scholarly journals Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via

Sensors ◽  
2018 ◽  
Vol 19 (1) ◽  
pp. 93 ◽  
Author(s):  
Meng Zhang ◽  
Jian Yang ◽  
Yurong He ◽  
Fan Yang ◽  
Fuhua Yang ◽  
...  
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Three Dimensional ◽  
Fabrication Process ◽  
Anodic Bonding ◽  
Mems Sensors ◽  
Through Silicon Via ◽  
Hermetic Packaging ◽  
Order Of Magnitude ◽  
Capacitive Mems

A novel three-dimensional (3D) hermetic packaging technique suitable for capacitive microelectromechanical systems (MEMS) sensors is studied. The composite substrate with through silicon via (TSV) is used as the encapsulation cap fabricated by a glass-in-silicon (GIS) reflow process. In particular, the low-resistivity silicon pillars embedded in the glass cap are designed to serve as the electrical feedthrough and the fixed capacitance plate at the same time to simplify the fabrication process and improve the reliability. The fabrication process and the properties of the encapsulation cap were studied systematically. The resistance of the silicon vertical feedthrough was measured to be as low as 263.5 mΩ, indicating a good electrical interconnection property. Furthermore, the surface root-mean-square (RMS) roughnesses of glass and silicon were measured to be 1.12 nm and 0.814 nm, respectively, which were small enough for the final wafer bonding process. Anodic bonding between the encapsulation cap and the silicon wafer with sensing structures was conducted in a vacuum to complete the hermetic encapsulation. The proposed packaging scheme was successfully applied to a capacitive gyroscope. The quality factor of the packaged gyroscope achieved above 220,000, which was at least one order of magnitude larger than that of the unpackaged. The validity of the proposed packaging scheme could be verified. Furthermore, the packaging failure was less than 1%, which demonstrated the feasibility and reliability of the technique for high-performance MEMS vacuum packaging.

Three-dimensional honeycomb-like porous carbon derived from tamarisk roots via a green fabrication process for high-performance supercapacitors

Ionics ◽  
2019 ◽  
Vol 25 (9) ◽  
pp. 4315-4323 ◽  
Author(s):  
Yingjie Wang ◽  
Lianchun Zhao ◽  
Hui Peng ◽  
Xiuwen Dai ◽  
Xueni Liu ◽  
...  
Keyword(s):  
Porous Carbon ◽  
High Performance ◽  
Three Dimensional ◽  
Fabrication Process

Fabrication of High Aspect Ratio Microcoils Using X-Ray Lithography

2010 ◽  
Author(s):  
Daiji Noda ◽  
Masaru Setomoto ◽  
Tadashi Hattori
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
High Performance ◽  
Three Dimensional ◽  
Fabrication Process ◽  
Electromagnetic Actuators ◽  
Pipe Surface ◽  
Suction Force ◽  
X Ray ◽  
Micro Parts

Recently, the demand of micro-fabrications such as micro-sensors, microcoils, micro-actuators etc is increasing. Actuators account for a large percentage and volume and weight of a product compared with other parts. Therefore, the progress in downsizing of actuators was required. In order to resolve these problems, the key technology to realizing micro-devices is micro-fabrication process. Particularly, it is essential to the technologies for processing high aspect ratio structures in the production of micro-parts. We have proposed a three-dimensional fabrication process using X-ray lithography technique, and fabricated spiral microcoils having coil lines of narrow pitch and high aspect ratio structures. We have fabricated spiral microcoils at a pitch of 60 μm, and aspect ratio of about 5 using X-ray lithography and narrow metallization techniques on acrylic pipe surface. In addition, we also estimated the suction force of electromagnetic actuators using these microcoils. Measurement results were relatively in good agreement with theoretical values using high aspect ratio microcoils. It is very expected that the high performance microcoils could be manufactured in spite of miniature size.

Interconnect Technologies for Heterogeneous 3D Integration : CMOS and MEMS

2010 ◽  
Vol 1249 ◽  
Author(s):  
Hyung Suk Yang ◽  
Muhannad Bakir
Keyword(s):  
High Performance ◽  
Electronic Circuit ◽  
Microelectromechanical Systems ◽  
High Density ◽  
Mems Devices ◽  
New Materials ◽  
3D Integration ◽  
Through Silicon Via ◽  
Wide Range ◽  
Conventional Methods

