High removal rate MRF[TM]

2021 ◽  
Author(s):  
William Messner ◽  
Christopher A. Hall
Keyword(s):  
Removal Rate ◽  
High Removal Rate

Derivation of Optimum Study Factors for Samples Contaminated with Cd Using Electric/Magnetic Field and ORP

2013 ◽  
Vol 813 ◽  
pp. 519-524
Author(s):  
Sang An Ha ◽  
Jei Pil Wang
Keyword(s):  
Magnetic Field ◽  
Heavy Metals ◽  
Removal Rate ◽  
Underground Water ◽  
Liquid Electrode ◽  
Oxidation Reduction ◽  
Oxidation Reduction Potential ◽  
Removal Of Heavy Metals ◽  
High Removal Rate ◽  
Membrane Treatment

A purpose of the present study is to derive optimum study factors for removal of heavy metals using combined alternating current electric/magnetic field and electric membranes for the area contaminated with heavy metals in soil or underground water. ORP (Oxidation Reduction Potential) analysis was conducted to determine an intensity of tendency for oxidation or reduction of the samples contaminated with heavy metals, and electrical membrane treatment was used with adjustment of concentrations and voltages of liquid electrode (Na2SO4) to derive a high removal rate. Removal constants were analyzed to be 0.0417, 0.119, 0.1594 when the voltages were 5V, 10V, 15V, respectively, and treatment efficiency was shown to increase as the liquid electrode concentration was increased. Keywords: heavy metals, electric/magnetic field, ORP, electrical membrane

Numerical Prediction of Contaminant Removal from Cavity in Horizontal Channel by Constrained Interpolated Profile Method

2014 ◽  
Vol 695 ◽  
pp. 384-388
Author(s):  
Nor Azwadi Che Sidik ◽  
A.S. Ahmad Sofianuddin ◽  
K.Y. Ahmat Rajab
Keyword(s):  
Reynolds Number ◽  
Aspect Ratio ◽  
Removal Rate ◽  
Contaminant Removal ◽  
Square Cavity ◽  
Profile Method ◽  
Aspect Ratios ◽  
Contaminants Removal ◽  
Parabolic Flow ◽  
High Removal Rate

In this paper, Constrained Interpolated Profile Method (CIP) was used to simulate contaminants removal from square cavity in channel flow. Predictions were conducted for the range of aspect ratios from 0.25 to 4.0. The inlet parabolic flow with various Reynolds number from 50 to 1000 was used for the whole presentation with the same properties of contaminants and fluid. The obtained results indicated that the percentage of removal increased at high aspect ratio of cavity and higher Reynolds number of flow but it shows more significant changes as increasing aspect ratio rather than increasing Reynolds number. High removal rate was found at the beginning of the removal process.

Preparation of Calcium Sulfate Anhydrate Whisker and a Primary Investigation of its Arsenic Removal Performance

2013 ◽  
Vol 690-693 ◽  
pp. 1013-1019
Author(s):  
Xiao Juan Chen ◽  
Liu Chun Yang ◽  
Jun Feng Zhang ◽  
Yan Huang
Keyword(s):  
Calcium Sulfate ◽  
Arsenic Removal ◽  
Removal Rate ◽  
Optical Microscope ◽  
Alkaline Condition ◽  
Crystal Water ◽  
Arsenic Uptake ◽  
Ft Ir ◽  
High Removal Rate ◽  
Calcium Sulfate Whisker

Calcium sulfate whisker (CSW) was prepared through the method of cooling recrystallization. In an attempt to develop its new application in environmental protection, we investigated the effect of calcination on the material properties and arsenic uptake performance of calcium sulfate whisker anhydrate (CSAW), which was obtained from CSW calcined at 600 °C for 2 h. Moreover, XRD, SEM, optical microscope, and FT-IR were used to characterize CSW samples. It was found that calcination played an important role in the whisker structure through changing the content of crystal water and the morphology. The CSAW material exhibited a high removal rate of As3+/As5+under strongly alkaline condition.

scholarly journals Effects of microhabitat on rodent-mediated seed removal of endangered Kmeria septentrionalis in the karst habitat

PeerJ ◽  
2020 ◽  
Vol 8 ◽  
pp. e10378
Author(s):  
Guohai Wang ◽  
Yang Pan ◽  
Guole Qin ◽  
Weining Tan ◽  
Changhu Lu
Keyword(s):  
Predation Risk ◽  
Rattus Norvegicus ◽  
Removal Rate ◽  
Soil Surface ◽  
Predation Rate ◽  
Seed Removal ◽  
Seed Type ◽  
Stone Surface ◽  
Broad Variety ◽  
High Removal Rate

