Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate

2020 ◽  
Vol 31 (09) ◽  
pp. 2050119
Author(s):  
Ahmet Mustafa Erer ◽  
Mukaddes Ökten Turacı
Keyword(s):  
Numerical Model ◽  
Numerical Computation ◽  
Solder Alloy ◽  
Empirical Model ◽  
Sessile Drop ◽  
Sessile Drop Method ◽  
Experimental Results ◽  
Cu Substrate ◽  
Free Solder ◽  
Alloy Systems

This paper was aimed to study of the wetting angle ([Formula: see text]) of Sn–Ag–Cu, Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])Bi and Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])In ([Formula: see text], 1 and 2 in wt.%) Pb-free solder alloy systems at various temperatures (250, 280 and 310∘C) on Cu substrate in Ar atmosphere. The new Sn–([Formula: see text])Ag–0.5Cu–xBi and Sn–([Formula: see text])Ag–0.5Cu[Formula: see text]([Formula: see text]) In systems, low Ag content quaternary Pb-free solder alloys, were produced by adding 0.5%, 1% and 2% Bi and In separately to the near-eutectic Sn-3[Formula: see text]wt.%Ag–0.5[Formula: see text]wt.%Cu (SAC305) alloy. The wetting angles of new alloys, Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%Bi (SAC-0.5Bi), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%Bi(SAC-1Bi), Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]2[Formula: see text]wt.%Bi(SAC-2Bi), Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%In (SAC-0.5In), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%In (SAC-1In) and Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt%.Cu[Formula: see text]2[Formula: see text]wt.%In (SAC-2In) were measured by sessile drop method. Experimental results showed that additions of Bi and In separately to SAC305 resulted in a continuous decrease in the [Formula: see text] up to 1[Formula: see text]wt.% above which the [Formula: see text] value was increased and it is appeared that a correlation among the [Formula: see text], alloys compositions and the test temperatures exists which recommended an empirical model to estimate the [Formula: see text] at a given Bi and In content and temperature for a given alloy systems. The numerical model estimates the [Formula: see text] understandably well with the present work.

Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems

2019 ◽  
Vol 32 (1) ◽  
pp. 19-23 ◽  
Author(s):  
Ahmet Mustafa Erer ◽  
Serkan Oguz
Keyword(s):  
Solder Alloy ◽  
Sessile Drop ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Cu Substrate ◽  
Wetting Properties ◽  
Free Solder ◽  
Drop Technique

Purpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35,34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.

scholarly journals Surface properties and wetting behavior of liquid Ag-Sb-Sn alloys

2012 ◽  
Vol 48 (3) ◽  
pp. 443-448 ◽  
Author(s):  
V. Sklyarchuk ◽  
Yu. Plevachuka ◽  
I. Kaban ◽  
R. Novakovic
Keyword(s):  
Experimental Data ◽  
Surface Tension ◽  
Surface Properties ◽  
Regular Solution ◽  
Wide Temperature Range ◽  
Thermodynamic Model ◽  
Sessile Drop ◽  
Sessile Drop Method ◽  
Experimental Results ◽  
Density Measurements

Surface tension and density measurements of liquid Ag-Sb-Sn alloys were carried out over a wide temperature range by using the sessile drop method. The surface tension experimental data were analyzed by the Butler thermodynamic model in the regular solution approximation. The wetting characteristics of these alloys on Cu and Ni substrates have been also determined. The new experimental results were compared with the calculated values as well as with data available in the literature.

Wettability of Carbon Nanotubes with Molten Sn-Ag-Cu Solder Alloy

2013 ◽  
Vol 372 ◽  
pp. 136-142 ◽  
Author(s):  
Suchart Chantaramanee ◽  
Sirikul Wisutmethangoon ◽  
Lek Sikong ◽  
Thawatchai Plookphol
Keyword(s):  
Solder Alloy ◽  
Sessile Drop ◽  
Wetting Angle ◽  
Lead Free Solder ◽  
Sessile Drop Technique ◽  
Single Walled Carbon Nanotube ◽  
Plating Method ◽  
Free Solder ◽  
Increasing Temperature ◽  
Drop Technique

