Reliability of the Flexible Display STN LCD Based Environmental Test

2009 ◽  
Author(s):  
Pan-Dong Fan ◽  
Qiang Miao ◽  
Ping Yang ◽  
Quayle Chen ◽  
Tom Xue ◽  
...  
Keyword(s):  
Failure Modes ◽  
Test Procedure ◽  
Large Angle ◽  
Cold Test ◽  
Electronic Packages ◽  
Practical Application ◽  
Flexible Display ◽  
High Brightness ◽  
Environmental Test ◽  
Angle Of View

In recent years, the application of Flexible Display (FD) is increasing dramatically due to its high brightness, high contrast, and large angle of view. Also because the substrate polymer material is flexible, FD is easily and widely used in various electronic packages. The competition of products based on these technologies such as electronic paper and mobile screen can be improved. In most of these applications, failure of FD can directly lead to failure of device. However, reliability data on FD are not commonly available in published literature, and the reliability of FD in practical application has not been studied very well. This paper presents an experimental study of FD with focus on its reliability under varying temperature and humidity conditions. The purpose of this paper is to investigate the failure mode of FD based on environmental test including steady damp heat test, dry heat test, cyclic damp heat test and cold test. The failure modes are discussed and the analysis is presented. In this study, all tests are conducted with visual inspections during each test procedure.

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

2003 ◽  
Vol 125 (4) ◽  
pp. 512-519 ◽  
Author(s):  
C. J. Liu ◽  
L. J. Ernst ◽  
G. Wisse ◽  
G. Q. Zhang ◽  
M. Vervoort
Keyword(s):  
Failure Modes ◽  
Research Effort ◽  
Metal Layer ◽  
Electronic Packages ◽  
Ceramic Substrates ◽  
Thermally Induced ◽  
Thermal Expansion Coefficients ◽  
Interface Delamination ◽  
Delamination Buckling ◽  
Expansion Coefficients

Interface delamination failure caused by thermomechanical loading and mismatch of thermal expansion coefficients and other material properties is one of the important failure modes occurring in electronic packages, thus a threat for package reliability. To solve this problem, both academic institutions and industry have been spending tremendous research effort in order to understand the inherent failure mechanisms and to develop advanced and reliable experimental and simulation methodologies, thus to be able to predict and to avoid interface delamination before physical prototyping. Various damage mechanisms can be involved and can result in interface delamination phenomena. These are not all sufficiently addressed and/or reported so far, probably because of the complexities caused by the occurrence of strong geometric and materials nonlinearities. One of the phenomena being insufficiently understood so far is the so-called buckling-driven delamination of thin metalic layers on ceramic substrates. This phenomenon will be discussed in the present paper.

Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids

2017 ◽  
Vol 2017 (1) ◽  
pp. 000201-000207 ◽  
Author(s):  
Youngtak Lee ◽  
Doug Link
Keyword(s):  
Hearing Aids ◽  
Flip Chip ◽  
Failure Modes ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Practical Application ◽  
Surface Mount ◽  
Free Solder ◽  
On Chip

Abstract Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Considerable amount of defects associated with solder overflow are found on chip-on-flip-chip (COFC) SiP in hearing aids. Through the use of design of experiments (DOE), lead-free solder defect causes on hearing aids application can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components for hearing aid applications. The practical application and analysis of lead-free solder for hearing aids will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types through the DOE process.

Software FMEA Analysis for Safety Software

2009 ◽  
Author(s):  
Gee-Yong Park ◽  
Sup Hur ◽  
Dong H. Kim ◽  
Dong Y. Lee ◽  
Kee C. Kwon
Keyword(s):  
Failure Modes ◽  
Block Diagram ◽  
Test Procedure ◽  
Safety Analysis ◽  
Software Safety ◽  
Effect Analysis ◽  
Function Blocks ◽  
Software Code ◽  
Fmea Analysis ◽  
Reactor Protection System

This paper describes a software safety analysis for a software code that is installed at an Automatic Test and Interface Processor (ATIP) in a digital reactor protection system. For the ATIP software safety analysis, an overall safety analysis is at first performed over the ATIP software architecture and modules, and then a detailed safety analysis based on the software FMEA (Failure Modes and Effect Analysis) method is applied to the ATIP program. For an efficient analysis, the software FMEA is carried out based on the so-called failure-mode template extracted from the function blocks used in the function block diagram (FBD) for the ATIP software. The software safety analysis by the software FMEA, being applied to the ATIP software code which has been integrated and passed through a very rigorous system test procedure, is proven to be able to provide very valuable results (i.e., software defects) which could not be identified during various system tests.

scholarly journals An Augmented Reality Head-Up Display System with a Wide-View Eyebox

2020 ◽  
Vol 2020 ◽  
pp. 1-9
Author(s):  
Pei-Jung Wu ◽  
Chih-Hao Chuang ◽  
Chien-Yu Chen ◽  
Jeng-Han Wu ◽  
Bor-Shyh Lin
Keyword(s):  
Large Angle ◽  
Optical Element ◽  
Splitting Function ◽  
Virtual Image ◽  
Projection System ◽  
Image Projection ◽  
Holographic Optical Element ◽  
Angle Of View ◽  
On The Road ◽  
Left Image

