Failure Modes and Mechanisms in Electronic Packages

1998 ◽  
Author(s):  
Puligandla Viswanadham ◽  
Pratap Singh
Keyword(s):  
Failure Modes ◽  
Electronic Packages

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

2003 ◽  
Vol 125 (4) ◽  
pp. 512-519 ◽  
Author(s):  
C. J. Liu ◽  
L. J. Ernst ◽  
G. Wisse ◽  
G. Q. Zhang ◽  
M. Vervoort
Keyword(s):  
Failure Modes ◽  
Research Effort ◽  
Metal Layer ◽  
Electronic Packages ◽  
Ceramic Substrates ◽  
Thermally Induced ◽  
Thermal Expansion Coefficients ◽  
Interface Delamination ◽  
Delamination Buckling ◽  
Expansion Coefficients

Interface delamination failure caused by thermomechanical loading and mismatch of thermal expansion coefficients and other material properties is one of the important failure modes occurring in electronic packages, thus a threat for package reliability. To solve this problem, both academic institutions and industry have been spending tremendous research effort in order to understand the inherent failure mechanisms and to develop advanced and reliable experimental and simulation methodologies, thus to be able to predict and to avoid interface delamination before physical prototyping. Various damage mechanisms can be involved and can result in interface delamination phenomena. These are not all sufficiently addressed and/or reported so far, probably because of the complexities caused by the occurrence of strong geometric and materials nonlinearities. One of the phenomena being insufficiently understood so far is the so-called buckling-driven delamination of thin metalic layers on ceramic substrates. This phenomenon will be discussed in the present paper.

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

2017 ◽  
Author(s):  
Quang Nguyen ◽  
Jeffrey C. Suhling ◽  
Richard C. Jaeger ◽  
Pradeep Lall
Keyword(s):  
Flip Chip ◽  
Failure Modes ◽  
Moisture Absorption ◽  
Numerical Study ◽  
Polymer Materials ◽  
Electronic Packages ◽  
Major Drawback ◽  
Electronic Package ◽  
Plastic Ball ◽  
Moisture Property

Polymer materials have been widely used in electronic packaging with many advantages such as: lower cost, light weight and good performance. They however suffer a major drawback that results in a number of challenges for reliability engineers and researchers, in which polymer materials are quite sensitive to moisture absorption when exposed to humid environment, causing many failure modes in electronic packages such as: popcorn cracking, delamination or corrosion. It is well-known that finite element simulation is a powerful tool to evaluate the effects of moisture on electronic package reliability. In this study, three moisture properties (diffusivity, saturated concentration, and coefficient of moisture expansion) were experimentally characterized. The obtained results were then used to perform moisture diffusion simulations on various types of electronic package. Finally, a numerical study was conducted on the dependence of the moisture effects (weight gains, die stresses) upon each moisture property of polymeric components of three kinds of electronic packages (Quad Flat Package, Plastic Ball Grid Array, and Flip Chip on Laminate). The results of the study provided valuable insights into how moisture induced die stresses vary with each moisture property of polymeric components in the packages.

Mechanical Modeling of a Solder Thermal Interface Material: Implications for Thermo-Mechanical Reliability

2005 ◽  
Author(s):  
Sankara J. Subramanian
Keyword(s):  
Failure Modes ◽  
Accelerated Testing ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Finite Element Models ◽  
Electronic Packages ◽  
Thermal Impedance ◽  
Thermal Interface ◽  
Service Conditions ◽  
Interface Materials

This paper addresses cracking in solder thermal interface materials (STIMs) used in electronic packages under accelerated testing or service conditions. Finite-element models of various packages have been built to study the deformation in the STIM through a few cycles of accelerated testing. Two commonly observed failure modes — center/off-center brittle interfacial cracking, and cohesive corner cracking — were looked at. The success of the modeling approach was evaluated by comparison with thermal impedance data, as well as with CSAM images showing the extent of cracking in the STIM. It is shown that the models agree qualitatively with experimental data, both in terms of failure locations, as well as in terms of rank ordering different packages in terms of STIM degradation.

Models for the Thermomechanical Behavior of Metal/Ceramic Laminates

1993 ◽  
Vol 323 ◽  
Author(s):  
S. M. Spearing ◽  
M. A. Tenhover ◽  
D. B. Lukco ◽  
L. Viswanathan ◽  
D. K. Hollen
Keyword(s):  
Failure Analysis ◽  
Failure Modes ◽  
Thermomechanical Behavior ◽  
Electronic Packages ◽  
Interfacial Failure ◽  
Material Systems ◽  
Metal Ceramic ◽  
Failure Models

AbstractMetal/ceramic bilayers fracture by one of three failure modes; crazing, spalling or interfacial failure. Models for these failure modes are developed. The results are presented as maps that can be used in the design and failure analysis of electronic packages. Examples are presented for several material systems, including A1N.

