Development of a Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center

2019 ◽  
Author(s):  
Jimil M. Shah ◽  
Roshan Anand ◽  
Satyam Saini ◽  
Rawhan Cyriac ◽  
Dereje Agonafer ◽  
...  
Keyword(s):  
Particulate Matter ◽  
Relative Humidity ◽  
Data Center ◽  
Printed Circuit Boards ◽  
Data Centers ◽  
Operating Conditions ◽  
Test Method ◽  
Dust Particles ◽  
Circuit Boards ◽  
Printed Circuit

Abstract A remarkable amount of data center energy is consumed in eliminating the heat generated by the IT equipment to maintain and ensure safe operating conditions and optimum performance. The installation of Airside Economizers, while very energy efficient, bears the risk of particulate contamination in data centers, hence, deteriorating the reliability of IT equipment. When RH in data centers exceeds the deliquescent relative humidity (DRH) of salts or accumulated particulate matter, it absorbs moisture, becomes wet and subsequently leads to electrical short circuiting because of degraded surface insulation resistance between the closely spaced features on printed circuit boards. Another concern with this type of failure is the absence of evidence that hinders the process of evaluation and rectification. Therefore, it is imperative to develop a practical test method to determine the DRH value of the accumulated particulate matter found on PCBs (Printed Circuit Boards). This research is a first attempt to develop an experimental technique to measure the DRH of dust particles by logging the leakage current versus RH% (Relative Humidity percentage) for the particulate matter dispensed on an interdigitated comb coupon. To validate this methodology, the DRH of pure salts like MgCl2, NH4NO3 and NaCl is determined and their results are then compared with their published values. This methodology was therefore implemented to help lay a modus operandi of establishing the limiting value or an effective relative humidity envelope to be maintained at a real-world data center facility situated in Dallas industrial area for its continuous and reliable operation.

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Jimil M. Shah ◽  
Roshan Anand ◽  
Prabjit Singh ◽  
Satyam Saini ◽  
Rawhan Cyriac ◽  
...  
Keyword(s):  
Particulate Matter ◽  
Relative Humidity ◽  
Data Center ◽  
Printed Circuit Boards ◽  
Data Centers ◽  
Industrial Area ◽  
Operating Conditions ◽  
Test Method ◽  
Dust Particles ◽  
Real World Data

Abstract A remarkable amount of energy in data centers is consumed in eliminating the heat generated by the information technology (IT) equipment to maintain and ensure safe operating conditions and optimum performance. The installation of airside economizers (ASEs), while very energy efficient, bears the risk of particulate contamination in data centers, hence, deteriorating the reliability of IT equipment. When relative humidity (RH) in data centers exceeds the deliquescent relative humidity (DRH) of salts or accumulated particulate matter, it absorbs moisture, becomes wet, and subsequently leads to electrical short-circuiting because of degraded surface insulation resistance (SIR) between the closely spaced features on printed circuit boards (PCBs). Another concern with this type of failure is the absence of evidence that hinders the process of evaluation and rectification. Therefore, it is imperative to develop a practical test method to determine the DRH value of the accumulated particulate matter found on PCBs. This research is a first attempt to develop an experimental technique to measure the DRH of dust particles by logging the leakage current versus RH% for the particulate matter dispensed on an interdigitated comb coupon. To validate this methodology, the DRH of pure salts like MgCl2, NH4NO3, and NaCl is determined, and their results are then compared with their published values. This methodology was therefore implemented to help lay a modus operandi of establishing the limiting value or an effective relative humidity envelope to be maintained at a real-world data center facility situated in Dallas industrial area for its continuous and reliable operation.

