scholarly journals A Tunable-Gain Transimpedance Amplifier for CMOS-MEMS Resonators Characterization

Micromachines ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 82
Author(s):  
Rafel Perelló-Roig ◽  
Jaume Verd ◽  
Sebastià Bota ◽  
Jaume Segura
Keyword(s):  
Cmos Technology ◽  
Open Loop ◽  
Transimpedance Amplifier ◽  
Mems Devices ◽  
Monolithically Integrated ◽  
Mems Resonators ◽  
Electromechanical Performance ◽  
Cmos Mems ◽  
Promising Solution ◽  
On Chip

CMOS-MEMS resonators have become a promising solution thanks to their miniaturization and on-chip integration capabilities. However, using a CMOS technology to fabricate microelectromechanical system (MEMS) devices limits the electromechanical performance otherwise achieved by specific technologies, requiring a challenging readout circuitry. This paper presents a transimpedance amplifier (TIA) fabricated using a commercial 0.35-µm CMOS technology specifically oriented to drive and sense monolithically integrated CMOS-MEMS resonators up to 50 MHz with a tunable transimpedance gain ranging from 112 dB to 121 dB. The output voltage noise is as low as 225 nV/Hz1/2—input-referred current noise of 192 fA/Hz1/2—at 10 MHz, and the power consumption is kept below 1-mW. In addition, the TIA amplifier exhibits an open-loop gain independent of the parasitic input capacitance—mostly associated with the MEMS layout—representing an advantage in MEMS testing compared to other alternatives such as Pierce oscillator schemes. The work presented includes the characterization of three types of MEMS resonators that have been fabricated and experimentally characterized both in open-loop and self-sustained configurations using the integrated TIA amplifier. The experimental characterization includes an accurate extraction of the electromechanical parameters for the three fabricated structures that enables an accurate MEMS-CMOS circuitry co-design.

scholarly journals Impact of Fluid Flow on CMOS-MEMS Resonators Oriented to Gas Sensing

Sensors ◽  
2020 ◽  
Vol 20 (17) ◽  
pp. 4663
Author(s):  
Rafel Perello-Roig ◽  
Jaume Verd ◽  
Sebastià Bota ◽  
Jaume Segura
Keyword(s):  
Fluid Flow ◽  
Gas Sensing ◽  
Low Cost ◽  
Cmos Technology ◽  
Monolithically Integrated ◽  
Impact Reduction ◽  
Mems Resonators ◽  
Cmos Mems ◽  
Outstanding Result ◽  
The Impact

Based on experimental data, this paper thoroughly investigates the impact of a gas fluid flow on the behavior of a MEMS resonator specifically oriented to gas sensing. It is demonstrated that the gas stream action itself modifies the device resonance frequency in a way that depends on the resonator clamp shape with a corresponding non-negligible impact on the gravimetric sensor resolution. Results indicate that such an effect must be accounted when designing MEMS resonators with potential applications in the detection of volatile organic compounds (VOCs). In addition, the impact of thermal perturbations was also investigated. Two types of four-anchored CMOS-MEMS plate resonators were designed and fabricated: one with straight anchors, while the other was sustained through folded flexure clamps. The mechanical structures were monolithically integrated together with an embedded readout amplifier to operate as a self-sustained fully integrated oscillator on a commercial CMOS technology, featuring low-cost batch production and easy integration. The folded flexure anchor resonator provided a flow impact reduction of 5× compared to the straight anchor resonator, while the temperature sensitivity was enhanced to −115 ppm/°C, an outstanding result compared to the −2403 ppm/°C measured for the straight anchored structure.

scholarly journals A Highly Linear Low-Noise Transimpedance Amplifier for Indoor Fiber-Wireless Remote Antenna Units

Electronics ◽  
2019 ◽  
Vol 8 (4) ◽  
pp. 437 ◽  
Author(s):  
Guillermo Royo ◽  
Antonio D. Martinez-Perez ◽  
Carlos Sanchez-Azqueta ◽  
Concepcion Aldea ◽  
Santiago Celma
Keyword(s):  
Cmos Technology ◽  
Antenna System ◽  
Open Loop ◽  
Low Noise ◽  
Total Power ◽  
Transimpedance Amplifier ◽  
Optimized Design ◽  
Error Vector Magnitude ◽  
Digitally Programmable ◽  
Total Power Consumption