AbstractMicroelectromechanical Systems (MEMS) market is a rapidly growing market with a wide range of devices. Most of these devices require an interaction with an electronic circuit, and with the increasing number of high performance MEMS devices that are being introduced, a demand for integrating CMOS and MEMS using high-density and low-parasitic interconnects have also been on the rise.Unfortunately, conventional methods of integrating CMOS with MEMS cannot provide the high density and low-parasitic interconnections required by modern high performance MEMS devices, and at the same time provide the flexibility required to accommodate new devices that are made using new materials and highly innovative fabrication processes.Heterogeneous 3D integration of MEMS and CMOS has the potential to provide both the performance and the integration flexibility; however there are two interconnect challenges that need to be addressed. This paper outlines the details of these interconnect challenges and introduces two interconnect technologies, Mechanically Flexible Interconnects (MFI) and Through-Silicon Via (TSV), developed specifically to address these challenges.

Thermomechanics of High-Pressure MEMS Sensors

2007 ◽  
Author(s):  
Ryszard J. Pryputniewicz
Keyword(s):  
High Pressure ◽  
High Performance ◽  
Microelectromechanical Systems ◽  
Hybrid Approach ◽  
Mems Sensors ◽  
Temperature Changes ◽  
Sensing Technology ◽  
Piezoresistive Sensor ◽  
Mems Fabrication ◽  
Increasing Demand

Increasing demand for high performance, stable, and affordable sensors for applications in process control industry has led to development of a miniature pressure sensor. This development, made possible by recent advances in microelectromechanical systems (MEMS) fabrication, utilizes polysilicon-sensing technology. The unique polysilicon piezoresistive sensor (PPS) measures differential pressure (DP) based on deformations of a multilayer/multimaterial diaphragm, which is about 2 μm thick. Deformations of a diaphragm, subjected to changes in pressure, are sensed by the piezoresistive bridge elements. Determination of the loading pressures from strains of the piezoresistors is based on computations relying on a number of material specific and process dependent coefficients that, because of their nature, can vary, which may lead to uncertainties in displayed results, especially when temperature changes also. To establish an independent means for measurements of the thermomechanical (TM) deformations of the PPS diaphragms and to validate the coefficients used, a hybrid methodology, based on measurements using optoelectronic laser interferometric microscope (OELIM) and finite element method (FEM) computations coupled with uncertainty analysis provided by unique closed form formulations, was developed. This methodology allows highly accurate and precise measurements of TM deformations of diaphragms, as well as their computational modeling/simulations, and is a basis for “design by analysis” approach to efficient and effective developments of new MEMS sensors. In this paper the hybrid approach is described and its use is illustrated by representative examples addressing high-pressure MEMS sensors.

Improved 3-D reconstruction using stereo computer graphics and multiple tilt EM images

1995 ◽  
Vol 53 ◽  
pp. 630-631
Author(s):  
Lee D. Peachey ◽  
Lou Fodor ◽  
John C. Haselgrove ◽  
Stanley M. Dunn ◽  
Junqing Huang
Keyword(s):  
Computer Graphics ◽  
High Performance ◽  
Transverse Section ◽  
Three Dimensional ◽  
Stereo Pair ◽  
3D Reconstructions ◽  
Video Cameras ◽  
Biological Objects ◽  
Microscope Images ◽  
High Performance Computer

Stereo pairs of electron microscope images provide valuable visual impressions of the three-dimensional nature of specimens, including biological objects. Beyond this one seeks quantitatively accurate models and measurements of the three dimensional positions and sizes of structures in the specimen. In our laboratory, we have sought to combine high resolution video cameras with high performance computer graphics systems to improve both the ease of building 3D reconstructions and the accuracy of 3D measurements, by using multiple tilt images of the same specimen tilted over a wider range of angles than can be viewed stereoscopically. Ultimately we also wish to automate the reconstruction and measurement process, and have initiated work in that direction.Figure 1 is a stereo pair of 400 kV images from a 1 micrometer thick transverse section of frog skeletal muscle stained with the Golgi stain. This stain selectively increases the density of the transverse tubular network in these muscle cells, and it is this network that we reconstruct in this example.