Reliability of the Flexible Display STN LCD Based Environmental Test

2009 ◽  
Author(s):  
Pan-Dong Fan ◽  
Qiang Miao ◽  
Ping Yang ◽  
Quayle Chen ◽  
Tom Xue ◽  
...  
Keyword(s):  
Failure Modes ◽  
Test Procedure ◽  
Large Angle ◽  
Cold Test ◽  
Electronic Packages ◽  
Practical Application ◽  
Flexible Display ◽  
High Brightness ◽  
Environmental Test ◽  
Angle Of View

In recent years, the application of Flexible Display (FD) is increasing dramatically due to its high brightness, high contrast, and large angle of view. Also because the substrate polymer material is flexible, FD is easily and widely used in various electronic packages. The competition of products based on these technologies such as electronic paper and mobile screen can be improved. In most of these applications, failure of FD can directly lead to failure of device. However, reliability data on FD are not commonly available in published literature, and the reliability of FD in practical application has not been studied very well. This paper presents an experimental study of FD with focus on its reliability under varying temperature and humidity conditions. The purpose of this paper is to investigate the failure mode of FD based on environmental test including steady damp heat test, dry heat test, cyclic damp heat test and cold test. The failure modes are discussed and the analysis is presented. In this study, all tests are conducted with visual inspections during each test procedure.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Human reliability in non-destructive inspections of nuclear power plant components: modeling and analysis

2019 ◽  
Vol 7 (2B) ◽  
Author(s):  
Vanderley Vasconcelos ◽  
Wellington Antonio Soares ◽  
Raissa Oliveira Marques ◽  
Silvério Ferreira Silva Jr ◽  
Amanda Laureano Raso
Keyword(s):  
Power Plant ◽  
Nuclear Power Plant ◽  
Human Factors ◽  
Nuclear Power ◽  
Power Plants ◽  
Failure Modes ◽  
Cooling System ◽  
Human Reliability ◽  
Non Destructive ◽  
Plant Components

Non-destructive inspection (NDI) is one of the key elements in ensuring quality of engineering systems and their safe use. This inspection is a very complex task, during which the inspectors have to rely on their sensory, perceptual, cognitive, and motor skills. It requires high vigilance once it is often carried out on large components, over a long period of time, and in hostile environments and restriction of workplace. A successful NDI requires careful planning, choice of appropriate NDI methods and inspection procedures, as well as qualified and trained inspection personnel. A failure of NDI to detect critical defects in safety-related components of nuclear power plants, for instance, may lead to catastrophic consequences for workers, public and environment. Therefore, ensuring that NDI is reliable and capable of detecting all critical defects is of utmost importance. Despite increased use of automation in NDI, human inspectors, and thus human factors, still play an important role in NDI reliability. Human reliability is the probability of humans conducting specific tasks with satisfactory performance. Many techniques are suitable for modeling and analyzing human reliability in NDI of nuclear power plant components, such as FMEA (Failure Modes and Effects Analysis) and THERP (Technique for Human Error Rate Prediction). An example by using qualitative and quantitative assessesments with these two techniques to improve typical NDI of pipe segments of a core cooling system of a nuclear power plant, through acting on human factors issues, is presented.

Corrosion of Electronic and Magnetic Devices and Materials

1996 ◽  
Vol 451 ◽  
Author(s):  
Gerald S. Frankel
Keyword(s):  
Thin Film ◽  
Failure Modes ◽  
Galvanic Corrosion ◽  
Potential Drop ◽  
Magnetic Devices ◽  
Disk Structure ◽  
Magnetic Layers ◽  
Ohmic Potential Drop ◽  
Corrosion Problem ◽  
Corrosion Susceptibility

ABSTRACTCorrosion of thin film structures commonly used in electronic and magnetic devices is discussed. Typical failure modes are presented, and galvanic corrosion is discussed in some detail since it is one common problem with such devices. A graphical explanation for the determination of the ohmic potential drop during galvanic corrosion is presented. The corrosion problem of thin film disks is shown to have changed during the past ten years owing to changes in disk structure. The corrosion susceptibility of two antiferromagnetic alloys used for exchange coupling to soft magnetic layers is discussed.

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