Thermomechanics of High-Pressure MEMS Sensors

2007 ◽  
Author(s):  
Ryszard J. Pryputniewicz
Keyword(s):  
High Pressure ◽  
High Performance ◽  
Microelectromechanical Systems ◽  
Hybrid Approach ◽  
Mems Sensors ◽  
Temperature Changes ◽  
Sensing Technology ◽  
Piezoresistive Sensor ◽  
Mems Fabrication ◽  
Increasing Demand

Increasing demand for high performance, stable, and affordable sensors for applications in process control industry has led to development of a miniature pressure sensor. This development, made possible by recent advances in microelectromechanical systems (MEMS) fabrication, utilizes polysilicon-sensing technology. The unique polysilicon piezoresistive sensor (PPS) measures differential pressure (DP) based on deformations of a multilayer/multimaterial diaphragm, which is about 2 μm thick. Deformations of a diaphragm, subjected to changes in pressure, are sensed by the piezoresistive bridge elements. Determination of the loading pressures from strains of the piezoresistors is based on computations relying on a number of material specific and process dependent coefficients that, because of their nature, can vary, which may lead to uncertainties in displayed results, especially when temperature changes also. To establish an independent means for measurements of the thermomechanical (TM) deformations of the PPS diaphragms and to validate the coefficients used, a hybrid methodology, based on measurements using optoelectronic laser interferometric microscope (OELIM) and finite element method (FEM) computations coupled with uncertainty analysis provided by unique closed form formulations, was developed. This methodology allows highly accurate and precise measurements of TM deformations of diaphragms, as well as their computational modeling/simulations, and is a basis for “design by analysis” approach to efficient and effective developments of new MEMS sensors. In this paper the hybrid approach is described and its use is illustrated by representative examples addressing high-pressure MEMS sensors.

scholarly journals Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via

Sensors ◽  
2018 ◽  
Vol 19 (1) ◽  
pp. 93 ◽  
Author(s):  
Meng Zhang ◽  
Jian Yang ◽  
Yurong He ◽  
Fan Yang ◽  
Fuhua Yang ◽  
...  
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Three Dimensional ◽  
Fabrication Process ◽  
Anodic Bonding ◽  
Mems Sensors ◽  
Through Silicon Via ◽  
Hermetic Packaging ◽  
Order Of Magnitude ◽  
Capacitive Mems

A novel three-dimensional (3D) hermetic packaging technique suitable for capacitive microelectromechanical systems (MEMS) sensors is studied. The composite substrate with through silicon via (TSV) is used as the encapsulation cap fabricated by a glass-in-silicon (GIS) reflow process. In particular, the low-resistivity silicon pillars embedded in the glass cap are designed to serve as the electrical feedthrough and the fixed capacitance plate at the same time to simplify the fabrication process and improve the reliability. The fabrication process and the properties of the encapsulation cap were studied systematically. The resistance of the silicon vertical feedthrough was measured to be as low as 263.5 mΩ, indicating a good electrical interconnection property. Furthermore, the surface root-mean-square (RMS) roughnesses of glass and silicon were measured to be 1.12 nm and 0.814 nm, respectively, which were small enough for the final wafer bonding process. Anodic bonding between the encapsulation cap and the silicon wafer with sensing structures was conducted in a vacuum to complete the hermetic encapsulation. The proposed packaging scheme was successfully applied to a capacitive gyroscope. The quality factor of the packaged gyroscope achieved above 220,000, which was at least one order of magnitude larger than that of the unpackaged. The validity of the proposed packaging scheme could be verified. Furthermore, the packaging failure was less than 1%, which demonstrated the feasibility and reliability of the technique for high-performance MEMS vacuum packaging.

scholarly journals MEMS Actuators for Optical Microendoscopy

Micromachines ◽  
2019 ◽  
Vol 10 (2) ◽  
pp. 85 ◽  
Author(s):  
Zhen Qiu ◽  
Wibool Piyawattanametha
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Fabrication Technology ◽  
Optical Components ◽  
Research Institutes ◽  
Mems Fabrication ◽  
Batch Fabrication ◽  
Mems Actuators ◽  
Mems Technology ◽  
Manufacturing Methods