Detection, Averaging, and 3D Reconstruction of Biological Specimens on Hypercubes (Transputer-based) Computers

1990 ◽  
Vol 48 (1) ◽  
pp. 454-455
Author(s):  
Jose-Maria Carazo ◽  
I. Benavides ◽  
S. Marco ◽  
J.L. Carrascosa ◽  
E.L. Zapata
Keyword(s):  
3D Reconstruction ◽  
3D Structure ◽  
Three Dimensional ◽  
Software Tools ◽  
Mapping Method ◽  
Computer Architectures ◽  
Parallel Computer ◽  
Reconstruction Process ◽  
Computing Power ◽  
Order Of Magnitude

Obtaining the three-dimensional (3D) structure of negatively stained biological specimens at a resolution of, typically, 2 - 4 nm is becoming a relatively common practice in an increasing number of laboratories. A combination of new conceptual approaches, new software tools, and faster computers have made this situation possible. However, all these 3D reconstruction processes are quite computer intensive, and the middle term future is full of suggestions entailing an even greater need of computing power. Up to now all published 3D reconstructions in this field have been performed on conventional (sequential) computers, but it is a fact that new parallel computer architectures represent the potential of order-of-magnitude increases in computing power and should, therefore, be considered for their possible application in the most computing intensive tasks.We have studied both shared-memory-based computer architectures, like the BBN Butterfly, and local-memory-based architectures, mainly hypercubes implemented on transputers, where we have used the algorithmic mapping method proposed by Zapata el at. In this work we have developed the basic software tools needed to obtain a 3D reconstruction from non-crystalline specimens (“single particles”) using the so-called Random Conical Tilt Series Method. We start from a pair of images presenting the same field, first tilted (by ≃55°) and then untilted. It is then assumed that we can supply the system with the image of the particle we are looking for (ideally, a 2D average from a previous study) and with a matrix describing the geometrical relationships between the tilted and untilted fields (this step is now accomplished by interactively marking a few pairs of corresponding features in the two fields). From here on the 3D reconstruction process may be run automatically.

Scanning-tunneling spectroscopy on conjugated polymer films

2003 ◽  
Vol 771 ◽  
Author(s):  
M. Kemerink ◽  
S.F. Alvarado ◽  
P.M. Koenraad ◽  
R.A.J. Janssen ◽  
H.W.M. Salemink ◽  
...  
Keyword(s):  
Polymer Films ◽  
Conjugated Polymer ◽  
Three Dimensional ◽  
Field Enhancement ◽  
Direct Consequence ◽  
Scanning Tunneling Spectroscopy ◽  
Tunneling Spectroscopy ◽  
Band Alignment ◽  
Scanning Tunneling ◽  
Order Of Magnitude

AbstractScanning-tunneling spectroscopy experiments have been performed on conjugated polymer films and have been compared to a three-dimensional numerical model for charge injection and transport. It is found that field enhancement near the tip apex leads to significant changes in the injected current, which can amount to more than an order of magnitude, and can even change the polarity of the dominant charge carrier. As a direct consequence, the single-particle band gap and band alignment of the organic material can be directly obtained from tip height-voltage (z-V) curves, provided that the tip has a sufficiently sharp apex.

Rationally Designed Three-Dimensional Porous Nico 2n@C Reticular Structure for High-Performance Li-Ion Batteries

2020 ◽  
Author(s):  
Peiyao Wang ◽  
Bangchuan Zhao ◽  
Jin Bai ◽  
Kunzhen Li ◽  
Hongyang Ma ◽  
...  
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Li Ion Batteries ◽  
Reticular Structure ◽  
Li Ion

scholarly journals Polarization-sensitive photodetectors based on three-dimensional molybdenum disulfide (MoS2) field-effect transistors

Nanophotonics ◽  
2020 ◽  
Vol 9 (16) ◽  
pp. 4719-4728
Author(s):  
Tao Deng ◽  
Shasha Li ◽  
Yuning Li ◽  
Yang Zhang ◽  
Jingye Sun ◽  
...  
Keyword(s):  
Molybdenum Disulfide ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Three Dimensional ◽  
Polarized Light ◽  
Optical Field ◽  
Two Dimensional ◽  
Polarization Ratio ◽  
Two Dimensional Materials

AbstractThe molybdenum disulfide (MoS2)-based photodetectors are facing two challenges: the insensitivity to polarized light and the low photoresponsivity. Herein, three-dimensional (3D) field-effect transistors (FETs) based on monolayer MoS2 were fabricated by applying a self–rolled-up technique. The unique microtubular structure makes 3D MoS2 FETs become polarization sensitive. Moreover, the microtubular structure not only offers a natural resonant microcavity to enhance the optical field inside but also increases the light-MoS2 interaction area, resulting in a higher photoresponsivity. Photoresponsivities as high as 23.8 and 2.9 A/W at 395 and 660 nm, respectively, and a comparable polarization ratio of 1.64 were obtained. The fabrication technique of the 3D MoS2 FET could be transferred to other two-dimensional materials, which is very promising for high-performance polarization-sensitive optical and optoelectronic applications.

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