Thermal transfer ink sheet with supercooling wax layer for lusterless plain-paper printing

1990 ◽  
Author(s):  
Kenji Nomura ◽  
Kikuo Hayama
Keyword(s):  
2007 ◽  
Vol 546-549 ◽  
pp. 1581-1584 ◽  
Author(s):  
Jiu Peng Zhao ◽  
Deng Teng Ge ◽  
Sai Lei Zhang ◽  
Xi Long Wei

Silica aerogel/epoxy composite, a kind of efficient thermal insulation material, was prepared by doping silica aerogel of different sizes into epoxy resin through thermocuring process. The results of thermal experiments showed that silica aerogel/epoxy composite had a lower thermal conductivity (0.105W/(m·k) at 60 wt% silica aerogel) and higher serviceability temperature (Martens heat distortion temperature: 160°C at 20 wt% silica aerogel). In addition, the composite doping larger size (0.2-2mm) of silica aerogel particle had lower thermal conductivity and higher Martens heat distortion temperature. Based on the results of SEM and FT-IR, the thermal transfer model was established. Thermal transfer mechanism and the reasons of higher Martens heat distortion temperature have been discussed respectively.


2014 ◽  
Vol 70 (a1) ◽  
pp. C397-C397
Author(s):  
Guoyin Shen ◽  
Stanislav Sinogeikin ◽  
Jesse Smith

Phase transformation pathways are strongly influenced by the time dependence of the driving mechanism (compression, thermal transfer, strain, irradiation, etc). While thermal rate has been widely used for centuries for enhancing materials properties such as hardened steels or metallic glasses through rapid cooling, the application of compression rate is relatively new. Yet it drives rich new physics, novel chemistry, exceptional energy materials, and new routes of materials synthesis, and has become an important impetus in studying materials metastability, phase growth, and transition kinetics. In this talk, we will outline recently developed capabilities at HPCAT at the Advanced Photon Source for studying materials behavior under fast compression or decompression, including both single event loading or unloading and multiple, repetitive ramping events. A few recent studies will be highlighted. For example, a compression rate of 17 TPa per second has been reached in a piezo-driven diamond anvil cell; fast compression experiments significantly improve the precision in thermal equation of state determinations; the feasibility of controlled formation of metastable phases of Si and Ge has been demonstrated under controlled decompression rate; the phase transition kinetics of B1-B2 transitions in NaCl and KCl have been studied under various compression and decompression rates.


10.2341/05-26 ◽  
2006 ◽  
Vol 31 (2) ◽  
pp. 261-265 ◽  
Author(s):  
A. R. Yazici ◽  
A. Müftü ◽  
G. Kugel ◽  
R. D. Perry

Clinical Relevance The thickness of the residual dentin is a critical factor in the reducing thermal transfer to pulp, and this transfer varies with the curing unit used.


2018 ◽  
Vol 104 (12) ◽  
pp. 735-741
Author(s):  
Shohei Fujiwara ◽  
Eiji Abe ◽  
Nobuki Yukawa

2016 ◽  
Vol 138 (5) ◽  
Author(s):  
Sina Hamian ◽  
Andrew M. Gauffreau ◽  
Timothy Walsh ◽  
Jungchul Lee ◽  
Keunhan Park

This paper reports the frequency-dependent electrothermal behaviors of a freestanding doped-silicon heated microcantilever probe operating under periodic (ac) Joule heating. We conducted a frequency-domain finite-element analysis (FEA) and compared the steady periodic solution with 3ω experiment results. The computed thermal transfer function of the cantilever accurately predicts the ac electrothermal behaviors over a full spectrum of operational frequencies, which could not be accomplished with the 1D approximation. In addition, the thermal transfer functions of the cantilever in vacuum and in air were compared, through which the frequency-dependent heat transfer coefficient of the air was quantified. With the developed FEA model, design parameters of the cantilever (i.e., the size and the constriction width of the cantilever heater) and their effects on the ac electrothermal behaviors were carefully investigated. Although this work focused on doped-Si heated microcantilever probes, the developed FEA model can be applied for the ac electrothermal analysis of general microelectromechanical systems.


Author(s):  
David M. Bierman ◽  
Andrej Lenert ◽  
Evelyn N. Wang

Solar thermophotovoltaic (STPV) devices provide conversion of solar energy to electrical energy through the use of an intermediate absorber/emitter module, which converts the broad solar spectrum to a tailored spectrum that is emitted towards a photovoltaic cell [1]. While the use of an absorber/emitter device could potentially overcome the Shockley-Queisser limit of photovoltaic conversion [2], it also increases the number of heat loss mechanisms. One of the most prohibitive aspects of STPV conversion is the thermal transfer efficiency, which is a measure of how well solar energy is delivered to the emitter. Although reported thermophotovoltaic efficiencies (thermal to electric) have exceeded 10% [3], [4], previously measured STPV conversion efficiencies are below 1% [5], [6], [7]. In this work, we present the design and characterization of a nanostructured absorber for use in a planar STPV device with a high emitter-to-absorber area ratio. We used a process for spatially-selective growth of vertically aligned multi-walled carbon nanotube (MWCNT) forests on highly reflective, smooth tungsten (W) surfaces. We implemented these MWCNT/W absorbers in a TPV system with a one-dimensional photonic crystal emitter, which was spectrally paired with a low bandgap PV cell. A high fidelity, system-level model of the radiative transfer in the device was experimentally validated and used to optimize the absorber surface geometry. For an operating temperature of approximately 1200 K, we experimentally demonstrated a 100% increase in overall STPV efficiency using a 4 to 1 emitter-to-absorber area ratio (relative to a 1 to 1 area ratio), due to improved thermal transfer efficiency. By further increasing the solar concentration incident on the absorber surface, increased emitter-to-absorber area ratios will improve both thermal transfer and overall efficiencies for these planar devices.


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