Seed removal behaviors of rodents are largely influenced by microhabitat. Although the karst ecosystem is composed of a broad variety of microhabitats, we have no information on how they affect such behaviors. We investigated rodents’ seed removal behaviors in four karst microhabitats (stone cavern, stone groove, stone surface, and soil surface) using three types of Kmeria septentrionalis seeds: fresh, black (intact seeds with black aril that dehydrates and darkens), and exposed (clean seeds without the aril). We show that Rattus norvegicus, Leopoldamys edwardsi and Rattus flavipectus were the predominant seed predators. Even though all seed types experienced a high removal rate in all four microhabitats, but rodents preferentially removed seeds from the three stone microhabitats (stone caves: 69.71 ± 2.74%; stone surface: 60.53 ± 2.90%; stone groove: 56.94 ± 2.91%) compared to the soil surface (53.90 ± 2.92%). Seeds that had been altered by being exposed to the environment were more attractive to rodents than fresh seeds (76.25 ± 2.20% versus 36.18 ± 2.29%). The seed removal behavior of rodents was significantly affected by the microhabitat and seed type. Finally, seeds that had fallen on the soil surface microhabitat incurred a lower predation risk than seeds fallen on other microhabitats, which increased their probability to germinate. Our results indicate that the lower predation rate of seeds from the endangered K. septentrionalis dropped on the soil surface increases trees’ likelihood of survival.

Dicing of SiC Wafer by Atmospheric-Pressure Plasma Etching Process with Slit Mask for Plasma Confinement

2014 ◽  
Vol 778-780 ◽  
pp. 759-762 ◽  
Author(s):  
Yasuhisa Sano ◽  
Hiroaki Nishikawa ◽  
Yuu Okada ◽  
Kazuya Yamamura ◽  
Satoshi Matsuyama ◽  
...  
Keyword(s):  
Plasma Etching ◽  
Atmospheric Pressure ◽  
Removal Rate ◽  
Atmospheric Pressure Plasma ◽  
Etching Process ◽  
Plasma Confinement ◽  
Plasma Etching Process ◽  
Pressure Plasma ◽  
High Removal Rate ◽  
Sic Wafer

Silicon carbide (SiC) is a promising semiconductor material for high-temperature, high-frequency, high-power, and energy-saving applications. However, because of the hardness and chemical stability of SiC, few conventional machining methods can handle this material efficiently. A plasma chemical vaporization machining (PCVM) technique is an atmospheric-pressure plasma etching process. We previously proposed a novel style of PCVM dicing using slit apertures for plasma confinement, which in principle can achieve both a high removal rate and small kerf loss, and demonstration experiments were performed using a silicon wafer as a sample. In this research, some basic experiments were performed using 4H-SiC wafer as a sample, and a maximum removal rate of approximately 10 μm/min and a narrowest groove width of 25 μm were achieved. We also found that argon can be used for plasma generation instead of expensive helium gas.

scholarly journals Mechanism of the High Removal Rate of Cobalt in Conventional Cementation by Zinc Dust with Arsenic Oxide in the Presence of Cupturic Ions.

2000 ◽  
Vol 116 (9) ◽  
pp. 779-783 ◽  
Author(s):  
Takeshi OHGAI ◽  
Hisaaki FUKUSHIMA ◽  
Tetsuya AKIYAMA ◽  
Shinichi HEGURI
Keyword(s):  
Zinc Dust ◽  
Removal Rate ◽  
Arsenic Oxide ◽  
High Removal Rate

scholarly journals Mn/sepiolite as the heterogeneous ozonation catalysts applied to the advanced treatment of regenerated-papermaking wastewater

2016 ◽  
Vol 75 (5) ◽  
pp. 1025-1033 ◽  
Author(s):  
Zheng Cheng ◽  
Rendang Yang ◽  
Yang Wang
Keyword(s):  
Reaction Pathway ◽  
Removal Rate ◽  
Oxygen Demand ◽  
Catalytic Ozonation ◽  
Treated Wastewater ◽  
Precipitation Method ◽  
Advanced Treatment ◽  
Heterogeneous Catalytic ◽  
High Removal Rate ◽  
Papermaking Wastewater