This article presents an optimized design of a low-noise transimpedance amplifier (TIA) with high linearity for use in the downlink receiver of a remote antenna unit (RAU). The aim of this design is to be used in a cost-effective indoor distributed antenna system (DAS) for WLAN transmission using a mixed fiber-wireless system. The circuit topology consists of a fully differential shunt–shunt feedback TIA with digitally programmable transimpedance. An open-loop gain compensation technique is used to maintain stability and constant bandwidth (BW). The TIA has been fabricated in 65 nm CMOS technology with a 1.2 V voltage supply. The total power consumption of the TIA is 6 mW. A complete electrical and optical characterization with a 1550 nm PIN photodiode has been performed to demonstrate the reliable 54 Mb/s 802.11a WLAN transmission achieved with an error vector magnitude (EVM) lower than 3% for a 20 dB optical input range.

scholarly journals High Performance Seesaw Torsional CMOS-MEMS Relay Using Tungsten VIA Layer

Micromachines ◽  
2018 ◽  
Vol 9 (11) ◽  
pp. 579 ◽  
Author(s):  
Martín Riverola ◽  
Francesc Torres ◽  
Arantxa Uranga ◽  
Núria Barniol
Keyword(s):  
High Performance ◽  
Complementary Metal Oxide Semiconductor ◽  
Life Time ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Mechanical Contact ◽  
Contact Materials ◽  
Monolithically Integrated ◽  
Cmos Mems ◽  
Mechanical Logic

In this paper, a seesaw torsional relay monolithically integrated in a standard 0.35 μm complementary metal oxide semiconductor (CMOS) technology is presented. The seesaw relay is fabricated using the Back-End-Of-Line (BEOL) layers available, specifically using the tungsten VIA3 layer of a 0.35 μm CMOS technology. Three different contact materials are studied to discriminate which is the most adequate as a mechanical relay. The robustness of the relay is proved, and its main characteristics as a relay for the three different contact interfaces are provided. The seesaw relay is capable of a double hysteretic switching cycle, providing compactness for mechanical logic processing. The low contact resistance achieved with the TiN/W mechanical contact with high cycling life time is competitive in comparison with the state-of-the art.

scholarly journals Thermomechanical Noise Characterization in Fully Monolithic CMOS-MEMS Resonators

Sensors ◽  
2018 ◽  
Vol 18 (9) ◽  
pp. 3124 ◽  
Author(s):  
Rafel Perelló-Roig ◽  
Jaume Verd ◽  
Sebastià Bota ◽  
Jaume Segura
Keyword(s):  
Limit Of Detection ◽  
Low Noise ◽  
System Level ◽  
Fully Integrated ◽  
Monolithically Integrated ◽  
Noise Characteristics ◽  
Mems Resonator ◽  
Mems Resonators ◽  
Cmos Mems ◽  
Noise Characterization

We analyzed experimentally the noise characteristics of fully integrated CMOS-MEMS resonators to determine the overall thermomechanical noise and its impact on the limit of detection at the system level. Measurements from four MEMS resonator geometries designed for ultrasensitive detection operating between 2-MHz and 8-MHz monolithically integrated with a low-noise CMOS capacitive readout circuit were analyzed and used to determine the resolution achieved in terms of displacement and capacitance variation. The CMOS-MEMS system provides unprecedented detection resolution of 11 yF·Hz−1/2 equivalent to a minimum detectable displacement (MDD) of 13 fm·Hz−1/2, enabling noise characterization that is experimentally demonstrated by thermomechanical noise detection and compared to theoretical model values.

Phase Locked Loop Integrated System

2010 ◽  
Vol 164 ◽  
pp. 221-226 ◽  
Author(s):  
J. Charlamov ◽  
R. Navickas
Keyword(s):  
Noise Analysis ◽  
Phase Locked Loop ◽  
Integrated System ◽  
Voltage Controlled Oscillator ◽  
Mems Devices ◽  
Single Chip ◽  
Fabrication Errors ◽  
Electromechanical Performance ◽  
Cmos Mems ◽  
A Charge