Growing demands for affordable, portable, and reliable optical microendoscopic imaging devices are attracting research institutes and industries to find new manufacturing methods. However, the integration of microscopic components into these subsystems is one of today’s challenges in manufacturing and packaging. Together with this kind of miniaturization more and more functional parts have to be accommodated in ever smaller spaces. Therefore, solving this challenge with the use of microelectromechanical systems (MEMS) fabrication technology has opened the promising opportunities in enabling a wide variety of novel optical microendoscopy to be miniaturized. MEMS fabrication technology enables abilities to apply batch fabrication methods with high-precision and to include a wide variety of optical functionalities to the optical components. As a result, MEMS technology has enabled greater accessibility to advance optical microendoscopy technology to provide high-resolution and high-performance imaging matching with traditional table-top microscopy. In this review the latest advancements of MEMS actuators for optical microendoscopy will be discussed in detail.

scholarly journals Synthesis, Structure and Diffusion Pathways of Fast Lithium-Ion Conductors in the Polymorphs α- and β-Li8SnP4

2021 ◽  
Author(s):  
Thomas F Fässler ◽  
Stefan Strangmüller ◽  
Henrik Eickkhoff ◽  
Wilhelm Klein ◽  
Gabriele Raudaschl-Sieber ◽  
...  
Keyword(s):  
High Performance ◽  
Low Cost ◽  
Lithium Ion ◽  
Conducting Materials ◽  
Increasing Demand ◽  
Battery Technology ◽  
Lithium Ion Conductors ◽  
And Diffusion ◽  
Ion Conductors

The increasing demand for a high-performance and low-cost battery technology promotes the search for Li+-conducting materials. Recently, phosphidotetrelates and aluminates were introduced as an innovative class of phosphide-based Li+-conducting materials...

MXene/Cellulose Nanofiber-Foam Based High Performance Degradable Piezoresistive Sensor with Greatly Expanded Interlayer Distances

Nano Energy ◽  
2021 ◽  
pp. 106151
Author(s):  
Tuoyi Su ◽  
Nishuang Liu ◽  
Yihua Gao ◽  
Dandan Lei ◽  
Luoxin Wang ◽  
...  
Keyword(s):  
High Performance ◽  
Cellulose Nanofiber ◽  
Piezoresistive Sensor

scholarly journals Human emotion modeling (HEM): an interface for IoT systems

2021 ◽  
Author(s):  
Mohammed R. Elkobaisi ◽  
Fadi Al Machot
Keyword(s):  
Assisted Living ◽  
High Performance ◽  
Modeling Language ◽  
Emotional States ◽  
Human Emotion ◽  
Care Givers ◽  
Novel Approach ◽  
Domain Specific Modeling ◽  
Increasing Demand ◽  
Human Support

AbstractThe use of IoT-based Emotion Recognition (ER) systems is in increasing demand in many domains such as active and assisted living (AAL), health care and industry. Combining the emotion and the context in a unified system could enhance the human support scope, but it is currently a challenging task due to the lack of a common interface that is capable to provide such a combination. In this sense, we aim at providing a novel approach based on a modeling language that can be used even by care-givers or non-experts to model human emotion w.r.t. context for human support services. The proposed modeling approach is based on Domain-Specific Modeling Language (DSML) which helps to integrate different IoT data sources in AAL environment. Consequently, it provides a conceptual support level related to the current emotional states of the observed subject. For the evaluation, we show the evaluation of the well-validated System Usability Score (SUS) to prove that the proposed modeling language achieves high performance in terms of usability and learn-ability metrics. Furthermore, we evaluate the performance at runtime of the model instantiation by measuring the execution time using well-known IoT services.

Ultrahigh energy storage and ultrafast ion diffusion in borophene-based anodes for rechargeable metal ion batteries

2017 ◽  
Vol 5 (5) ◽  
pp. 2328-2338 ◽  
Author(s):  
Dewei Rao ◽  
Lingyan Zhang ◽  
Zhaoshun Meng ◽  
Xirui Zhang ◽  
Yunhui Wang ◽  
...  
Keyword(s):  
Energy Storage ◽  
Metal Ion ◽  
High Performance ◽  
Storage Systems ◽  
Ultrahigh Energy ◽  
Ion Diffusion ◽  
Energy Storage Systems ◽  
Increasing Demand

Since the turn of the new century, the increasing demand for high-performance energy storage systems has generated considerable interest in rechargeable ion batteries.

