Investigation of Flip-Chip Bonding for MEMS Applications

2004 ◽  
Vol 126 (1) ◽  
pp. 48-51 ◽  
Author(s):  
W. Salalha ◽  
E. Zussman ◽  
P. Z. Bar-Yoseph
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Flip Chip ◽  
Bond Number ◽  
Bonding Process ◽  
Mems Devices ◽  
Finite Element Analyses ◽  
Flip Chip Bonding ◽  
Solder Volume ◽  
Simulation Results

An investigation of the flip-chip bonding process for application in MEMS devices was carried out. Finite element analyses of axisymmetric and non-axisymmetric solder joint geometries were performed. It was found that in typical cases of MEMS devices in which the solder volume is small (Bo≪1, where Bo is the Bond number), the finite element solution of the axisymmetric solder joint is well approximated by a surface of revolution whose generating meridian is a circular arc. Experimental results of solder joints in flip-chip assembly were found to correlate well with simulation results.

Tether System Designed for Flip-Chip Bonded MEMS

2003 ◽  
Author(s):  
Alexander Laws ◽  
Faheem Faheem ◽  
Huantong Zhang ◽  
Y. C. Lee
Keyword(s):  
Flip Chip ◽  
Mems Devices ◽  
Release Process ◽  
Design Rules ◽  
Donor Substrate ◽  
Flip Chip Bonding ◽  
Novel Devices

Flip-chip bonding is important to integrate MEMS devices with other components or to make novel devices. The use of tethers when flip-chip bonding is valuable because it enables the release of the MEMS based device prior to bonding. Releasing the device prior to bonding allows the possibility to bond to a substrate that includes materials that are incompatible with the release process, increase yield since any devices lost during release are not bonded, and avoid damage to the bond. This paper presents a set of design rules for devices created with the MUMPs process that can be implemented to allow the device to be tether flip-chip bonded. The rules outline the design of tethers, mechanical stops, and locking bumps, which work as a system to keep the device from slipping or twisting during bonding, but break free from the donor substrate after bonding. Examples of success, reasons for past failures and the solutions are presented.

scholarly journals Repeatability of Full-Scale Crash Tests and Criteria for Validating Simulation Results

1996 ◽  
Vol 1528 (1) ◽  
pp. 155-160 ◽  
Author(s):  
Malcolm H. Ray
Keyword(s):  
Finite Element ◽  
Full Scale ◽  
Crash Test ◽  
Test Results ◽  
Finite Element Analyses ◽  
Element Analysis ◽  
Acceleration Time Histories ◽  
Time Histories ◽  
Simulation Results ◽  
Crash Tests

A method of comparing two acceleration time histories to determine whether they describe similar physical events is described. The method can be used to assess the repeatability of full-scale crash tests and it can also be used as a criterion for assessing how well a finite-element analysis of a collision event simulates a corresponding full-scale crash test. The method is used to compare a series of six identical crash tests and then is used to compare several finite-element analyses with full-scale crash test results.

FEM Simulation of Quartz Thickness Shear Mode Resonator for Gas Sensing Applications

2014 ◽  
Vol 605 ◽  
pp. 569-572
Author(s):  
Pavel Kulha ◽  
Igor Laposa ◽  
Alexandr Laposa ◽  
Miroslav Husák
Keyword(s):  
Finite Element ◽  
Shear Mode ◽  
Mems Devices ◽  
Sensitive Layer ◽  
Adsorption Effect ◽  
Selective Layer ◽  
Thickness Shear Mode ◽  
Sensing Applications ◽  
Simulation Results ◽  
Thickness Shear

The objective of this paper is to present simulation results of the Thickness Shear Mode (TSM) resonator based on quartz using finite element simulation method. 3D model of quartz resonator and simulations were completed using finite element method in CoventorWare software suite for design and simulation of MEMS devices. Different techniques for simulation of adsorption effect on selective layer were studied: influence of change in mass of the sensitive layer and influence of change in density of the sensitive layer. Analyses of resonant modes were performed for both cases and displacement profiles in selected modes were determined for the resonator under study. Impedance and phase characteristics were calculated and measured for clean sample and sample with selective layer coated. The adsorption model calculates the frequency shift in basic resonant frequency with adsorbed amount of sensed gas. The simulation results were used in design of gas sensors for dangerous substances detection.

Computational Modeling for the Dynamic Simulation of Paper and its Application to Some Paper Handling Problems

1998 ◽  
Author(s):  
Shinya Sekimoto ◽  
Makoto Ukai
Keyword(s):  
Finite Element ◽  
Rigid Wall ◽  
The Self ◽  
Bending Test ◽  
Flexible Plate ◽  
Finite Element Analyses ◽  
Element Analysis ◽  
Linear Finite Element ◽  
The Finite Element Analysis ◽  
Simulation Results

Abstract This paper deals with the paper handling problems in highspeed labor saving machines. Non-linear finite element analyses are done for a lightweight and flexible plate or beam leaping from a sliding constraint and colliding against a rigid wall. The fluid force of air and the paper elasticity are taken into account. The elastic property of paper is identified by comparing the “self-bending test” and the finite element analysis. The effect of geometrical stiffness with an initial deformation is studied. The change of the flying orbit is shown with flat paper and geometrically stiffened paper. The behavior of paper after colliding against a rigid wall is also simulated with the parameters of the paper velocity and the friction coefficient between the paper and the wall. The simulation results agree well with the designers’ experiences and help the designers design new machines with higher speed.

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