The purpose of this work was to study the wettability of single-walled carbon nanotube (SWCNTs) and molten 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloy. The SWCNTs was coated with silver (Ag) by using an electroless plating method in order to enhance its wettability. The wetting behavior of molten SAC305 alloy on three different substrates, alumina, un-coated SWCNTs and Ag-coated SWCNTs was investigated by employing a modified sessile drop technique. The wetting angle between the molten SAC305 and the three substrates was measured at temperature range of 250-550 °C. The average wetting angles between the molten SAC305 and the alumina, the un-coated SWCNTs and the Ag-coated SWCNTs substrates were 130.7±1.3°, 128.4±4.2° and 120.1±3.5°, respectively. The wettabilty of the SWCNTs was improved by coating it with silver. The wetting angle of the Ag-coated SWCNTs was decreased approx. 9° compared to that of the un-coated. Increasing temperature has slightly affected on the wettability of SWCNTs and the molten SAC305.

Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu Substrate

2015 ◽  
Vol 815 ◽  
pp. 103-108 ◽  
Author(s):  
Xue Chao Zhang ◽  
Jing Wei Cheng ◽  
Bing Zheng ◽  
Xiu Chen Zhao ◽  
Ying Liu ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Alloy ◽  
Nickel Nanoparticles ◽  
Copper Substrate ◽  
Lead Free Solder ◽  
Ni Nanoparticles ◽  
Imcs Layer ◽  
Cu Substrate ◽  
Free Solder ◽  
Pure Sn

In the present study, the effect of addition of Ni nanoparticles on the growth of the intermetallic compound (IMC) layer between low-silver lead-free solder and Cu substrate was investigated. Ni nanoparticles were synthesized and smelted with pure Sn, Ag to prepare Sn-1.0Ag-xNi (x=0, 0.05, 0.1, 0.2) solder alloy. Sn-1.0Ag-xNi was soldered on a copper substrate, and then the solder/Cu couples were isothermally aged at 423K for 360h.The Cross-section images of IMCs layer were obtained to observe the morphology of IMC and to measure the thickness of Cu6Sn5and Cu3Sn layers respectively. The results show that, during aging, addition of Ni can remarkably improve the morphology of IMC, level the scalloped IMC, facilitate the growth of the total interfacial IMCs and inhibit the growth of Cu3Sn. Moreover, the rate change of thickness of the Cu3Sn reduced obviously with the increase of Ni nanoparticles. Comprehensive analysis shows that the addition of Ni promotes the nucleation and growth of Cu6Sn5. The thermodynamics calculation on the solder alloy was identical with the experiment result.

Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu

2011 ◽  
Vol 233-235 ◽  
pp. 2323-2327
Author(s):  
Hui Zhen Huang ◽  
Xiu Qin Wei ◽  
Lang Zhou
Keyword(s):  
Activation Energy ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Growth Kinetics ◽  
Layer Growth ◽  
Experimental Results ◽  
Cu Substrate ◽  
Diffusion Mechanisms ◽  
Kinetics Of

The morphology and growth of the intermetallic compound (IMC) formed between liquid Sn-9Zn eutectic solder alloy and Cu at 220-260°C was investigated. Experimental results showed that γ-Cu5Zn8 was present at the Sn-9Zn/Cu interface as the reaction product. The IMC layer growth follows the parabolic-growth law, which indicates that the growth of the IMC is controlled by the diffusion mechanisms. The activation energy of γ-Cu5Zn8 layer growth for liquid Sn-9Zn reacting with Cu substrate is determined as 50.5 KJ/mol.

scholarly journals STUDYING ON FAILURE MECHANISM OF 2D GRANULAR COLUMNS: NUMERICAL RESULTS

2020 ◽  
Vol 57 (6A) ◽  
pp. 88
Author(s):  
Cuong Tien NGUYEN
Keyword(s):  
Numerical Model ◽  
Numerical Computation ◽  
Failure Mechanism ◽  
Numerical Experiments ◽  
Physical Experiment ◽  
Numerical Results ◽  
Experimental Results ◽  
Computation Model ◽  
Granular Column

