Analysis of Solder Joint Breakdown Life in Electronic Device Mounted in Vehicle

2004 ◽  
Author(s):  
Qiang Yu ◽  
Masaki Shiratori ◽  
Kimimasa Murayama ◽  
Kazuhiro Igarashi ◽  
Takashi Nakanishi
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Electronic Device ◽  
Time Estimation ◽  
Initial Crack ◽  
Fatigue Reliability ◽  
Electric Device ◽  
Long Time ◽  
Reliability Of Solder Joints ◽  
Improve Reliability

In recent years many electric equipments have come to be used for cars. Solder joints in electric device utilizing car are exposed to harder environment and required higher reliability than that in electric household appliances. Because of this reason, thermal fatigue reliability of solder joints has become one of the most important issues in car electronics. Generally thermal fatigue reliability is estimated by thermal cycle examination, but it needs long time. Estimation by FEM enables it to improve reliability and to reduce time. Analysis of solder life generally can predict only initial crack. But it is important to predict crack propagation and solder joints break down, considering that a function of solder joints is electric connection. In this study, the authors proposed a method to predict break down life by analytical approach.

Reliability Evaluation of Lead Free Solder Joints Subjected to Multi-Loads

2007 ◽  
Author(s):  
Akihiko Tosaka ◽  
Qiang Yu ◽  
Tadahiro Shibutani ◽  
Satoshi Kondo ◽  
Masaki Shiratori
Keyword(s):  
Solder Joints ◽  
Electronic Device ◽  
Cyclic Fatigue ◽  
Reliability Evaluation ◽  
Test Method ◽  
Bending Test ◽  
Fatigue Reliability ◽  
Bending Load ◽  
Reliability Of Solder Joints ◽  
Free Solder

The miniaturization and the high integration of electronic device parts were progressed by the advance in technology, and it leads the problems of warpage of high-integrated component during mounting processes. This kind mismatch would be released slowly after the components are assembled. Therefore, it is concerned that the deformation of the solder joints caused by the warpage should give some impact on the thermal fatigue reliability of solder joints, because the solder joints are subjected not only to the cyclic thermal mismatch but also to the considerable one direction bending load. This state is called as multi-loads in this study. The thermal cyclic fatigue reliability of solder joints had been studied by using analytical and heat cyclic testing approaches, and it is shown that the fatigue life can be assessed by Manson-Coffin’s law. However, the reliability evaluation techniques for multi-loads problem have not been established. In this study, the relation between the fatigue reliability and the multi-loads conditions was studied and the BGA (Ball Grid Array) package was chosen as the target. The author proposed a new cyclic bending test method to achieve the different conditions of the multi-loads, and based upon the experimented and analytical results it was found that impact of the multi loads some cases neglected for could not be.

Assessment of Influence and Analysis of Mechanism on the Reliability for Solder Joints of Electronic Device

2005 ◽  
Author(s):  
Qiang Yu ◽  
Jae-Chul Jin ◽  
Hirokazu Abe ◽  
Takahiro Koyama ◽  
Tadahiro Shibutani ◽  
...  
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Electronic Device ◽  
Advanced Technology ◽  
Circuit Board ◽  
Design Stage ◽  
Concept Design ◽  
Fatigue Reliability ◽  
Design Engineers ◽  
Design Factors

In recent years, the development of the electronic device using the semiconductor is remarkable. In current advanced technology, it has succeeded in making the package which size is almost equal to the IC chip. Moreover for miniaturization and high integration of the electronic device, it has been fined in soldered joints divisions. As a result, the strength reliability become an important problem, since the thermal fatigue fracture is generated by thermal expansion difference between package and printed-circuit board. However, it is difficult to guarantee quality during the design stage, because it is hard to know which design factors will prolong the fatigue life. So it is needed that a quantitative evaluation technique of the relation between the design change and the thermal fatigue reliability. The authors introduced a simple approach to help solving the design and development of a package system by using the SDSS (statistical design support system) and FEM (Finite Element Method) analysis. In this study, in order to improve the reliability, evaluations of the influence of various design factors on the reliability of BGA (Ball Grid Array) soldered joints were carried out. By using the total equivalent inelastic strain range obtained by FEM analysis, the sensitivity is calculated and the authors got the influence of each design factor. With the results, the design engineers can know the rate of each factors’ effect on the reliability of solder joints and they can use the results to assess the reliability of their design from the concept design stage. Consequently, it can be expected that almost reliability problems can be avoided at the beginning, and it will lead a great advantage of shortening design period and slashing costs. And this will lead design engineers to come up with more new ideas.

scholarly journals Evaluation for Thermal Fatigue Life of Electronic Device Solder Joints utilizing Car

2003 ◽  
Vol 2003.16 (0) ◽  
pp. 699-700
Author(s):  
Qiang YU ◽  
Masaki SHIRATORI ◽  
Hae Ki NAM ◽  
Kazuhiru HIYAKE ◽  
Kazuhiro IGARASHI ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Electronic Device ◽  
Thermal Fatigue Life
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