Epifluorescence microscopy study of a quadruple node of triple junctions of grain boundaries in a Eu 2+ ‐doped Kcl:Kbr solid solution by using the doping ion as a fluorochrome

2018 ◽  
Vol 271 (3) ◽  
pp. 325-336 ◽  
Author(s):  
A.E. CORDERO‐BORBOA ◽  
R. UNDA‐ANGELES
Microscopy ◽  
2020 ◽  
Vol 69 (1) ◽  
pp. 17-25
Author(s):  
Adolfo Ernesto Cordero-Borboa ◽  
Rodrigo Unda-Angeles

Abstract The shape and orientation of second-phase precipitates in a Eu2+-doped equimolar KCl:KBr solid solution are reported in this paper as they were unveiled by epifluorescence microscopy. To make this, microscopy images of different optical cross sections of some precipitate fields and, also, of some representative precipitates in these fields, were recorded by using the Eu2+ ion itself as a fluorochrome. From these images, the corresponding precipitate fields and individual precipitates were electronically reconstructed into the host lattice space. Previously, the KCl:KBr:Eu2+ system was characterized by absorption and fluorescence optical spectrophotometry, to tailor properly the fluorescence mirror unit, as well as by powder and single-plate X-ray diffraction, to correlate the host lattice orientation with those of the observed precipitates. These are shaped as plates, with broad faces parallel to host lattice {100}, {110} or {120}planes (the {100}, {110} and {120} precipitates, respectively), and as rods, aligned with a host lattice ˂100> direction (the ˂100> precipitates). The {100}, {110}, {120}-precipitate broad faces are in the shapes of 72.6° rhomboids, rectangles and 59.5° rhomboids, with a side lying along host lattice <310>, <110> and <421> directions, respectively, and with another side lying along a <100> direction. A typical precipitate field and the spatial reconstructions of typical {100}, {110}, {120} and ˂100> precipitates, as well as their corresponding electronic 3D-geometrical models, are described in detail. It is discussed that four different europium precipitation states are responsible for the precipitation and that the precipitate lattices are spatially coherent with the host lattice.


Author(s):  
Z. Horita ◽  
D. J. Smith ◽  
M. Furukawa ◽  
M. Nemoto ◽  
R. Z. Valiev ◽  
...  

It is possible to produce metallic materials with submicrometer-grained (SMG) structures by imposing an intense plastic strain under quasi-hydrostatic pressure. Studies using conventional transmission electron microscopy (CTEM) showed that many grain boundaries in the SMG structures appeared diffuse in nature with poorly defined transition zones between individual grains. The implication of the CTEM observations is that the grain boundaries of the SMG structures are in a high energy state, having non-equilibrium character. It is anticipated that high-resolution electron microscopy (HREM) will serve to reveal a precise nature of the grain boundary structure in SMG materials. A recent study on nanocrystalline Ni and Ni3Al showed lattice distortion and dilatations in the vicinity of the grain boundaries. In this study, HREM observations are undertaken to examine the atomic structure of grain boundaries in an SMG Al-based Al-Mg alloy.An Al-3%Mg solid solution alloy was subjected to torsion straining to produce an equiaxed grain structure with an average grain size of ~0.09 μm.


2015 ◽  
Vol 107 ◽  
pp. 134-138 ◽  
Author(s):  
Wenhong Yin ◽  
Weiguo Wang ◽  
Xiaoying Fang ◽  
Congxiang Qin ◽  
Xiaoguang Xing

Materials ◽  
2021 ◽  
Vol 14 (19) ◽  
pp. 5522
Author(s):  
Kai-Cheng Shie ◽  
Po-Ning Hsu ◽  
Yu-Jin Li ◽  
Dinh-Phuc Tran ◽  
Chih Chen

The failure mechanisms of Cu–Cu bumps under thermal cycling test (TCT) were investigated. The resistance change of Cu–Cu bumps in chip corners was less than 20% after 1000 thermal cycles. Many cracks were found at the center of the bonding interface, assumed to be a result of weak grain boundaries. Finite element analysis (FEA) was performed to simulate the stress distribution under thermal cycling. The results show that the maximum stress was located close to the Cu redistribution lines (RDLs). With the TiW adhesion layer between the Cu–Cu bumps and RDLs, the bonding strength was strong enough to sustain the thermal stress. Additionally, the middle of the Cu–Cu bumps was subjected to tension. Some triple junctions with zig-zag grain boundaries after TCT were observed. From the pre-existing tiny voids at the bonding interface, cracks might initiate and propagate along the weak bonding interface. In order to avoid such failures, a postannealing bonding process was adopted to completely eliminate the bonding interface of Cu–Cu bumps. This study delivers a deep understanding of the thermal cycling reliability of Cu–Cu hybrid joints.


2018 ◽  
Vol 82 (9) ◽  
pp. 1125-1129
Author(s):  
G. M. Poletaev ◽  
I. V. Zorya ◽  
M. D. Starostenkov ◽  
R. Yu. Rakitin

2010 ◽  
Vol 654-656 ◽  
pp. 623-626 ◽  
Author(s):  
Y.J. Wu ◽  
Li Ming Peng ◽  
X.Q. Zeng ◽  
D.L. Lin ◽  
W.J. Ding

The coherent fine-lamellae consisting of the 2H-Mg and the 14H-type long period stacking ordered (LPSO) structure within α'-Mg matrix have been observed in an as-cast Mg–Gd–Zn–Zr alloy. During subsequent solid solution heat treatment at 773 K, in addition to the lamellae within matrix, a novel lamellar X phase [Mg–(8.37±1.0)Zn–(11.32±1.0)Gd] with the 14H-type LPSO structure was transformed from the dendritical β phase. The 14H-type LPSO structure existing in Mg–Gd–Zn–Zr alloys derives from two variant ways: formation of the 14H-type LPSO structure comes from two variant means: i.e., the formation within matrix and the phase transformation from the β phase to the X phase in grain boundaries.


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