The failure mechanism of granular columns and the characteristics of this failure flows have been intersted in researching in recent years. In particular, the experiments in failure mechanism and failure flow of 2D granular column are not often 2D standard. Therefore, Cuong T. Nguyen et al. (2015) conducted research this problem based on 2D standard in the laboratory and developed a numerical computation model using SPH (Smooth Particles Hydrodynamics) method (Cuong T. Nguyen et al., 2017). This model has proven the reliability by verification of calculation and experimental results. In this paper, the developed numerical model is used to perform a series of numerical experiments that some are difficult or impossible to obtain accurate results by physical experiment model to re-examine the previously identified characteristics and find out the rules more general of this failure flow.

scholarly journals Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces

2017 ◽  
Vol 2017 ◽  
pp. 1-8 ◽  
Author(s):  
Janusz Pstruś ◽  
Tomasz Gancarz ◽  
Przemyslaw Fima
Keyword(s):  
Sessile Drop ◽  
Intermetallic Phases ◽  
Sessile Drop Method ◽  
Liquid Solder ◽  
Reflow Time ◽  
Eutectic Solder ◽  
Cu Substrate ◽  
Wetting Time ◽  
Activation Energy Of Diffusion ◽  
Over Time

The wettability of copper substrates by Sn-Zn eutectic solder alloy doped with 0, 0.5, 1, and 1.5 at.% of indium was studied using the sessile drop method, with flux, in air, at 250°C and reflow time of 3, 8, 15, 30, and 60 min. Wetting tests were performed at 230, 250, 280, 320, and 370°C for an alloy containing 1.5 at.% of indium, in order to determine activation energy of diffusion. Solidified solder/substrate couples were studied using scanning electron microscopy (SEM), the intermetallic phases from Cu-Zn system which formed at the solder/substrate interface were identified, and their growth kinetics was investigated. The ε-CuZn4 was formed first, as a product of the reaction between liquid solder and the Cu substrate, whereas γ-Cu5Zn8 was formed as a product of the reaction between ε-CuZn4 and the Cu substrate. With increasing wetting time, the thickness of ε-CuZn4 increases, while the thickness of ε-CuZn4 does not change over time for indium-doped solders and gradually disappears over time for Sn-Zn eutectic solder.

scholarly journals STUDYING ON FAILURE MECHANISM OF 2D GRANULAR COLUMNS: NUMERICAL RESULTS

2020 ◽  
Vol 57 (6A) ◽  
pp. 88
Author(s):  
Cuong Tien NGUYEN
Keyword(s):  
Numerical Model ◽  
Numerical Computation ◽  
Failure Mechanism ◽  
Numerical Experiments ◽  
Physical Experiment ◽  
Numerical Results ◽  
Experimental Results ◽  
Computation Model ◽  
Granular Column

The failure mechanism of granular columns and the characteristics of this failure flows have been intersted in researching in recent years. In particular, the experiments in failure mechanism and failure flow of 2D granular column are not often 2D standard. Therefore, Cuong T. Nguyen et al. (2015) conducted research this problem based on 2D standard in the laboratory and developed a numerical computation model using SPH (Smooth Particles Hydrodynamics) method (Cuong T. Nguyen et al., 2017). This model has proven the reliability by verification of calculation and experimental results. In this paper, the developed numerical model is used to perform a series of numerical experiments that some are difficult or impossible to obtain accurate results by physical experiment model to re-examine the previously identified characteristics and find out the rules more general of this failure flow.

Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates

2012 ◽  
Vol 710 ◽  
pp. 569-574 ◽  
Author(s):  
Satyanarayan ◽  
K.N. Prabhu
Keyword(s):  
Solder Alloy ◽  
Surface Texture ◽  
Copper Substrate ◽  
Dynamic Contact Angle ◽  
Dynamic Contact ◽  
Contact Angles ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Free Solder

In the present work, the effect of surface texture on wetting characteristics of lead-free solder Sn-0.7Cu on copper substrates have been investigated at 298°C. The wetting tests were carried out using FTA 200 (First Ten Angstrom) dynamic contact angle analyzer. The surface texture of copper substrate significantly affected the wetting properties of Sn-0.7Cu solder alloy. Contact angles of about 30° were obtained on Cu substrate having smooth surface texture (Ra = 0.0155µm). On other hand contact angles on rough copper surface texture (Ra = 1.1194µm) were reduced to 20°. The contact angles decreased with increasing surface texture of Cu substrate. For rough Cu substrate, it seems that the solder atoms dissolve into the substrate in the time period of 200-600s.

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