Plasma Surface Engineering: An Enabling Technology Designed to Clean and Protect Printed Circuit Boards

2020 ◽  
Vol 2020 (1) ◽  
pp. 000197-000200
Author(s):  
Daphne Pappas ◽  
Sebastian Guist ◽  
Dhia Ben Salem
Keyword(s):  
Organic Contaminants ◽  
Atmospheric Pressure ◽  
Printed Circuit Boards ◽  
Surface Cleaning ◽  
Solvent Free ◽  
Atmospheric Plasma ◽  
Dust Particles ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Surface Contaminants

Abstract Long term reliability and performance of printed circuit boards (PCBs) are strongly affected by the presence of surface contaminants from the manufacturing and assembly processes. Flux and solder residue, dust particles, oils and greases are often found on the assembled boards and can inhibit the successful application of conformal coatings that are used to protect the electronic components. Surface contaminants can cause coating delamination, dendritic growth, electromigration, corrosion and result in compromised coatings. In the first part of this paper, the fundamental mechanism of plasma-induced removal of organic contaminants from PCBs will be presented. While vacuum based plasmas are considered the traditional solvent-free technology for surface cleaning, a new approach involving air plasma operating under atmospheric pressure conditions is gaining interest due to its adaptability for industrial inline processing. The low concentration of oxygen that is available in the plasma gas is effective in vaporizing organic contaminants leaving behind a clean surface. Additionally, atmospheric plasma processes focusing on the development of functional nanocoatings on PCBs have been investigated. These plasma-enhanced chemical vapor deposition (PECVD) processes involve the delivery and vaporization of small volumes of solvent-free precursors that react with the plasma to form thin coatings on polymer substrates. Depending on the chemical structure of the precursor used, adhesion promoting, water repellant or electrical barrier coatings of 30–100nm thickness can be deposited. These protective functional coatings do not require any curing or special handling and no chemical waste is generated. The latest developments in atmospheric pressure PECVD for electronics protection will be presented in the second part of the paper. Besides the improvement of device performance and reliability, the application of PECVD has the potential to replace chemical substances such as primers known to have harmful impact on human health and the environment.

scholarly journals FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers

2012 ◽  
Vol 30 (21) ◽  
pp. 3316-3329 ◽  
Author(s):  
Richard C. A. Pitwon ◽  
Kai Wang ◽  
Jasper Graham-Jones ◽  
Ioannis Papakonstantinou ◽  
Hadi Baghsiahi ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Data Centers ◽  
Optical Interconnect ◽  
Circuit Boards ◽  
Printed Circuit

scholarly journals The influence of novel organic gold complex on photoresist layers of printed circuit boards

10.30544/73 ◽  
2015 ◽  
Vol 21 (4) ◽  
pp. 269-276
Author(s):  
Silvana Dimitrijević ◽  
Zoran Stević ◽  
Mirjana Rajčić-Vujasinović ◽  
Vesna Grekulović ◽  
Stevan Dimitrijević ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Ph Value ◽  
Operating Conditions ◽  
Gold Complex ◽  
Gold Concentration ◽  
Circuit Boards ◽  
Optimal Operating ◽  
Gold Complexes ◽  
Printed Circuit ◽  
Ph Values

The goal of this paper was to study the influence of organic gold complex based on mercaptotriazole on photoresist layers used in manufacturing of printed circuit boards (PCBs). Investigations were performed by immersion the previously prepared boards in electrolytes with different pH values (pH=2, 4, 7, 9 and 12) at gold concentration of 2.5 g/dm3 and in gold complexes with different gold concentrations (1.5; 2.0; 2.5; 3.0 and 3.5 g/dm3) at pH value of pH=9. Investigations showed that photoresist layers on boards are the most resistant at optimal operating conditions, pH=9 and concentration of gold of 2.5 g/dm3.

Use Condition Characterization of Package Components

2011 ◽  
Author(s):  
Leigh Wojewoda ◽  
Dhanya Athreya ◽  
Michael J. Hill
Keyword(s):  
Printed Circuit Boards ◽  
Operating Conditions ◽  
Metal Composite ◽  
Electronic Packages ◽  
Circuit Boards ◽  
Composite Component ◽  
Electrical Parameters ◽  
Analysis And Design ◽  
Printed Circuit

Discrete components, such as capacitors and inductors, play an important role in the analysis and design of electronic packages and printed circuit boards. Although the electrical parameters of discrete components are described by manufacturers, the component performance at product operating conditions can vary drastically from the manufacturer’s specification. Accurate characterization of discrete package components at operating conditions is essential to understand product operation. This paper will introduce a method to characterize discrete capacitors and inductors while applying multiple operating conditions simultaneously. Several inductor options will be evaluated, including a newly introduced metal composite component.

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