scholarly journals Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces

2017 ◽  
Vol 2017 ◽  
pp. 1-8 ◽  
Author(s):  
Janusz Pstruś ◽  
Tomasz Gancarz ◽  
Przemyslaw Fima
Keyword(s):  
Sessile Drop ◽  
Intermetallic Phases ◽  
Sessile Drop Method ◽  
Liquid Solder ◽  
Reflow Time ◽  
Eutectic Solder ◽  
Cu Substrate ◽  
Wetting Time ◽  
Activation Energy Of Diffusion ◽  
Over Time

The wettability of copper substrates by Sn-Zn eutectic solder alloy doped with 0, 0.5, 1, and 1.5 at.% of indium was studied using the sessile drop method, with flux, in air, at 250°C and reflow time of 3, 8, 15, 30, and 60 min. Wetting tests were performed at 230, 250, 280, 320, and 370°C for an alloy containing 1.5 at.% of indium, in order to determine activation energy of diffusion. Solidified solder/substrate couples were studied using scanning electron microscopy (SEM), the intermetallic phases from Cu-Zn system which formed at the solder/substrate interface were identified, and their growth kinetics was investigated. The ε-CuZn4 was formed first, as a product of the reaction between liquid solder and the Cu substrate, whereas γ-Cu5Zn8 was formed as a product of the reaction between ε-CuZn4 and the Cu substrate. With increasing wetting time, the thickness of ε-CuZn4 increases, while the thickness of ε-CuZn4 does not change over time for indium-doped solders and gradually disappears over time for Sn-Zn eutectic solder.

Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate

2020 ◽  
Vol 31 (09) ◽  
pp. 2050119
Author(s):  
Ahmet Mustafa Erer ◽  
Mukaddes Ökten Turacı
Keyword(s):  
Numerical Model ◽  
Numerical Computation ◽  
Solder Alloy ◽  
Empirical Model ◽  
Sessile Drop ◽  
Sessile Drop Method ◽  
Experimental Results ◽  
Cu Substrate ◽  
Free Solder ◽  
Alloy Systems

This paper was aimed to study of the wetting angle ([Formula: see text]) of Sn–Ag–Cu, Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])Bi and Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])In ([Formula: see text], 1 and 2 in wt.%) Pb-free solder alloy systems at various temperatures (250, 280 and 310∘C) on Cu substrate in Ar atmosphere. The new Sn–([Formula: see text])Ag–0.5Cu–xBi and Sn–([Formula: see text])Ag–0.5Cu[Formula: see text]([Formula: see text]) In systems, low Ag content quaternary Pb-free solder alloys, were produced by adding 0.5%, 1% and 2% Bi and In separately to the near-eutectic Sn-3[Formula: see text]wt.%Ag–0.5[Formula: see text]wt.%Cu (SAC305) alloy. The wetting angles of new alloys, Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%Bi (SAC-0.5Bi), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%Bi(SAC-1Bi), Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]2[Formula: see text]wt.%Bi(SAC-2Bi), Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%In (SAC-0.5In), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%In (SAC-1In) and Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt%.Cu[Formula: see text]2[Formula: see text]wt.%In (SAC-2In) were measured by sessile drop method. Experimental results showed that additions of Bi and In separately to SAC305 resulted in a continuous decrease in the [Formula: see text] up to 1[Formula: see text]wt.% above which the [Formula: see text] value was increased and it is appeared that a correlation among the [Formula: see text], alloys compositions and the test temperatures exists which recommended an empirical model to estimate the [Formula: see text] at a given Bi and In content and temperature for a given alloy systems. The numerical model estimates the [Formula: see text] understandably well with the present work.