This study proposes to apply the combination of two 90-degree prisms and a holographic optical element to an image-dividing element, divide an image into three through the virtual image projection system, and accurately project the images to 160 cm behind the windshield. In order to distinguish the left image, middle image, and right image at the horizontal direction, the 90-degree prism is first utilized for horizontally deflecting the light, a holographic optical element is then used for presenting the vertical deflection of the image, and finally, the images are horizontally arranged as a real image on the diffuser. An image-dividing element is eventually integrated to the virtual image projection system. Then, the divided images are made as a virtual image which is projected to 160 cm behind the windshield to combine with the street scene. The horizontal angle of view of an eyebox is increased from 2.51° to 7.22°, and the size of the eyebox is 31.68 cm × 12.48 cm, allowing a wide-view laser-based head-up display with the large-angle beam-splitting function being successfully designed. It would not affect the field of view on the road, and this system could reduce the space and be arranged easily in a vehicle. Therefore, this proposed system is suitable for the aftermarket.

scholarly journals Novel test procedure for testing antimicrobially active materials

2018 ◽  
Vol 4 (1) ◽  
pp. 229-231
Author(s):  
Alexander Stich ◽  
Sebastian Buhl ◽  
Clemens Bulitta
Keyword(s):  
Antimicrobial Activity ◽  
Standard Method ◽  
Test Procedure ◽  
Practical Application ◽  
Active Materials ◽  
Antimicrobial Coatings ◽  
Artificial Structure ◽  
Antimicrobial Test ◽  
Cleaning Procedures

AbstractAntimicrobial coatings are typically tested for their activity and effectiveness based on an artificial procedure, the standard JIS Z 2801 (or ISO 22196). The test samples are contaminated with a predetermined concentration of bacteria and covered with a sterile film. Due to the artificial structure of this process, however, there is always the question of the validity in the practical application of these surfaces and how comparable this germ-reducing effect is to currently common disinfection measures. Therefore, we developed a more realistic test procedure in our laboratory. The test samples are inoculated and incubated at standard room conditions. To compare the antimicrobial activity to standard cleaning procedures also disinfection and wipe controls were performed. The results show that the antimicrobial test patterns we use have a strong efficacy. This could be shown reproducibly both with the standard method JIS Z 2801 as well as with our new test procedure.

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

2017 ◽  
Author(s):  
Quang Nguyen ◽  
Jeffrey C. Suhling ◽  
Richard C. Jaeger ◽  
Pradeep Lall
Keyword(s):  
Flip Chip ◽  
Failure Modes ◽  
Moisture Absorption ◽  
Numerical Study ◽  
Polymer Materials ◽  
Electronic Packages ◽  
Major Drawback ◽  
Electronic Package ◽  
Plastic Ball ◽  
Moisture Property

Polymer materials have been widely used in electronic packaging with many advantages such as: lower cost, light weight and good performance. They however suffer a major drawback that results in a number of challenges for reliability engineers and researchers, in which polymer materials are quite sensitive to moisture absorption when exposed to humid environment, causing many failure modes in electronic packages such as: popcorn cracking, delamination or corrosion. It is well-known that finite element simulation is a powerful tool to evaluate the effects of moisture on electronic package reliability. In this study, three moisture properties (diffusivity, saturated concentration, and coefficient of moisture expansion) were experimentally characterized. The obtained results were then used to perform moisture diffusion simulations on various types of electronic package. Finally, a numerical study was conducted on the dependence of the moisture effects (weight gains, die stresses) upon each moisture property of polymeric components of three kinds of electronic packages (Quad Flat Package, Plastic Ball Grid Array, and Flip Chip on Laminate). The results of the study provided valuable insights into how moisture induced die stresses vary with each moisture property of polymeric components in the packages.

Mechanical Modeling of a Solder Thermal Interface Material: Implications for Thermo-Mechanical Reliability

2005 ◽  
Author(s):  
Sankara J. Subramanian
Keyword(s):  
Failure Modes ◽  
Accelerated Testing ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Finite Element Models ◽  
Electronic Packages ◽  
Thermal Impedance ◽  
Thermal Interface ◽  
Service Conditions ◽  
Interface Materials

This paper addresses cracking in solder thermal interface materials (STIMs) used in electronic packages under accelerated testing or service conditions. Finite-element models of various packages have been built to study the deformation in the STIM through a few cycles of accelerated testing. Two commonly observed failure modes — center/off-center brittle interfacial cracking, and cohesive corner cracking — were looked at. The success of the modeling approach was evaluated by comparison with thermal impedance data, as well as with CSAM images showing the extent of cracking in the STIM. It is shown that the models agree qualitatively with experimental data, both in terms of failure locations, as well as in terms of rank ordering different packages in terms of STIM degradation.

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