Herein a Mn-deposited sepiolite catalyst was obtained through a facile co-precipitation method, and then used as the heterogeneous ozonation catalysts applied to the tertiary treatment of regenerated-papermaking wastewater. During the process, the as-prepared catalyst was endowed with higher Brunauer–Emmett–Teller specific surface area of 412.3 m2/g compared to 124.6 m2/g of the natural sepiolite. Hence, in the adsorption of methylene blue, the as-prepared catalyst was observed with a very high removal rate of 96.2% although a little lower than the modified sepiolite of 97.5% in 100 min. And for practical application, the catalyst was used for treating the effluent from regenerated-papermaking industry, via a heterogeneous catalytic ozonation process. Consequently, the highest color removal rate of 99.5%, and the highest chemical oxygen demand (COD) removal efficiency of 73.4% were achieved in 20 and 30 min, respectively. As a result, the treated wastewater was more biodegradable and less toxic; the biochemical oxygen demand (BOD5)/COD value could reach 0.41. Moreover, the catalyst showed superior stability at successive ozonation runs. The main possible reaction pathway is also presented. The results indicate that catalytic ozonation was proved to be effective when Mn/sepiolite was used as catalysts applied to the advanced treatment of regenerated-papermaking wastewater.

A Novel Tape and Diamond Process Developed for Polishing Hard Substrates

2015 ◽  
Vol 656-657 ◽  
pp. 416-421
Author(s):  
Rong Hwei Yeh ◽  
T.M. Chao ◽  
Cheng Kuo Lee ◽  
A.H. Tan
Keyword(s):  
Surface Roughness ◽  
Removal Rate ◽  
Lower Surface ◽  
Polished Surface ◽  
Closed Chamber ◽  
Glass Substrates ◽  
Nominal Size ◽  
Hard Glass ◽  
High Removal Rate ◽  
Diamond Abrasive

A nanoscale polish process with improved desired characteristics of low roughness and low scratch counts has been developed using a novel polish tape and diamond abrasive on hard glass substrates. For an improved polishing performance with high removal rate properties and preventing scratches, a novel tape was developed having a nanofiber level, densified surface and a flatter surface by slenderizing the fiber and dispersing ultrafine fiber using an innovative technique. Using this novel polishing tape with a fiber size of 200nm, one can produce a 17% lower surface roughness (Ra) (from 1.05A to 0.87A) and a reduced polished surface scratch count of 53 reduced to 18. The novel nanocluster diamond abrasive is synthesized from carbon atoms of explosives created by detonation in a closed chamber under an oxygen leaked atmosphere ambient. Several crystals are bonded together by layers of non-diamond carbon and other elements, forming aggregates with a nanocluster structure. Using this novel nanocluster diamond along with an ultra-fine diamond mixture with a nominal size of 15nm, one is able to produce an improvement of a 48% lower surface roughness Ra (from 0.87A to 0.45A) and a lower polishing surface scratch count reduced from 18 to 7. Overall, these results indicate that a smoother and a reduced scratch polished substrate results in a significant improvement in disk defects and related magnetic performances.

Understanding Selectivity on Germanium/SiO2 Chemical Mechanical Planarization Through Design of Experiments

2015 ◽  
Vol 1790 ◽  
pp. 19-24
Author(s):  
Ayse Karagoz ◽  
James Mal ◽  
G. Bahar Basim
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Surface Active Agent ◽  
Chemical Mechanical Planarization ◽  
Sodium Dodecyl ◽  
Active Agent ◽  
High Mobility ◽  
High Removal Rate ◽  
The Impact

ABSTRACTThe continuous trend of achieving more complex microelectronics with smaller nodes yet larger wafer sizes in microelectronics manufacturing lead to aggressive development requirements for chemical mechanical planarization (CMP) process. Particularly, beyond the 14 nm technology the development needs made it a must to introduce high mobility channel materials such as Ge. CMP is an enabler for integration of these new materials into future devices. In this study, we implemented a design of experiment (DOE) methodology in order to understand the optimized CMP slurry parameters such as optimal concentration of surface active agent (sodium dodecyl sulfate-SDS), concentration of abrasive particles and pH from the viewpoint of high removal rate and selectivity while maintaining a defect free surface finish. The responses examined were particle size distribution (slurry stability), zeta potential, material removal rate (MRR) and the surface defectivity as a function of the selected design variables. The impact of fumed silica particle loadings, oxidizer (H2O2) concentration, SDS surfactant concentration and pH were analyzed on Ge/silica selectivity through material removal rate (MRR) surface roughness and defectivity analyses.

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