CMOS-MEMS integration is an indispensable technique for self-calibration of electromechanical performance to make MEMS devices independent on environmental drift or fabrication errors. The goal of single-chip integration (the “holy grail” for the semiconductor timing industry) would be to include the resonator, the oscillator, the PLL and a temperature compensation circuit (TCC) on a single silicon substrate. The current structure of silicon MEMS-based devices utilizes a stacked-die arrangement, housed in a multi-chip package [1]. MEMS-based timing circuits often use PLLs, which can succumb to phase jitter and noise at higher timing frequencies. The architecture of a charge pump phase locked loop (CPPLL) is proposed in this work. It is discussed how its functional blocks influence the overall system performance. We have performed voltage-controlled oscillator (VCO) phase noise analysis and have determined the relationship between CPPLL and VCO phase noises and have discussed the requirements and results of the accomplished design.

Fabrication of Monolithic Integrated Bimaterial Resonant Uncooled IR Sensor

2013 ◽  
Vol 543 ◽  
pp. 176-179 ◽  
Author(s):  
D.Q. Zhao ◽  
Xia Zhang ◽  
P. Liu ◽  
F. Yang ◽  
C. Lin ◽  
...  
Keyword(s):  
Silicon Nitride ◽  
Hole Mobility ◽  
Micro Electro Mechanical System ◽  
Cmos Process ◽  
Standard Cmos Process ◽  
Ir Sensor ◽  
Cantilever Structure ◽  
Cmos Mems ◽  
On Chip ◽  
Micro Cantilever

In this work we studied the fabrication of a monolithic bimaterial micro-cantilever resonant IR sensor with on-chip drive circuits. The effects of high temperature process and stress induced performance degradation were investigated. The post-CMOS MEMS (micro electro mechanical system) fabrication process of this IR sensor is the focus of this paper, starting from theoretical analysis and simulation, and then moving to experimental verification. The capacitive cantilever structure was fabricated by surface micromachining method, and drive circuits were prepared by standard CMOS process. While the stress introduced by MEMS films, such as the tensile silicon nitride which works as a contact etch stopper layer for MOSFETs and releasing stop layer for the MEMS structure, increases the electron mobility of NMOS, PMOS hole mobility decreases. Moreover, the NMOS threshold voltage (Vth) shifts, and transconductance (Gm) degrades. An additional step of selective removing silicon nitride capping layer and polysilicon layer upon IC area were inserted into the standard CMOS process to lower the stress in MOSFET channel regions. Selective removing silicon nitride and polysilicon before annealing can void 77% Vth shift and 86% Gm loss.

scholarly journals 1.0 V-0.18 µm CMOS Tunable Low Pass Filters with 73 dB DR for On-Chip Sensing Acquisition Systems

Electronics ◽  
2021 ◽  
Vol 10 (5) ◽  
pp. 563
Author(s):  
Jorge Pérez-Bailón ◽  
Belén Calvo ◽  
Nicolás Medrano
Keyword(s):  
Power Consumption ◽  
Dynamic Range ◽  
Low Voltage ◽  
Cutoff Frequency ◽  
Cmos Technology ◽  
Active Area ◽  
Current Steering ◽  
Low Pass ◽  
On Chip ◽  
Low Pass Filters

This paper presents a new approach based on the use of a Current Steering (CS) technique for the design of fully integrated Gm–C Low Pass Filters (LPF) with sub-Hz to kHz tunable cut-off frequencies and an enhanced power-area-dynamic range trade-off. The proposed approach has been experimentally validated by two different first-order single-ended LPFs designed in a 0.18 µm CMOS technology powered by a 1.0 V single supply: a folded-OTA based LPF and a mirrored-OTA based LPF. The first one exhibits a constant power consumption of 180 nW at 100 nA bias current with an active area of 0.00135 mm2 and a tunable cutoff frequency that spans over 4 orders of magnitude (~100 mHz–152 Hz @ CL = 50 pF) preserving dynamic figures greater than 78 dB. The second one exhibits a power consumption of 1.75 µW at 500 nA with an active area of 0.0137 mm2 and a tunable cutoff frequency that spans over 5 orders of magnitude (~80 mHz–~1.2 kHz @ CL = 50 pF) preserving a dynamic range greater than 73 dB. Compared with previously reported filters, this proposal is a competitive solution while satisfying the low-voltage low-power on-chip constraints, becoming a preferable choice for general-purpose reconfigurable front-end sensor interfaces.

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