  
Praveen Vaidyanathan ◽  
...  
Keyword(s):  
Test Structure ◽  
Nand Flash ◽  
Degradation Analysis

Degradation Analysis and Degradation Suppression Technology Caused by Light Absorption at Active Layer Facet of GaInAsP Laser Diode

2008 ◽  
Vol 128 (5) ◽  
pp. 732-737
Author(s):  
Hiroyuki Ichikawa ◽  
Masashi Ito ◽  
Chie Fukuda ◽  
Kotaro Hamada ◽  
Akira Yamaguchi ◽  
...  
Keyword(s):  
Active Layer ◽  
Laser Diode ◽  
Light Absorption ◽  
Degradation Analysis

Novel Three Dimensional (3D) NAND Flash Memory Array Having Tied Bit-line and Ground Select Transistor (TiGer)

2012 ◽  
Vol E95.C (5) ◽  
pp. 837-841 ◽  
Author(s):  
Se Hwan PARK ◽  
Yoon KIM ◽  
Wandong KIM ◽  
Joo Yun SEO ◽  
Hyungjin KIM ◽  
...  
Keyword(s):  
Flash Memory ◽  
Three Dimensional ◽  
Nand Flash ◽  
Nand Flash Memory ◽  
Memory Array

Energy-Scalable 4KB LDPC Decoding Architecture for NAND-Flash-Based Storage Systems

2016 ◽  
Vol E99.C (2) ◽  
pp. 293-301 ◽  
Author(s):  
Youngjoo LEE ◽  
Jaehwan JUNG ◽  
In-Cheol PARK
Keyword(s):  
Storage Systems ◽  
Nand Flash ◽  
Ldpc Decoding

Development of Test Structure for Variability Evaluation using Charge-Based Capacitance Measurement

2014 ◽  
Vol E97.C (11) ◽  
pp. 1117-1123 ◽  
Author(s):  
Katsuhiro TSUJI ◽  
Kazuo TERADA ◽  
Ryota KIKUCHI
Keyword(s):  
Test Structure ◽  
Capacitance Measurement

Thermal Degradation Analysis of Fluorocarbon Thin Films prepared by an r.f. Sputtering with Poly (tetrafluoroethylene) Target

2013 ◽  
Vol 56 (4) ◽  
pp. 133-135
Author(s):  
Yuki IKEDA ◽  
Satoru IWAMORI ◽  
Hiroyuki MATSUMOTO ◽  
Kiyoshi YOSHINO ◽  
Itsuo NISHIYAMA ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Degradation ◽  
Degradation Analysis

Degradation Analysis of Thick Film Chip Resistors

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Diganta Das ◽  
Michael H. Azarian ◽  
Michael Pecht
Keyword(s):  
Thick Film ◽  
Printed Circuit Board ◽  
Negative Resistance ◽  
Circuit Board ◽  
High Humidity ◽  
Circuit Boards ◽  
Chemical Modifications ◽  
Current Leakage ◽  
Printed Circuit ◽  
Degradation Analysis

Abstract Negative resistance drift in thick film chip resistors in high temperature and high humidity application conditions was investigated. This paper reports on the investigation of possible causes including formation of current leakage paths on the printed circuit board, delamination between the resistor protective coating and laser trim, and the possibility of silver migration or copper dendrite formation. Analysis was performed on a set of circuit boards exhibiting failures due to this phenomenon. Electrical tests after mechanical and chemical modifications showed that the drift was most likely caused by moisture ingress that created a conductive path across the laser trim.

Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing

2012 ◽  
Author(s):  
P. Larré ◽  
H. Tupin ◽  
C. Charles ◽  
R.H. Newton ◽  
A. Reverdy
Keyword(s):  
Electron Beam ◽  
Failure Analysis ◽  
Test Structure ◽  
Precise Localization ◽  
Isolation Method ◽  
Accurate Detection ◽  
Conventional Methods ◽  
Technology Nodes ◽  
Tem Lamella

Abstract As technology nodes continue to shrink, resistive opens have become increasingly difficult to detect using conventional methods such as AVC and PVC. The failure isolation method, Electron Beam Absorbed Current (EBAC) Imaging has recently become the preferred method in failure analysis labs for fast and highly accurate detection of resistive opens and shorts on a number of structures. This paper presents a case study using a two nanoprobe EBAC technique on a 28nm node test structure. This technique pinpointed the fail and allowed direct TEM lamella.

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