Effect of Cold Isostatic Pressing on the Pore Size and Distribution in the High-Chromium High-Temperature Alloys Fabricated by Selective Laser Melting of Metallic Powders

2020 ◽  
Vol 2020 (11) ◽  
pp. 1283-1291
Author(s):  
E. Yu. Remshev ◽  
G. A. Vorob’eva ◽  
A. R. Avetisyan ◽  
P. V. Elfimov ◽  
G. O. Afim’in ◽  
...  
Keyword(s):  
High Temperature ◽  
Pore Size ◽  
Selective Laser Melting ◽  
Cold Isostatic Pressing ◽  
Laser Melting ◽  
High Chromium ◽  
Isostatic Pressing ◽  
Metallic Powders ◽  
High Temperature Alloys

Martensite decomposition during post-heat treatments and the aging response of near-α Ti–6Al–2Sn–4Zr–2Mo (Ti-6242) titanium alloy processed by selective laser melting (SLM)

2021 ◽  
pp. 2050018
Author(s):  
Haiyang Fan ◽  
Yahui Liu ◽  
Shoufeng Yang
Keyword(s):  
Titanium Alloy ◽  
High Temperature ◽  
Titanium Alloys ◽  
Selective Laser Melting ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Aging Treatment ◽  
Water Quenching ◽  
Laser Melting ◽  
Aging Response

Ti–6Al–2Sn–4Zr–2Mo (Ti-6242), a near-[Formula: see text] titanium alloy explicitly designed for high-temperature applications, consists of a martensitic structure after selective laser melting (SLM). However, martensite is thermally unstable and thus adverse to the long-term service at high temperatures. Hence, understanding martensite decomposition is a high priority for seeking post-heat treatment for SLMed Ti-6242. Besides, compared to the room-temperature titanium alloys like Ti–6Al–4V, aging treatment is indispensable to high-temperature near-[Formula: see text] titanium alloys so that their microstructures and mechanical properties are pre-stabilized before working at elevated temperatures. Therefore, the aging response of the material is another concern of this study. To elaborate the two concerns, SLMed Ti-6242 was first isothermally annealed at 650[Formula: see text]C and then water-quenched to room temperature, followed by standard aging at 595[Formula: see text]C. The microstructure analysis revealed a temperature-dependent martensite decomposition, which proceeded sluggishly at [Formula: see text]C despite a long duration but rapidly transformed into lamellar [Formula: see text] above the martensite transition zone (770[Formula: see text]C). As heating to [Formula: see text]C), it produced a coarse microstructure containing new martensites formed in water quenching. The subsequent mechanical testing indicated that SLM-built Ti-6242 is excellent in terms of both room- and high-temperature tensile properties, with around 1400 MPa (UTS)[Formula: see text]5% elongation and 1150 MPa (UTS)[Formula: see text]10% elongation, respectively. However, the combination of water quenching and aging embrittled the as-built material severely.

Selective laser melting for the preparation of an ultra-high temperature ceramic coating

2019 ◽  
Vol 45 (2) ◽  
pp. 2466-2473 ◽  
Author(s):  
Derek King ◽  
John Middendorf ◽  
Kathleen Cissel ◽  
Thomas Key ◽  
Carmen Carney
Keyword(s):  
High Temperature ◽  
Selective Laser Melting ◽  
Ceramic Coating ◽  
Laser Melting ◽  
Ultra High Temperature

scholarly journals Effect of Process Parameters and High-Temperature Preheating on Residual Stress and Relative Density of Ti6Al4V Processed by Selective Laser Melting

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 930 ◽  
Author(s):  
Martin Malý ◽  
Christian Höller ◽  
Mateusz Skalon ◽  
Benjamin Meier ◽  
Daniel Koutný ◽  
...  
Keyword(s):  
Residual Stress ◽  
High Temperature ◽  
Residual Stresses ◽  
Relative Density ◽  
Selective Laser Melting ◽  
Process Parameters ◽  
Stress Reduction ◽  
Laser Melting ◽  
Preheating Temperature ◽  
Laser Velocity

The aim of this study is to observe the effect of process parameters on residual stresses and relative density of Ti6Al4V samples produced by Selective Laser Melting. The investigated parameters were hatch laser power, hatch laser velocity, border laser velocity, high-temperature preheating and time delay. Residual stresses were evaluated by the bridge curvature method and relative density by the optical method. The effect of the observed process parameters was estimated by the design of experiment and surface response methods. It was found that for an effective residual stress reduction, the high preheating temperature was the most significant parameter. High preheating temperature also increased the relative density but caused changes in the chemical composition of Ti6Al4V unmelted powder. Chemical analysis proved that after one build job with high preheating temperature, oxygen and hydrogen content exceeded the ASTM B348 limits for Grade 5 titanium.

Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers

2016 ◽  
Vol 2016 (1) ◽  
pp. 000517-000522
Author(s):  
Aarief Syed-Khaja ◽  
Christopher Kaestle ◽  
Joerg Franke
Keyword(s):  
High Temperature ◽  
Selective Laser Melting ◽  
Pure Copper ◽  
Feasibility Studies ◽  
Influential Factors ◽  
Powder Materials ◽  
Laser Melting ◽  
Bronze Alloy ◽  
Ceramic Surfaces ◽  
Copper Powders

Abstract Additive manufacturing (AM) has the potential to lead significant changes in the present state-of-the-art production processes. This provides tool-free and direct manufacturing of complex geometries simultaneously integrating various functions into components. Though AM techniques are widely used in various sectors, the application into electronics production has been not yet explored. In electronics production, substrate development has high relevance due to their multi-functionality in giving the mechanical support and electrically connecting electronic components. This contribution introduces an innovative approach in the development of high-temperature substrates through additive layered manufacturing. The technique used in the investigations was selective laser melting (SLM) of copper based powder materials mainly bronze alloy and pure copper, for the generation of conductive patterns on ceramic surfaces. The process parameters for the SLM technique and the influential factors in the generation of conductive structures are discussed in detail.

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