STIGMERGIC LANDMARK OPTIMIZATION

2012 ◽  
Vol 15 (08) ◽  
pp. 1150025 ◽  
Author(s):  
N. LEMMENS ◽  
K. TUYLS
Keyword(s):  
High Performance ◽  
Nest Site ◽  
Hybrid Approach ◽  
Nest Site Selection ◽  
The Third ◽  
Selection Behavior ◽  
Bee Foraging ◽  
Global Route ◽  
Foraging Task ◽  
Vector Strength

In this paper we present three Swarm Intelligence algorithms which we evaluate on the complex foraging task domain. Each of the algorithms draws inspiration from biologic bee foraging/nest-site selection behavior. The main focus will be on the third algorithm, namely STIGMERGIC LANDMARK FORAGING which is a novel hybrid approach. It combines the high performance of bee-inspired navigation with ant-inspired recruitment. More precisely, navigation is based on Path Integration which results in vectors indicating the distance and direction to a destination. Recruitment only occurs at key locations (i.e., landmarks) inside of the environment. Each landmark contains a collection of vectors with which visiting agents can find their way to a certain goal or to another landmark in an unknown environment. Each vector represents a local segment of a global route. In contrast to ant-inspired recruitment, no attracting or repelling pheromone is used to indicate where to go and how worthwhile a route is in comparison to other routes. Instead, each vector in a landmark has a certain strength indicating how worthwhile it is. In analogy to ant-inspired recruitment, vector strength can be reinforced by visiting agents. Moreover, vector strength decays over time. In the end, this results in optimal routes to destinations. STIGMERGIC LANDMARK FORAGING proves to be very efficient in terms of building and adapting solutions.

RF-MEMS Components and Networks for High-Performance Reconfigurable Telecommunication and Wireless Systems

2012 ◽  
Vol 81 ◽  
pp. 65-74 ◽  
Author(s):  
Jacopo Iannacci ◽  
Giuseppe Resta ◽  
Paola Farinelli ◽  
Roberto Sorrentino
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Low Cost ◽  
Impedance Matching ◽  
Phase Shifters ◽  
Rf Systems ◽  
Mems Technology ◽  
And Performance ◽  
Rf Performance

MEMS (MicroElectroMechanical-Systems) technology applied to the field of Radio Frequency systems (i.e. RF-MEMS) has emerged in the last 10-15 years as a valuable and viable solution to manufacture low-cost and very high-performance passive components, like variable capacitors, inductors and micro-relays, as well as complex networks, like tunable filters, reconfigurable impedance matching networks and phase shifters, and so on. The availability of such components and their integration within RF systems (e.g. radio transceivers, radars, satellites, etc.) enables boosting the characteristics and performance of telecommunication systems, addressing for instance a significant increase of their reconfigurability. The benefits resulting from the employment of RF-MEMS technology are paramount, being some of them the reduction of hardware redundancy and power consumption, along with the operability of the same RF system according to multiple standards. After framing more in detail the whole context of RF MEMS technology, this paper will provide a brief introduction on a typical RF-MEMS technology platform. Subsequently, some relevant examples of lumped RF MEMS passive elements and complex reconfigurable networks will be reported along with their measured RF performance and characteristics.

New Generation of Brake Callipers to Improve Competitiveness and Energy Savings in Very High Performance Cars

2014 ◽  
Vol 217-218 ◽  
pp. 471-480
Author(s):  
Ivano Gattelli ◽  
Gian Luigi Chiarmetta ◽  
Marcello Boschini ◽  
Renzo Moschini ◽  
Mario Rosso ◽  
...  
Keyword(s):  
High Pressure ◽  
High Performance ◽  
Energy Savings ◽  
High Reliability ◽  
A357 Alloy ◽  
Bench Tests ◽  
Heat Treated ◽  
New Generation ◽  
Non Destructive ◽  
Very High

This paper concerns with the optimisation of the innovative rheocasting process to produce a new generation of brake callipers, characterised by very high reliability and strength. The attained very promising properties favoured their use on a very high performance car and the presented technique can be further extended for other important challenging applications. The prototype components are produced using T6 heat treated A357 alloy. Results on the samples machined directly from the produced callipers are in detail described and analysed. Pieces exhibiting some small defects, individuated by non-destructive tests, as well as defectless pieces have been underlined to severe industrial tests, e.g. high pressure tight, as well as severe bench tests, and it has been observed that the proposed technological process assure the fulfilment of the requirements contained in standards.

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