A Sessile Drop Method for Facile and Robust Spheroid Cultures

2021 ◽  
pp. 2100972
Author(s):  
Bangyong Sun ◽  
Yi Zhao ◽  
Qiang Zhao ◽  
Gang Li
Keyword(s):  
Sessile Drop ◽  
Sessile Drop Method ◽  
Drop Method

Investigation of the Wetting Process of Glass Fiber with Oligophenylene Sulfide Sulfone

2021 ◽  
Vol 899 ◽  
pp. 326-331
Author(s):  
Zhanna I. Kurdanova ◽  
Kamila T. Shakhmurzova ◽  
V.A. Guchinov ◽  
Ilya Kobyhno ◽  
Andrey Bezborodov
Keyword(s):  
Thin Film ◽  
Contact Angle ◽  
Glass Fiber ◽  
Carbon Fibers ◽  
Fiber Surface ◽  
Reinforcing Fillers ◽  
Study Results ◽  
Wetting Time ◽  
Wetting Process ◽  
Over Time

The wettability of reinforcing fillers such as glass and carbon fibers is a significant factor influencing the mechanical properties of the composite. This study focuses on the effect of finishing glass fiber surfaces with different concentrations of oligophenylene sulfide sulfone solution on fiber wettability, which is determined by contact angle and wetting time. The Adam-Schütte method was chosen as a method for determining the contact angle. According to the study results a 1.5% solution of oligophenylene sulfide sulfone in N, N'-dimethylacetamide gives a contact angle of 45°, forming over time a thin film on the fiber surface, which indicates a sufficiently high sizing ability.

scholarly journals Wettability and Infiltration of Liquid Silicon on Graphite Substrates

Metals ◽  
2019 ◽  
Vol 9 (3) ◽  
pp. 300 ◽  
Author(s):  
Almudena Casado ◽  
Jose Torralba ◽  
Srdjan Milenkovic
Keyword(s):  
Sessile Drop ◽  
Triple Line ◽  
Passive Layer ◽  
Sessile Drop Method ◽  
Purification Process ◽  
Key Factors ◽  
Vacuum Refining ◽  
New Methods ◽  
Solar Silicon ◽  
Infiltration Behavior

The energy crisis has stimulated a rapid growth of developments in the photovoltaic industry in recent years. To reduce the high cost and the toxicity of classical metallurgical routes, new methods, such as vacuum refining of silicon, have been developed. Moreover, at the industry level, parameters such as the porosity in crucibles and dies are not controlled, so wettability, infiltration, and reaction between silicon and graphite are the key factors in the purification process. In this work, the behavior of several refractory substrates against melted silicon was studied by the classic sessile drop method. The most important phenomena, i.e., wettability and infiltration, were compared with the properties of the substrates. According to the results, for the carbonaceous materials, the reaction of triple line silicon-graphite manages these phenomena, whereas for alumina, a passive layer is formed due to the presence of oxygen, which is subsequently eliminated by the chemical reactions, delaying the process. Regarding the contact angle and infiltration behavior, alumina showed the best results, but due to its reactivity, it contaminates Si, so that this material is not recommended for solar silicon application. However, composite 2 is compatible with the application, as it shows good results in comparison with the other materials.

Use of the Sessile Drop Method to Understand the Behaviour of Self Healing Ceramic Matrix Composite

2008 ◽  
Vol 595-598 ◽  
pp. 1173-1180
Author(s):  
Sébastien Wery ◽  
Francis Teyssandier
Keyword(s):  
Glass Ceramic ◽  
Sessile Drop ◽  
Ceramic Matrix Composite ◽  
Ceramic Matrix ◽  
Sessile Drop Method ◽  
Self Healing ◽  
Infiltration Process ◽  
Drop Method ◽  
Sic Composites ◽  
Sealing Glass

Surface and interfacial properties of borosilicate glass/ceramic systems have been investigated using the sessile drop method. The purpose is to compare and understand the reactivity of the sealing glass in C / SiC and SiC / SiC composites. A hot wall reactor has been designed to measure the variation of the contact angle and the spreading kinetic according to the temperature (500 to 1100°C) and the atmosphere (Ar, Ar + O2 and Ar + H2O). Chemical and morphological analyses underline (i) the strong reactivity between the liquid and the ceramic, (ii) the influence of the infiltration process and (iii) the strong influence of the oxidizing agent on the wetting behaviour of the glass/ceramic systems.

