Reliability Evaluation of Lead Free Solder Joints Subjected to Multi-Loads

2007 ◽  
Author(s):  
Akihiko Tosaka ◽  
Qiang Yu ◽  
Tadahiro Shibutani ◽  
Satoshi Kondo ◽  
Masaki Shiratori
Keyword(s):  
Solder Joints ◽  
Electronic Device ◽  
Cyclic Fatigue ◽  
Reliability Evaluation ◽  
Test Method ◽  
Bending Test ◽  
Fatigue Reliability ◽  
Bending Load ◽  
Reliability Of Solder Joints ◽  
Free Solder

The miniaturization and the high integration of electronic device parts were progressed by the advance in technology, and it leads the problems of warpage of high-integrated component during mounting processes. This kind mismatch would be released slowly after the components are assembled. Therefore, it is concerned that the deformation of the solder joints caused by the warpage should give some impact on the thermal fatigue reliability of solder joints, because the solder joints are subjected not only to the cyclic thermal mismatch but also to the considerable one direction bending load. This state is called as multi-loads in this study. The thermal cyclic fatigue reliability of solder joints had been studied by using analytical and heat cyclic testing approaches, and it is shown that the fatigue life can be assessed by Manson-Coffin’s law. However, the reliability evaluation techniques for multi-loads problem have not been established. In this study, the relation between the fatigue reliability and the multi-loads conditions was studied and the BGA (Ball Grid Array) package was chosen as the target. The author proposed a new cyclic bending test method to achieve the different conditions of the multi-loads, and based upon the experimented and analytical results it was found that impact of the multi loads some cases neglected for could not be.

Analysis of Solder Joint Breakdown Life in Electronic Device Mounted in Vehicle

2004 ◽  
Author(s):  
Qiang Yu ◽  
Masaki Shiratori ◽  
Kimimasa Murayama ◽  
Kazuhiro Igarashi ◽  
Takashi Nakanishi
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Electronic Device ◽  
Time Estimation ◽  
Initial Crack ◽  
Fatigue Reliability ◽  
Electric Device ◽  
Long Time ◽  
Reliability Of Solder Joints ◽  
Improve Reliability

In recent years many electric equipments have come to be used for cars. Solder joints in electric device utilizing car are exposed to harder environment and required higher reliability than that in electric household appliances. Because of this reason, thermal fatigue reliability of solder joints has become one of the most important issues in car electronics. Generally thermal fatigue reliability is estimated by thermal cycle examination, but it needs long time. Estimation by FEM enables it to improve reliability and to reduce time. Analysis of solder life generally can predict only initial crack. But it is important to predict crack propagation and solder joints break down, considering that a function of solder joints is electric connection. In this study, the authors proposed a method to predict break down life by analytical approach.

scholarly journals Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints

2005 ◽  
Vol 46 (11) ◽  
pp. 2316-2321 ◽  
Author(s):  
Qiang Yu ◽  
Jae-Chul Jin ◽  
Do-Seop Kim ◽  
Masaki Shiratori
Keyword(s):  
Solder Joints ◽  
Reliability Evaluation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Fatigue Reliability ◽  
Free Solder

Property of Sn-37Pb solder bumps with different diameter during thermal shock

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Guisheng Gan ◽  
Donghua Yang ◽  
Yi-ping Wu ◽  
Xin Liu ◽  
Pengfei Sun ◽  
...  
Keyword(s):  
Shear Strength ◽  
Solder Joint ◽  
Thermal Shock ◽  
Solder Joints ◽  
Test Method ◽  
Content Type ◽  
Ball Size ◽  
Solder Bumps ◽  
Free Solder ◽  
The Impact

Purpose The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored. Design/methodology/approach In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed. Findings With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively. Originality/value Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.

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