FEM Investigation of Damage Evolution at Elevated Temperatures With Multiple Impact Hits in Vibration Assisted Nano Impact Machining by Loose Abrasives

2019 ◽  
Author(s):  
Nick H. Duong ◽  
Jianfeng Ma ◽  
Shuting Lei ◽  
Murali Sundaram ◽  
Muhammad P. Jahan
Keyword(s):  
Material Removal ◽  
Elevated Temperatures ◽  
Operating Temperature ◽  
Computational Study ◽  
Frictional Coefficient ◽  
Impact Angle ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Multiple Impact ◽  
The Impact

Abstract In this paper, a computational study of a novel nanomachining process, Vibration Assisted Nano Impact machining by Loose Abrasives (VANILA), is conducted using the commercial FEM software package ABAQUS. In this novel nanomachining process, an atomic force microscope (AFM) is utilized as a platform and the nano abrasives are injected in the slurry which is located between the workpiece and the vibrating AFM probe. These nano abrasives impact the workpiece and result in nanoscale material removal. In this research, diamond particles are used as loose abrasives and the ductile mode machining is used to describe the behavior of the brittle silicon workpiece. This study aims to investigate the effects of operating temperature and number of multiple impact hits on material removal mechanism of VANILA process. The impact speed of the loose abrasives is kept constant at 200 m/s and the impact angle is fixed at 90°. The frictional coefficient during the machining is considered to be 0.05. The material removal mechanism at various operating temperatures (20°C, 100°C, 200°C, 400°C, 600°C, and 800°C) and multiple impacts are tested. It is found that the operating temperature and number of impact hits have substantial influence on material removal volume in the VANILA process.

Numerical Investigation of the Damage Evolution in Vibration Assisted Nano Impact Machining by Loose Abrasives With Different Operating Parameters

2018 ◽  
Author(s):  
Nick H. Duong ◽  
J. Ma ◽  
Shuting Lei
Keyword(s):  
Material Removal ◽  
Frictional Coefficient ◽  
Material Model ◽  
Impact Angle ◽  
Ductile Material ◽  
Nanoscale Material ◽  
Impact Speed ◽  
Atomic Force ◽  
Afm Probe ◽  
The Impact

In this paper, the commercial FEM software package Abaqus is employed to model a novel nanomachining process, in which an atomic force microscope (AFM) is used as a platform and the nano abrasives injected in slurry between the workpiece and the vibrating AFM probe impact the workpiece and result in nanoscale material removal. Diamond particles are used as loose abrasives. The ductile material model is used to describe the behavior of the silicon workpiece. The effects of impact speed, impact angle, and the frictional coefficient between the workpiece and abrasives on material removal mechanism are investigated. It is found that the impact speed, impact angle, and frictional coefficient between the silicon workpiece and nanoabrasives have big influence on material removal volume in this novel nanomachining process.

A Molecular Dynamics Simulation Study of Material Removal Mechanisms in Vibration Assisted Nano Impact-Machining by Loose Abrasives

2017 ◽  
Vol 139 (8) ◽  
Author(s):  
Sagil James ◽  
Murali Sundaram
Keyword(s):  
Material Removal ◽  
Removal Rate ◽  
Dynamics Simulation ◽  
Common Mechanism ◽  
Initial Kinetic Energy ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms ◽  
The Impact

Vibration assisted nano impact-machining by loose abrasives (VANILA) is a novel nanomachining process to perform target-specific nano abrasive machining of hard and brittle materials. In this study, molecular dynamic (MD) simulations are performed to understand the nanoscale material removal mechanisms involved in the VANILA process. The simulation results revealed that the material removal for the given impact conditions happens primarily in ductile mode through three distinct mechanisms, which are nanocutting, nanoplowing, and nanocracking. It was found that domination by any of these mechanisms over the other mechanisms during the material removal process depends on the impact conditions, such as angle of impact and the initial kinetic energy of the abrasive grain. The transition zone from nanocutting to nanoplowing is observed at angle of impact of near 60 deg, while the transition from the nanocutting and nanoplowing mechanisms to nanocracking mechanism is observed for initial abrasive kinetic energies of about 600–700 eV. In addition, occasional lip formation and material pile-up are observed in the impact zone along with amorphous phase transformation. A material removal mechanism map is constructed to illustrate the effects of the impacts conditions on the material removal mechanism. Confirmatory experimentation on silicon and borosilicate glass substrates showed that all the three nanoscale mechanisms are possible, and the nanoplowing is the most common mechanism. It was also found that the material removal rate (MRR) values are found to be highest when the material is removed through nanocracking mechanism and is found to be lowest when the material removal happens through nanocutting mechanism.