Reliability and Characterization of Micro-Packages in a Wafer Level Au-Si Eutectic Vacuum Bonding Process

2005 ◽  
Author(s):  
Jay S. Mitchell ◽  
Gholamhassan R. Lahiji ◽  
Khalil Najafi
Keyword(s):  
High Sensitivity ◽  
Pressure Change ◽  
Bonding Process ◽  
Wafer Level ◽  
Eutectic Solder ◽  
Packaging Process ◽  
Primary Mechanism ◽  
Airtight Seal ◽  
Over Time

A Au-Si eutectic vacuum packaging process was evaluated using high sensitivity poly-Si Pirani vacuum sensors. Encapsulation of devices was achieved by bonding a silicon cap wafer to a device wafer using a Au-Si eutectic solder at above 390°C in a vacuum bonder. The Au-Si eutectic solder encircled the devices, providing an airtight seal. The Pirani gauges were encapsulated and tested over a period of several months in order to determine base pressures and leak/outgassing rates of the micro-cavities. Packaged devices without getters showed initial pressures from 2 to 12 Torr with initial leak/outgassing rates of −0.073 to 80 Torr/year. Using getters, pressures as low as 5 mTorr have been achieved with leak/outgassing rates of <10 mTorr/year. Trends in pressure over time seem to indicate outgassing (desorption of atoms from inside of the microcavity) as the primary mechanism for pressure change over time.

Synthesis of Porous Heat-Insulating Material from Industrial Waste

2018 ◽  
Vol 284 ◽  
pp. 82-89
Author(s):  
Liudmila Shtirc ◽  
Svetlana G. Vlasova ◽  
K. Zemlyanoi
Keyword(s):  
Surface Tension ◽  
Industrial Waste ◽  
Sessile Drop ◽  
Foam Glass ◽  
Temperature Drop ◽  
Sessile Drop Method ◽  
Insulating Material ◽  
Stable Temperature ◽  
Crystallization Ability ◽  
Glass Compositions

We chose two glass compositions suitable for the synthesis of foam glass. The influence of additive at the amorphous silica charge in the amount of 20% and 100%, a by-product in the leaching of serpentinite, was studied. By the method of stable temperature drop, the crystallization ability of the welded glass compositions was studied. The surface tension was measured by the sessile drop method.

Wettability Study of Red Ceramic and Glaze from Dimension Stone Waste

2017 ◽  
Vol 899 ◽  
pp. 289-294
Author(s):  
Maria Vitória Machado Rosetti ◽  
R.A. Carvalho ◽  
S.P. Taguchi ◽  
L.A. Borges
Keyword(s):  
Contact Angle ◽  
Melting Point ◽  
Optical Microscopy ◽  
Sessile Drop ◽  
Longitudinal Section ◽  
Sessile Drop Method ◽  
Ceramic Plate ◽  
Dimension Stone ◽  
Drop Method ◽  
Stone Industry

The dimension stone industry produces large amount of residue. An alternative to reduce this environmental liability is to apply as glaze in coating ceramic. This research is about the wettability between glaze and red ceramic, applying the sessile drop method. The waste and additives were mixed, pressed, and put over red ceramic plate previously sintered. The system was heated until the melting point of the glaze and the contact angle decreasing was measured in function of the temperature, and in a function of the time at 750 °C and 800 °C. The minimum contact angle value was near 6 ° at 994 °C in the testing changing the temperature, and presents 19 ° and 10 °, respectively, at 750 °C and 800 °C, when the time was varied. The longitudinal section of the samples was analyzed using optical microscopy, showing physical wettability in all testing. This glaze presents good wettability on red ceramic with potential as coating ceramic.

scholarly journals Influence of Experimental Variables on the Measure of Contact Angle in Metals Using the Sessile Drop Method

2015 ◽  
Vol 8 ◽  
pp. 742-751 ◽  
Author(s):  
Jonathan M. Schuster ◽  
Carlos E. Schvezov ◽  
Mario R. Rosenberger
Keyword(s):  
Contact Angle ◽  
Sessile Drop ◽  
Sessile Drop Method ◽  
Drop Method
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