scholarly journals Analytical and Experimental Investigation on Cutting Force in Longitudinal-Torsional Coupled Rotary Ultrasonic Machining Zirconia Ceramics

2021 ◽  
Author(s):  
Fan Chen ◽  
Wenbo Bie ◽  
Yingli Chang ◽  
Bo Zhao ◽  
Xiaobo Wang ◽  
...  
Keyword(s):  
Cutting Force ◽  
Material Removal ◽  
Processing Parameters ◽  
Force Model ◽  
Ultrasonic Machining ◽  
Removal Mechanism ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanism ◽  
Zirconia Ceramics ◽  
The Impact

Abstract Ceramics and other hard-and-brittle materials are very effectively processed by longitudinal-torsional coupled rotary ultrasonic machining (LTC-RUM). However, the cutting force evolution and the effects of processing parameters on the material removal mechanism in LTC-RUM need to be clarified for machining optimization. This paper proposes a cutting force model of the LTC-RUM of zirconia ceramics via the brittle material removal mechanism. Firstly, the kinematic analysis of a single abrasive grain was performed, with further consideration of the material removal volume, the effective contact time, and the impact force per one ultrasonic vibration cycle. Then, the longitudinal-torsional coupled vibration of the core tool was analyzed from the standpoint of wave energy conversion. The analytical model was finalized and experimentally verified by LTC-RUM tests. The cutting force curves predicted via the proposed model were in good agreement with the experimental results. The results obtained are considered instrumental in predicting the effects of processing parameters on cutting force during LTC-RUM of ceramics and their further optimization.

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study

Microgrinding of Nanostructured Carbide Coatings: Ground Surface and Subsurface Damage Observations

2006 ◽  
Vol 304-305 ◽  
pp. 276-280 ◽  
Author(s):  
Y.H. Ren ◽  
Zhi Xiong Zhou ◽  
Zhao Hui Deng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Material Removal ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Carbide Coatings ◽  
Subsurface Layers ◽  
Scanning Electron

Surface microgrinding of the nanostructured WC/12Co coatings have been undertaken with diamond wheels under various conditions. Nondestructive and destructive approaches were utilized to assess damage in ground nanostructured coatings. Different surface and subsurface configurations were observed by scanning electron microscopy. This paper investigates the effects of microgrinding conditions on damage formation in the surface and subsurface layers of the ground nanostructured WC/12Co coatings. And the material-removal mechanism has been discussed.

The Research and Development on the Material Removal Mechanism of the Ultrasonic Cutting

2014 ◽  
Vol 1027 ◽  
pp. 40-43
Author(s):  
Yan Yan Lou ◽  
Yan Zhang ◽  
Ying Gao ◽  
Jia Chen Zhang ◽  
Yan Zhou Sun
Keyword(s):  
Material Removal ◽  
Development Trend ◽  
Ultrasonic Machining ◽  
Removal Mechanism ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanism ◽  
Material Removal Model ◽  
The Development Trend ◽  
Removal Model ◽  
Ultrasonic Cutting

Ultrasonic machining is an important part of modern processing technology which is adapt to all kinds of hard brittle materials processing. This paper reviews the latest progress of the material removal mechanism on one-dimensional ultrasonic machining, two-dimensional ultrasonic machining and rotary ultrasonic machining, and expounds the development trend of establishing the material removal model of the ultrasonic machining.

A Review of Material Removal Mechanism in Ultra-Precision Polishing of Optical Glass

2021 ◽  
Vol 48 (4) ◽  
pp. 0401014
Author(s):  
蒋小为 Jiang Xiaowei ◽  
龙兴武 Long Xingwu ◽  
谭中奇 Tan Zhongqi
Keyword(s):  
Material Removal ◽  
Optical Glass ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Ultra Precision
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